JP2005142312A5 - - Google Patents

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Publication number
JP2005142312A5
JP2005142312A5 JP2003376415A JP2003376415A JP2005142312A5 JP 2005142312 A5 JP2005142312 A5 JP 2005142312A5 JP 2003376415 A JP2003376415 A JP 2003376415A JP 2003376415 A JP2003376415 A JP 2003376415A JP 2005142312 A5 JP2005142312 A5 JP 2005142312A5
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JP
Japan
Prior art keywords
semiconductor device
electrodes
wiring board
chip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003376415A
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English (en)
Japanese (ja)
Other versions
JP2005142312A (ja
JP4398225B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003376415A priority Critical patent/JP4398225B2/ja
Priority claimed from JP2003376415A external-priority patent/JP4398225B2/ja
Publication of JP2005142312A publication Critical patent/JP2005142312A/ja
Publication of JP2005142312A5 publication Critical patent/JP2005142312A5/ja
Application granted granted Critical
Publication of JP4398225B2 publication Critical patent/JP4398225B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003376415A 2003-11-06 2003-11-06 半導体装置 Expired - Fee Related JP4398225B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003376415A JP4398225B2 (ja) 2003-11-06 2003-11-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003376415A JP4398225B2 (ja) 2003-11-06 2003-11-06 半導体装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2009025463A Division JP4839384B2 (ja) 2009-02-06 2009-02-06 半導体装置の製造方法
JP2009111869A Division JP2009200519A (ja) 2009-05-01 2009-05-01 半導体装置

Publications (3)

Publication Number Publication Date
JP2005142312A JP2005142312A (ja) 2005-06-02
JP2005142312A5 true JP2005142312A5 (enExample) 2006-12-21
JP4398225B2 JP4398225B2 (ja) 2010-01-13

Family

ID=34687463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003376415A Expired - Fee Related JP4398225B2 (ja) 2003-11-06 2003-11-06 半導体装置

Country Status (1)

Country Link
JP (1) JP4398225B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4571679B2 (ja) * 2008-01-18 2010-10-27 Ｏｋｉセミコンダクタ株式会社 半導体装置
JP7197719B2 (ja) * 2019-04-15 2022-12-27 長江存儲科技有限責任公司 半導体デバイス及び方法
CN114005760A (zh) * 2021-11-05 2022-02-01 苏州群策科技有限公司 一种半导体封装基板的制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09199630A (ja) * 1996-01-19 1997-07-31 Toshiba Corp 多層配線基板
JP2000114412A (ja) * 1998-10-06 2000-04-21 Shinko Electric Ind Co Ltd 回路基板の製造方法
JP2001284783A (ja) * 2000-03-30 2001-10-12 Shinko Electric Ind Co Ltd 表面実装用基板及び表面実装構造
JP3871853B2 (ja) * 2000-05-26 2007-01-24 株式会社ルネサステクノロジ 半導体装置及びその動作方法
JP2002026174A (ja) * 2000-07-11 2002-01-25 Shinko Electric Ind Co Ltd 回路基板の製造方法
JP4465884B2 (ja) * 2001-01-22 2010-05-26 ソニー株式会社 半導体装置およびその製造方法
JP2002343818A (ja) * 2001-05-14 2002-11-29 Shinko Electric Ind Co Ltd Ｂｇａ型配線基板及びその製造方法並びに半導体装置の製造方法
JP4012375B2 (ja) * 2001-05-31 2007-11-21 株式会社ルネサステクノロジ 配線基板およびその製造方法
KR100868419B1 (ko) * 2001-06-07 2008-11-11 가부시끼가이샤 르네사스 테크놀로지 반도체장치 및 그 제조방법
JP3500132B2 (ja) * 2001-06-15 2004-02-23 日本アビオニクス株式会社 フリップチップ実装方法
JP2003007902A (ja) * 2001-06-21 2003-01-10 Shinko Electric Ind Co Ltd 電子部品の実装基板及び実装構造
JP2003086735A (ja) * 2001-06-27 2003-03-20 Shinko Electric Ind Co Ltd 位置情報付配線基板及びその製造方法並びに半導体装置の製造方法
JP2003234451A (ja) * 2002-02-06 2003-08-22 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法

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