JP4451298B2 - Icカードモジュール体 - Google Patents
Icカードモジュール体 Download PDFInfo
- Publication number
- JP4451298B2 JP4451298B2 JP2004368041A JP2004368041A JP4451298B2 JP 4451298 B2 JP4451298 B2 JP 4451298B2 JP 2004368041 A JP2004368041 A JP 2004368041A JP 2004368041 A JP2004368041 A JP 2004368041A JP 4451298 B2 JP4451298 B2 JP 4451298B2
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- processing material
- chip
- metal
- die pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
加工用素材111としては、通常、厚さ0.1mm程度の帯状のCu材あるいは42含金(42%Ni−Fe合金)材を用い、製版処理により、その両面に耐エッチング性のレジストパターンを形成した後、所定のエッチング液を用い、両面からスプレーエッチングを行い、メタルサブストレート部材をエッチング形成する。
111 加工用素材
120 メタルサブストレート
121 ダイパッド
122A、122B アンテナ端子
123A、123B 内部端子
124 貫通孔
125 貫通孔部
130 ICチップ
135 ボンディングワイヤ
140 封止用樹脂
220 メタルサブストレート
221 ダイパッド
222A、222B、222C、222D アンテナ端子
223A、223B、223C、223D 内部端子
225 貫通孔部
230 ICチップ
235 ボンディングワイヤ
240 封止用樹脂
Claims (2)
- 長手方向に延びる帯状の加工用素材をエッチングすることにより長手方向に連続して形成された多数のメタル基材を備え、各メタル基材はICチップ搭載用のダイパッドと、ダイパッドを含む樹脂封止領域と、ダイパッドおよび樹脂封止領域の外側であって長手方向に沿う両側に各々突設された少なくとも一対のアンテナ端子とを有し、一のメタル基材のアンテナ端子と、このメタル基材の長手方向に隣接するメタル基材のアンテナ端子は、加工用素材の幅方向の共通の領域内に入っているメタル基材装置と、
各メタル基材のダイパッド上に搭載されたICチップと、
ICチップとメタル基材の所定部分とをワイヤボンディングにより接続するワイヤと、 各メタル基材の樹脂封止領域に、ICチップとワイヤを覆って設けられた封止樹脂とを備え、
加工用素材上に、封止樹脂に連結するとともに幅方向に延びるモールドゲート部が設けられ、
加工用素材の各メタル基材の一対のアンテナ端子の近傍に、各アンテナ端子を加工用素材の他の部分から絶縁する開口が設けられていることを特徴とするICカードモジュール体。 - メタル基材は加工用素材の幅方向に多列に配置され、加工用素材上に各メタル基材の封止樹脂同志を連結するとともに幅方向に延びるモールドスルーゲート部が設けられていることを特徴とする請求項1記載のICカードモジュール体。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004368041A JP4451298B2 (ja) | 2004-12-20 | 2004-12-20 | Icカードモジュール体 |
US11/086,238 US7271471B2 (en) | 2003-06-17 | 2005-03-23 | Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus |
KR1020050124686A KR101110968B1 (ko) | 2004-12-20 | 2005-12-16 | 메탈기재장치, 아이씨카드모듈 제조방법 및아이씨카드모듈체 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004368041A JP4451298B2 (ja) | 2004-12-20 | 2004-12-20 | Icカードモジュール体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006179512A JP2006179512A (ja) | 2006-07-06 |
JP4451298B2 true JP4451298B2 (ja) | 2010-04-14 |
Family
ID=36733360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004368041A Expired - Fee Related JP4451298B2 (ja) | 2003-06-17 | 2004-12-20 | Icカードモジュール体 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4451298B2 (ja) |
KR (1) | KR101110968B1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7847380B2 (en) * | 2007-09-20 | 2010-12-07 | Samsung Electronics Co., Ltd. | Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card |
KR101066642B1 (ko) * | 2009-08-31 | 2011-09-22 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
DE102010005771B4 (de) * | 2010-01-25 | 2012-12-13 | Heraeus Materials Technology Gmbh & Co. Kg | Modulares Metallband, Verfahren zur seiner Herstellung und Bauteil mit verbesserter Ebenheit |
KR101426438B1 (ko) * | 2013-03-14 | 2014-08-06 | (주)바이오스마트 | 금속 카드의 cob 타입 칩 패키지 장착 방법 및 이를 이용하여 제작된 금속 카드 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62150868A (ja) * | 1985-12-25 | 1987-07-04 | Hitachi Micro Comput Eng Ltd | 半導体装置用リ−ドフレ−ムとそれを使用する樹脂封止方法 |
JPH01302757A (ja) * | 1988-05-30 | 1989-12-06 | Ibiden Co Ltd | 基板集合シート |
JPH05102377A (ja) * | 1991-10-04 | 1993-04-23 | Sony Corp | 半導体装置用リードフレーム |
JP2000174176A (ja) * | 1998-12-01 | 2000-06-23 | Tokin Corp | Icモジュール用のリードフレーム、及びそれを用いたicモジュール、並びにicカード |
JP3679285B2 (ja) * | 1999-11-12 | 2005-08-03 | 株式会社ケンウッド | シールドケース |
JP3895570B2 (ja) * | 2000-12-28 | 2007-03-22 | 株式会社ルネサステクノロジ | 半導体装置 |
JP4121335B2 (ja) * | 2002-08-28 | 2008-07-23 | 三洋電機株式会社 | リードフレームおよびそれを用いた半導体装置の製造方法 |
JP2004266109A (ja) * | 2003-03-03 | 2004-09-24 | Dainippon Printing Co Ltd | Icカード用回路基板及びicモジュールとその製造方法 |
JP4357885B2 (ja) * | 2003-06-17 | 2009-11-04 | 大日本印刷株式会社 | Icカードモジュール用のメタルサブストレート部材とicカードモジュールの作製方法 |
-
2004
- 2004-12-20 JP JP2004368041A patent/JP4451298B2/ja not_active Expired - Fee Related
-
2005
- 2005-12-16 KR KR1020050124686A patent/KR101110968B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20060070440A (ko) | 2006-06-23 |
KR101110968B1 (ko) | 2012-03-13 |
JP2006179512A (ja) | 2006-07-06 |
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