JP2009044065A5 - - Google Patents

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Publication number
JP2009044065A5
JP2009044065A5 JP2007209696A JP2007209696A JP2009044065A5 JP 2009044065 A5 JP2009044065 A5 JP 2009044065A5 JP 2007209696 A JP2007209696 A JP 2007209696A JP 2007209696 A JP2007209696 A JP 2007209696A JP 2009044065 A5 JP2009044065 A5 JP 2009044065A5
Authority
JP
Japan
Prior art keywords
electrode
circuit board
board
circuit
conductive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007209696A
Other languages
English (en)
Japanese (ja)
Other versions
JP4444995B2 (ja
JP2009044065A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007209696A priority Critical patent/JP4444995B2/ja
Priority claimed from JP2007209696A external-priority patent/JP4444995B2/ja
Priority to US12/180,831 priority patent/US7910837B2/en
Publication of JP2009044065A publication Critical patent/JP2009044065A/ja
Publication of JP2009044065A5 publication Critical patent/JP2009044065A5/ja
Application granted granted Critical
Publication of JP4444995B2 publication Critical patent/JP4444995B2/ja
Priority to US13/017,544 priority patent/US8217280B2/en
Priority to US13/017,590 priority patent/US8609999B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007209696A 2007-08-10 2007-08-10 基板配線用導電性組成物、回路基板及び電子デバイス Expired - Fee Related JP4444995B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007209696A JP4444995B2 (ja) 2007-08-10 2007-08-10 基板配線用導電性組成物、回路基板及び電子デバイス
US12/180,831 US7910837B2 (en) 2007-08-10 2008-07-28 Circuit board, electronic device and method for manufacturing the same
US13/017,544 US8217280B2 (en) 2007-08-10 2011-01-31 Circuit board, electronic device and method for manufacturing the same
US13/017,590 US8609999B2 (en) 2007-08-10 2011-01-31 Circuit board, electronic device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007209696A JP4444995B2 (ja) 2007-08-10 2007-08-10 基板配線用導電性組成物、回路基板及び電子デバイス

Publications (3)

Publication Number Publication Date
JP2009044065A JP2009044065A (ja) 2009-02-26
JP2009044065A5 true JP2009044065A5 (enExample) 2009-09-17
JP4444995B2 JP4444995B2 (ja) 2010-03-31

Family

ID=40444454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007209696A Expired - Fee Related JP4444995B2 (ja) 2007-08-10 2007-08-10 基板配線用導電性組成物、回路基板及び電子デバイス

Country Status (1)

Country Link
JP (1) JP4444995B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102598879A (zh) * 2009-10-23 2012-07-18 株式会社藤仓 器件安装结构以及器件安装方法
EP2493273A4 (en) * 2009-10-23 2013-10-16 Fujikura Ltd MOUNTING SUPPORT AND ASSEMBLY PROCESS FOR ONE DEVICE
US20140254120A1 (en) * 2009-10-23 2014-09-11 Fujikura Ltd. Device packaging structure and device packaging method
JP4637966B1 (ja) * 2010-02-15 2011-02-23 有限会社ナプラ 電子デバイスの製造方法
US9704793B2 (en) 2011-01-04 2017-07-11 Napra Co., Ltd. Substrate for electronic device and electronic device
JP5667467B2 (ja) * 2011-02-18 2015-02-12 有限会社 ナプラ 合金材料、回路基板、電子デバイス及びその製造方法
CN104332447A (zh) * 2013-07-22 2015-02-04 赛方塊股份有限公司 电极的构造,构成材料及其制造方法
US20220395935A1 (en) * 2019-09-11 2022-12-15 Shinryo Corporation Sn-bi-in-based low melting-point joining member, production method therefor, semiconductor electronic circuit, and mounting method therefor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW369451B (en) * 1996-05-10 1999-09-11 Ford Motor Co Solder composition and method of using to interconnect electronic components to circuits on thermoplastic substrates
JP3761678B2 (ja) * 1997-07-17 2006-03-29 松下電器産業株式会社 錫含有鉛フリーはんだ合金及びそのクリームはんだ並びにその製造方法
JP4468081B2 (ja) * 2004-06-10 2010-05-26 三菱樹脂株式会社 多層配線基板用導電性ペースト組成物
JP4936352B2 (ja) * 2005-09-02 2012-05-23 有限会社 ナプラ 多層回路基板又はウエハーに設けられた貫通孔又は非貫通孔に充填材を充填する方法

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