JP4334128B2 - 半導体実装方法および半導体実装装置 - Google Patents

半導体実装方法および半導体実装装置 Download PDF

Info

Publication number
JP4334128B2
JP4334128B2 JP2000327884A JP2000327884A JP4334128B2 JP 4334128 B2 JP4334128 B2 JP 4334128B2 JP 2000327884 A JP2000327884 A JP 2000327884A JP 2000327884 A JP2000327884 A JP 2000327884A JP 4334128 B2 JP4334128 B2 JP 4334128B2
Authority
JP
Japan
Prior art keywords
semiconductor
position confirmation
circuit board
mounting
confirmation mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000327884A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002134561A (ja
JP2002134561A5 (enExample
Inventor
良典 酒井
一博 登
真 北畠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2000327884A priority Critical patent/JP4334128B2/ja
Publication of JP2002134561A publication Critical patent/JP2002134561A/ja
Publication of JP2002134561A5 publication Critical patent/JP2002134561A5/ja
Application granted granted Critical
Publication of JP4334128B2 publication Critical patent/JP4334128B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)
JP2000327884A 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置 Expired - Fee Related JP4334128B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000327884A JP4334128B2 (ja) 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000327884A JP4334128B2 (ja) 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置

Publications (3)

Publication Number Publication Date
JP2002134561A JP2002134561A (ja) 2002-05-10
JP2002134561A5 JP2002134561A5 (enExample) 2007-04-12
JP4334128B2 true JP4334128B2 (ja) 2009-09-30

Family

ID=18804824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000327884A Expired - Fee Related JP4334128B2 (ja) 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置

Country Status (1)

Country Link
JP (1) JP4334128B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005301056A (ja) * 2004-04-14 2005-10-27 Hitachi Displays Ltd 表示装置とその製造方法
CN100463130C (zh) * 2004-05-20 2009-02-18 威盛电子股份有限公司 倒装芯片封装工艺
TWI299555B (en) * 2006-04-28 2008-08-01 Taiwan Tft Lcd Ass Semiconductor flip-chip package component and fabricating method
TW201018340A (en) * 2008-10-30 2010-05-01 Nan Ya Printed Circuit Board Method for improving yield of solder bumps
JP5191927B2 (ja) * 2009-02-26 2013-05-08 アルプス電気株式会社 Ｍｅｍｓセンサ及びその製造方法
JP2012089563A (ja) * 2010-10-15 2012-05-10 Sanken Electric Co Ltd 半導体モジュール
JP2019121704A (ja) * 2018-01-09 2019-07-22 トヨタ自動車株式会社 半導体装置
JP7655141B2 (ja) * 2021-08-05 2025-04-02 住友電気工業株式会社 半導体装置の製造方法
JP7428916B2 (ja) * 2021-12-27 2024-02-07 日亜化学工業株式会社 発光装置の製造方法および発光装置
CN116110805B (zh) * 2023-04-13 2023-07-11 深圳宏芯宇电子股份有限公司 芯片键合方法、结构及存储器

Also Published As

Publication number Publication date
JP2002134561A (ja) 2002-05-10

Similar Documents

Publication Publication Date Title
CN1171299C (zh) 半导体装置和载带及其制造方法、电路基板、电子装置
JP4334128B2 (ja) 半導体実装方法および半導体実装装置
JP3582634B2 (ja) 固体撮像装置
CN102024458B (zh) 带电路的悬挂基板集合体片及其制造方法
CN100435180C (zh) 电路板连接结构、形成电路板连接结构的方法和显示装置
JPH02303100A (ja) 部品装着方法
US20120304460A1 (en) Module manufacturing method
WO1998033366A1 (en) Method and device for manufacturing multilayered wiring board and wiring board
US7952713B2 (en) Bonding agent sticking inspection apparatus, mounting apparatus, and method of manufacturing electrical component
US20100038017A1 (en) Camera module and method of manufacturing camera module
US7637413B2 (en) X-ray inspection device and X-ray inspection method
US20140299367A1 (en) Component-Embedded Substrate Manufacturing Method and Component-Embedded Substrate Manufactured Using the Same
JP7271680B2 (ja) 光センサモジュールおよび光センサモジュールの製造方法
JP6626027B2 (ja) 製造装置および電子部品の製造方法
CN1105398C (zh) 半导体装置的制造方法
JPH05159233A (ja) 薄膜磁気ヘッド構造体およびその製造方法
JP3651465B2 (ja) 電子部品位置合わせ方法
JP5501204B2 (ja) 支持基板、該支持基板の製造方法及び多層配線基板の製造方法
CN105379430A (zh) 带找位孔基板的制造方法及制造装置以及多个带找位孔基板
JP2769200B2 (ja) ボンディング方法および装置
JP2001244699A (ja) 電極の観察方法。
JP2013225545A (ja) Ｆｐｄモジュール組立装置、および、圧着ヘッド制御方法
JP4147985B2 (ja) 半導体装着装置および半導体装着方法
JP2011039271A (ja) 電子部品実装処理装置及び実装処理方法並びに電子部品実装アライメント方法
CN101969738A (zh) 附连板以及印制板制造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070222

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070222

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080926

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081028

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090310

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090421

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090526

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090623

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120703

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120703

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120703

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130703

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees