JP4391301B2 - 有機電界発光表示装置の製造方法 - Google Patents
有機電界発光表示装置の製造方法 Download PDFInfo
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- JP4391301B2 JP4391301B2 JP2004126897A JP2004126897A JP4391301B2 JP 4391301 B2 JP4391301 B2 JP 4391301B2 JP 2004126897 A JP2004126897 A JP 2004126897A JP 2004126897 A JP2004126897 A JP 2004126897A JP 4391301 B2 JP4391301 B2 JP 4391301B2
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- 238000000034 method Methods 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 claims description 58
- 239000011521 glass Substances 0.000 claims description 50
- 238000007789 sealing Methods 0.000 claims description 50
- 229920000642 polymer Polymers 0.000 claims description 21
- 230000004888 barrier function Effects 0.000 claims description 17
- 239000005394 sealing glass Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 13
- 238000005401 electroluminescence Methods 0.000 claims description 12
- 239000003566 sealing material Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229920000592 inorganic polymer Polymers 0.000 claims description 3
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 95
- 239000010408 film Substances 0.000 description 35
- 239000010409 thin film Substances 0.000 description 19
- 239000012044 organic layer Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000002161 passivation Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229920001621 AMOLED Polymers 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910019015 Mg-Ag Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- YOZHUJDVYMRYDM-UHFFFAOYSA-N 4-(4-anilinophenyl)-3-naphthalen-1-yl-n-phenylaniline Chemical compound C=1C=C(C=2C(=CC(NC=3C=CC=CC=3)=CC=2)C=2C3=CC=CC=C3C=CC=2)C=CC=1NC1=CC=CC=C1 YOZHUJDVYMRYDM-UHFFFAOYSA-N 0.000 description 1
- MBPCKEZNJVJYTC-UHFFFAOYSA-N 4-[4-(n-phenylanilino)phenyl]aniline Chemical compound C1=CC(N)=CC=C1C1=CC=C(N(C=2C=CC=CC=2)C=2C=CC=CC=2)C=C1 MBPCKEZNJVJYTC-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229920001795 coordination polymer Polymers 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/128—Active-matrix OLED [AMOLED] displays comprising two independent displays, e.g. for emitting information from two major sides of the display
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/176—Passive-matrix OLED displays comprising two independent displays, e.g. for emitting information from two major sides of the display
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
2…有機電界発光部、
3…密封部、
t…厚さ、
11…バッファ層、
12…活性層、
13…ゲート絶縁膜、
14…ゲート電極、
15…層間絶縁膜、
16…ソース電極、
17…ドレイン電極、
18…パシべーション膜、
19…絶縁性平坦化膜、
21…第1電極層、
22…絶縁層、
23…有機層、
24…第2電極層。
Claims (5)
- ガラス基板を準備する段階と、
前記ガラス基板の一面に有機電界発光素子を含む有機電界発光部を複数個形成する段階と、
前記各有機電界発光部にそれぞれ密封部を形成して密封する段階と、
前記複数個の有機電界発光部が設けられた前記ガラス基板のエッジに沿ってシーリング材を塗布する段階と、
前記密封部と密封ガラスとの間を接合しないように前記シーリング材によって前記密封ガラスと前記ガラス基板を接合して、前記ガラス基板の前記有機電界発光部が形成された面を前記シーリング材と前記密封ガラスのみにより密封する段階と、
前記ガラス基板を所定厚さにエッチングする段階と、
前記ガラス基板及び前記密封ガラスを前記各有機電界発光部に対応するように切断して前記各有機電界発光部を分離する段階と、を含むことを特徴とする有機電界発光表示装置の製造方法。 - 前記各有機電界発光部にそれぞれ密封部を形成して密封する段階は、
前記各有機電界発光部を密封するように少なくとも一つのバリヤー層を蒸着する段階、及び少なくとも一つのポリマー層を形成する段階を含むことを特徴とする請求項1に記載の有機電界発光表示装置の製造方法。 - 前記バリヤー層は、シリコン、メタルオキサイド、メタルナイトライド、メタルカーバイド、メタルオキシナイトライド及びこれらの化合物のうち少なくとも一つであることを特徴とする請求項2に記載の有機電界発光表示装置の製造方法。
- 前記ポリマー層は、有機ポリマー、無機ポリマー、有機金属ポリマー及び有機/無機複合ポリマーのうち少なくとも一つであることを特徴とする請求項3に記載の有機電界発光表示装置の製造方法。
- 前記エッチング段階は、前記ガラス基板を0.05ないし0.5mm厚さにエッチングすることであることを特徴とする請求項1に記載の有機電界発光表示装置の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030080539A KR100563057B1 (ko) | 2003-11-14 | 2003-11-14 | 초박형 유기 전계 발광 표시장치 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005150076A JP2005150076A (ja) | 2005-06-09 |
JP4391301B2 true JP4391301B2 (ja) | 2009-12-24 |
Family
ID=34431768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004126897A Expired - Lifetime JP4391301B2 (ja) | 2003-11-14 | 2004-04-22 | 有機電界発光表示装置の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20050104516A1 (ja) |
EP (1) | EP1531502B1 (ja) |
JP (1) | JP4391301B2 (ja) |
KR (1) | KR100563057B1 (ja) |
CN (1) | CN1617641B (ja) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006041135A (ja) * | 2004-07-26 | 2006-02-09 | Sumitomo Bakelite Co Ltd | 電子デバイスおよびその製造方法 |
TWI296895B (en) * | 2005-12-02 | 2008-05-11 | Au Optronics Corp | Encapsulation structure of dual emission organic electroluminescence device and method of fabricating the same |
DE102006027393A1 (de) * | 2006-06-13 | 2007-12-20 | Applied Materials Gmbh & Co. Kg | Verkapselung für organisches Bauelement |
KR100770104B1 (ko) * | 2006-09-28 | 2007-10-24 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 및 그 제조 방법과 이를 위한이송 장치 |
JP2009094050A (ja) * | 2007-09-19 | 2009-04-30 | Fujifilm Corp | 発光素子または表示素子、およびこれらの製造方法 |
US20090267891A1 (en) * | 2008-04-25 | 2009-10-29 | Bamidele Ali | Virtual paper |
TWI587734B (zh) * | 2009-03-26 | 2017-06-11 | 精工愛普生股份有限公司 | 有機el裝置、有機el裝置之製造方法、及電子機器 |
CN101876866B (zh) * | 2010-06-30 | 2012-07-04 | 彩虹集团公司 | 一种具有触摸屏的有机发光器件的制备方法 |
CN101937285B (zh) * | 2010-09-29 | 2012-11-28 | 彩虹集团公司 | 一种触摸面板与显示屏集成的oled显示器件 |
KR101521114B1 (ko) | 2010-12-03 | 2015-05-19 | 엘지디스플레이 주식회사 | 유기전계발광 표시장치 및 그 제조 방법 |
TWI577066B (zh) | 2011-02-08 | 2017-04-01 | 應用材料股份有限公司 | 有機發光二極體的混合式封裝方法 |
KR101876540B1 (ko) | 2011-12-28 | 2018-07-10 | 삼성디스플레이 주식회사 | 가요성 표시 장치 및 가요성 표시 장치의 제조 방법 |
KR101333138B1 (ko) | 2012-03-05 | 2013-11-26 | 삼성디스플레이 주식회사 | 유기 발광 장치의 제조 방법, 무기막 전사용 기판 및 유기 발광 장치 |
KR101931174B1 (ko) | 2012-03-22 | 2019-03-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조방법 |
KR101931336B1 (ko) * | 2012-04-16 | 2018-12-20 | 엘지디스플레이 주식회사 | 평판 표시장치의 보호필름 부착용 전사필름 및 전사필름을 이용한 평판 표시장치의 제조 방법 |
KR102086545B1 (ko) * | 2012-07-19 | 2020-03-10 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치 및 그의 제조 방법 |
US9397318B2 (en) | 2012-09-04 | 2016-07-19 | Applied Materials, Inc. | Method for hybrid encapsulation of an organic light emitting diode |
KR101984736B1 (ko) * | 2012-10-09 | 2019-06-03 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치용 어레이 기판 |
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-
2003
- 2003-11-14 KR KR1020030080539A patent/KR100563057B1/ko active IP Right Grant
-
2004
- 2004-04-22 JP JP2004126897A patent/JP4391301B2/ja not_active Expired - Lifetime
- 2004-10-26 EP EP04256603.4A patent/EP1531502B1/en active Active
- 2004-10-29 CN CN2004100880332A patent/CN1617641B/zh active Active
- 2004-11-01 US US10/976,807 patent/US20050104516A1/en not_active Abandoned
-
2007
- 2007-05-08 US US11/745,815 patent/US7828618B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1531502A3 (en) | 2007-08-01 |
EP1531502B1 (en) | 2014-02-26 |
CN1617641A (zh) | 2005-05-18 |
US7828618B2 (en) | 2010-11-09 |
KR20050046922A (ko) | 2005-05-19 |
EP1531502A2 (en) | 2005-05-18 |
US20050104516A1 (en) | 2005-05-19 |
JP2005150076A (ja) | 2005-06-09 |
US20070207696A1 (en) | 2007-09-06 |
KR100563057B1 (ko) | 2006-03-24 |
CN1617641B (zh) | 2010-09-08 |
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