JP4444995B2 - 基板配線用導電性組成物、回路基板及び電子デバイス - Google Patents

基板配線用導電性組成物、回路基板及び電子デバイス Download PDF

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Publication number
JP4444995B2
JP4444995B2 JP2007209696A JP2007209696A JP4444995B2 JP 4444995 B2 JP4444995 B2 JP 4444995B2 JP 2007209696 A JP2007209696 A JP 2007209696A JP 2007209696 A JP2007209696 A JP 2007209696A JP 4444995 B2 JP4444995 B2 JP 4444995B2
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Japan
Prior art keywords
circuit board
circuit
electrode
circuit pattern
conductive composition
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Expired - Fee Related
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JP2007209696A
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Japanese (ja)
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JP2009044065A (ja
JP2009044065A5 (enExample
Inventor
重信 関根
由莉奈 関根
良治 桑名
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有限会社ナプラ
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Priority to JP2007209696A priority Critical patent/JP4444995B2/ja
Priority to US12/180,831 priority patent/US7910837B2/en
Publication of JP2009044065A publication Critical patent/JP2009044065A/ja
Publication of JP2009044065A5 publication Critical patent/JP2009044065A5/ja
Application granted granted Critical
Publication of JP4444995B2 publication Critical patent/JP4444995B2/ja
Priority to US13/017,544 priority patent/US8217280B2/en
Priority to US13/017,590 priority patent/US8609999B2/en
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2007209696A 2007-08-10 2007-08-10 基板配線用導電性組成物、回路基板及び電子デバイス Expired - Fee Related JP4444995B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007209696A JP4444995B2 (ja) 2007-08-10 2007-08-10 基板配線用導電性組成物、回路基板及び電子デバイス
US12/180,831 US7910837B2 (en) 2007-08-10 2008-07-28 Circuit board, electronic device and method for manufacturing the same
US13/017,544 US8217280B2 (en) 2007-08-10 2011-01-31 Circuit board, electronic device and method for manufacturing the same
US13/017,590 US8609999B2 (en) 2007-08-10 2011-01-31 Circuit board, electronic device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007209696A JP4444995B2 (ja) 2007-08-10 2007-08-10 基板配線用導電性組成物、回路基板及び電子デバイス

Publications (3)

Publication Number Publication Date
JP2009044065A JP2009044065A (ja) 2009-02-26
JP2009044065A5 JP2009044065A5 (enExample) 2009-09-17
JP4444995B2 true JP4444995B2 (ja) 2010-03-31

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JP2007209696A Expired - Fee Related JP4444995B2 (ja) 2007-08-10 2007-08-10 基板配線用導電性組成物、回路基板及び電子デバイス

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JP (1) JP4444995B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102598879A (zh) * 2009-10-23 2012-07-18 株式会社藤仓 器件安装结构以及器件安装方法
EP2493273A4 (en) * 2009-10-23 2013-10-16 Fujikura Ltd MOUNTING SUPPORT AND ASSEMBLY PROCESS FOR ONE DEVICE
US20140254120A1 (en) * 2009-10-23 2014-09-11 Fujikura Ltd. Device packaging structure and device packaging method
JP4637966B1 (ja) * 2010-02-15 2011-02-23 有限会社ナプラ 電子デバイスの製造方法
US9704793B2 (en) 2011-01-04 2017-07-11 Napra Co., Ltd. Substrate for electronic device and electronic device
JP5667467B2 (ja) * 2011-02-18 2015-02-12 有限会社 ナプラ 合金材料、回路基板、電子デバイス及びその製造方法
CN104332447A (zh) * 2013-07-22 2015-02-04 赛方塊股份有限公司 电极的构造,构成材料及其制造方法
US20220395935A1 (en) * 2019-09-11 2022-12-15 Shinryo Corporation Sn-bi-in-based low melting-point joining member, production method therefor, semiconductor electronic circuit, and mounting method therefor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW369451B (en) * 1996-05-10 1999-09-11 Ford Motor Co Solder composition and method of using to interconnect electronic components to circuits on thermoplastic substrates
JP3761678B2 (ja) * 1997-07-17 2006-03-29 松下電器産業株式会社 錫含有鉛フリーはんだ合金及びそのクリームはんだ並びにその製造方法
JP4468081B2 (ja) * 2004-06-10 2010-05-26 三菱樹脂株式会社 多層配線基板用導電性ペースト組成物
JP4936352B2 (ja) * 2005-09-02 2012-05-23 有限会社 ナプラ 多層回路基板又はウエハーに設けられた貫通孔又は非貫通孔に充填材を充填する方法

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JP2009044065A (ja) 2009-02-26

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