JP4393175B2 - 半導体素子の金属配線層形成方法 - Google Patents
半導体素子の金属配線層形成方法 Download PDFInfo
- Publication number
- JP4393175B2 JP4393175B2 JP2003413092A JP2003413092A JP4393175B2 JP 4393175 B2 JP4393175 B2 JP 4393175B2 JP 2003413092 A JP2003413092 A JP 2003413092A JP 2003413092 A JP2003413092 A JP 2003413092A JP 4393175 B2 JP4393175 B2 JP 4393175B2
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- JP
- Japan
- Prior art keywords
- wiring layer
- metal wiring
- layer
- metal
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002184 metal Substances 0.000 title claims description 107
- 238000000034 method Methods 0.000 title claims description 52
- 239000004065 semiconductor Substances 0.000 title claims description 28
- 239000000463 material Substances 0.000 claims description 28
- 150000004767 nitrides Chemical class 0.000 claims description 22
- 229920000642 polymer Polymers 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 238000001312 dry etching Methods 0.000 claims description 9
- 238000000059 patterning Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 80
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0275—Photolithographic processes using lasers
Description
120、220 感光物質
130、230 金属ポリマー
132、232 金属残留物
140、240 酸化膜
216 窒化膜
218 Barc層
Claims (11)
- 半導体構造物上に金属配線層を蒸着する段階と、
前記金属配線層上に絶縁膜及び感光物質を順次形成する段階と、
前記感光物質及び前記絶縁膜をマスクとしたドライエッチングにより前記金属配線層をパターニングする段階と、
前記感光物質を除去する段階と、前記絶縁膜を等方性エッチングして、金属ポリマー及び金属残留物を除去する段階とを順次含むことを特徴とする半導体素子の金属配線層形成方法。 - 前記金属配線層はTi/TiN層とAl層で構成された多層構造であることを特徴とする請求項1記載の半導体素子の金属配線層形成方法。
- 前記絶縁膜が窒化膜であることを特徴とする請求項1記載の半導体素子の金属配線層形成方法。
- 前記金属配線層は第1Ti/TiN層、Al層及び第2Ti/TiN層が順次積層されていることを特徴とする請求項2記載の半導体素子の金属配線層形成方法。
- 前記半導体構造物の最上層が酸化膜であることを特徴とする請求項1記載の半導体素子の金属配線層形成方法。
- 前記絶縁膜と前記感光物質の形成の間に、前記感光物質のパターニング時に光の乱反射を防止するためにBarc層を形成する段階をさらに含むことを特徴とする請求項3記載の半導体素子の金属配線層形成方法。
- Barc層及び前記絶縁膜はCHF3/CF4/Arガスを含む活性化プラズマを用いて単一ステップでエッチングすることを特徴とする請求項6記載の半導体素子の金属配線層形成方法。
- 前記Barc層及び前記絶縁膜はCxFy(x、yは自然数)/O2/Arガスを含む活性化プラズマを用いて単一ステップでエッチングすることを特徴とする請求項6記載の半導体素子の金属配線層形成方法。
- 前記Barc層はO2/N2/Arガスを含む活性化プラズマを用いてドライエッチングし、前記絶縁膜はCHF3/CF4/ArガスまたはCxFy(x、yは自然数)/O2/Arガスを含む活性化プラズマを用いてドライエッチングすることを特徴とする請求項6記載の半導体素子の金属配線層形成方法。
- 前記絶縁膜をエッチングする段階はO2/CF4ガスを用いてダウンフロー(Down flow)方式を利用することを特徴とする請求項3記載の半導体素子の金属配線層形成方法。
- 前記絶縁膜をエッチングする段階の後、残っている金属ポリマー及び/または金属残留物を除去するために洗浄工程を行う段階をさらに含むことを特徴とする請求項3記載の半導体素子の金属配線層形成方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0049249A KR100523141B1 (ko) | 2003-07-18 | 2003-07-18 | 반도체 소자의 금속 배선층 형성방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005039183A JP2005039183A (ja) | 2005-02-10 |
JP4393175B2 true JP4393175B2 (ja) | 2010-01-06 |
Family
ID=34056904
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003413092A Expired - Lifetime JP4393175B2 (ja) | 2003-07-18 | 2003-12-11 | 半導体素子の金属配線層形成方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7148150B2 (ja) |
JP (1) | JP4393175B2 (ja) |
KR (1) | KR100523141B1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100684451B1 (ko) * | 2004-12-29 | 2007-02-16 | 동부일렉트로닉스 주식회사 | 건식 식각을 이용한 반도체 제조 방법 |
CN102723273B (zh) * | 2012-05-28 | 2015-03-11 | 上海华力微电子有限公司 | 一种扩大铝线干法刻蚀腐蚀缺陷工艺窗口的方法 |
US9099481B2 (en) | 2013-03-15 | 2015-08-04 | Semiconductor Components Industries, Llc | Methods of laser marking semiconductor substrates |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6013574A (en) * | 1996-01-30 | 2000-01-11 | Advanced Micro Devices, Inc. | Method of forming low resistance contact structures in vias arranged between two levels of interconnect lines |
US6117345A (en) * | 1997-04-02 | 2000-09-12 | United Microelectronics Corp. | High density plasma chemical vapor deposition process |
US6012469A (en) * | 1997-09-17 | 2000-01-11 | Micron Technology, Inc. | Etch residue clean |
US6177353B1 (en) * | 1998-09-15 | 2001-01-23 | Infineon Technologies North America Corp. | Metallization etching techniques for reducing post-etch corrosion of metal lines |
US6063695A (en) * | 1998-11-16 | 2000-05-16 | Taiwan Semiconductor Manufacturing Company | Simplified process for the fabrication of deep clear laser marks using a photoresist mask |
US6255130B1 (en) * | 1998-11-19 | 2001-07-03 | Samsung Electronics Co., Ltd. | Thin film transistor array panel and a method for manufacturing the same |
US6342452B1 (en) * | 1999-05-20 | 2002-01-29 | International Business Machines Corporation | Method of fabricating a Si3N4/polycide structure using a dielectric sacrificial layer as a mask |
JP2000353804A (ja) * | 1999-06-11 | 2000-12-19 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
US6630407B2 (en) * | 2001-03-30 | 2003-10-07 | Lam Research Corporation | Plasma etching of organic antireflective coating |
-
2003
- 2003-07-18 KR KR10-2003-0049249A patent/KR100523141B1/ko active IP Right Grant
- 2003-12-01 US US10/724,133 patent/US7148150B2/en active Active
- 2003-12-11 JP JP2003413092A patent/JP4393175B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20050014381A1 (en) | 2005-01-20 |
KR20050010235A (ko) | 2005-01-27 |
US7148150B2 (en) | 2006-12-12 |
KR100523141B1 (ko) | 2005-10-19 |
JP2005039183A (ja) | 2005-02-10 |
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