JP2004518022A5 - - Google Patents
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- Publication number
- JP2004518022A5 JP2004518022A5 JP2002556406A JP2002556406A JP2004518022A5 JP 2004518022 A5 JP2004518022 A5 JP 2004518022A5 JP 2002556406 A JP2002556406 A JP 2002556406A JP 2002556406 A JP2002556406 A JP 2002556406A JP 2004518022 A5 JP2004518022 A5 JP 2004518022A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- metal
- copper
- reduction potential
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US24593700P | 2000-11-03 | 2000-11-03 | |
| PCT/US2001/047369 WO2002055762A2 (en) | 2000-11-03 | 2001-11-03 | Electrochemical co-deposition of metals for electronic device manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004518022A JP2004518022A (ja) | 2004-06-17 |
| JP2004518022A5 true JP2004518022A5 (enExample) | 2005-05-19 |
Family
ID=22928699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002556406A Pending JP2004518022A (ja) | 2000-11-03 | 2001-11-03 | 電子デバイス製造のための金属の電気化学的共析出 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20020127847A1 (enExample) |
| EP (1) | EP1346083A2 (enExample) |
| JP (1) | JP2004518022A (enExample) |
| KR (1) | KR20030048110A (enExample) |
| CN (1) | CN1529772A (enExample) |
| AU (1) | AU2002245083A1 (enExample) |
| WO (1) | WO2002055762A2 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030159941A1 (en) * | 2002-02-11 | 2003-08-28 | Applied Materials, Inc. | Additives for electroplating solution |
| US6974767B1 (en) * | 2002-02-21 | 2005-12-13 | Advanced Micro Devices, Inc. | Chemical solution for electroplating a copper-zinc alloy thin film |
| US7316772B2 (en) * | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
| US8002962B2 (en) | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
| JP4758614B2 (ja) * | 2003-04-07 | 2011-08-31 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 電気めっき組成物および方法 |
| US20050045485A1 (en) * | 2003-09-03 | 2005-03-03 | Taiwan Semiconductor Manufacturing Co. Ltd. | Method to improve copper electrochemical deposition |
| TWI400365B (zh) | 2004-11-12 | 2013-07-01 | Enthone | 微電子裝置上的銅電沈積 |
| US7771579B2 (en) * | 2004-12-03 | 2010-08-10 | Taiwan Semiconductor Manufacturing Co. | Electro chemical plating additives for improving stress and leveling effect |
| US7271482B2 (en) * | 2004-12-30 | 2007-09-18 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
| DE102005014748B4 (de) * | 2005-03-31 | 2007-02-08 | Advanced Micro Devices, Inc., Sunnyvale | Technik zum elektrochemischen Abscheiden einer Legierung mit chemischer Ordnung |
| US7905994B2 (en) | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
| JP2010045140A (ja) * | 2008-08-11 | 2010-02-25 | Nec Electronics Corp | リードフレーム、リードフレームの製造方法及び半導体装置の製造方法 |
| US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| WO2015065150A1 (ko) * | 2013-11-04 | 2015-05-07 | 서울시립대학교 산학협력단 | 합금 도금액과 펄스전류를 이용한 다층 도금 박막 제조방법 |
| US9496145B2 (en) | 2014-03-19 | 2016-11-15 | Applied Materials, Inc. | Electrochemical plating methods |
| US9758896B2 (en) | 2015-02-12 | 2017-09-12 | Applied Materials, Inc. | Forming cobalt interconnections on a substrate |
| WO2016171526A1 (ko) * | 2015-04-22 | 2016-10-27 | 덕산하이메탈(주) | 나노 그레인 사이즈에 의한 발열 반응을 이용한 저온 소결 접합소재 및 이의 제조방법 |
| KR102028239B1 (ko) * | 2015-09-02 | 2019-10-02 | 단국대학교 천안캠퍼스 산학협력단 | 전주를 이용한 다양한 조성의 합금 박막 제조 방법 |
| US9809892B1 (en) * | 2016-07-18 | 2017-11-07 | Rohm And Haas Electronic Materials Llc | Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium |
| WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| CN115182004A (zh) | 2016-12-20 | 2022-10-14 | 巴斯夫欧洲公司 | 包含用于无空隙填充的抑制试剂的用于金属电镀的组合物 |
| RU2684423C1 (ru) * | 2018-05-21 | 2019-04-09 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Саратовский государственный технический университет имени Гагарина Ю.А." (СГТУ имени Гагарина Ю.А.) | Способ изготовления хеморезистора на основе наноструктур оксида цинка электрохимическим методом |
| JP7087759B2 (ja) * | 2018-07-18 | 2022-06-21 | 住友金属鉱山株式会社 | 銅張積層板 |
| US11901225B2 (en) * | 2021-09-14 | 2024-02-13 | Applied Materials, Inc. | Diffusion layers in metal interconnects |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4108739A (en) * | 1973-09-04 | 1978-08-22 | Fuji Photo Film Co., Ltd. | Plating method for memory elements |
| JPS5713637B2 (enExample) * | 1973-09-04 | 1982-03-18 | ||
| BR8805772A (pt) * | 1988-11-01 | 1990-06-12 | Metal Leve Sa | Processo de formacao de camada de deslizamento de mancal |
| US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| JP4394234B2 (ja) * | 2000-01-20 | 2010-01-06 | 日鉱金属株式会社 | 銅電気めっき液及び銅電気めっき方法 |
| US6679983B2 (en) * | 2000-10-13 | 2004-01-20 | Shipley Company, L.L.C. | Method of electrodepositing copper |
-
2001
- 2001-11-03 WO PCT/US2001/047369 patent/WO2002055762A2/en not_active Ceased
- 2001-11-03 US US10/008,665 patent/US20020127847A1/en not_active Abandoned
- 2001-11-03 JP JP2002556406A patent/JP2004518022A/ja active Pending
- 2001-11-03 EP EP01993230A patent/EP1346083A2/en not_active Withdrawn
- 2001-11-03 KR KR10-2003-7006092A patent/KR20030048110A/ko not_active Ceased
- 2001-11-03 AU AU2002245083A patent/AU2002245083A1/en not_active Abandoned
- 2001-11-03 CN CNA018209033A patent/CN1529772A/zh active Pending
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