JP4326545B2 - 凹凸基板の製造方法及び光起電力素子の製造方法 - Google Patents
凹凸基板の製造方法及び光起電力素子の製造方法 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims description 71
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 11
- 239000000654 additive Substances 0.000 claims description 26
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- 238000005530 etching Methods 0.000 claims description 25
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- 239000012670 alkaline solution Substances 0.000 claims description 20
- 239000000243 solution Substances 0.000 claims description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims description 18
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 18
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 10
- 125000003545 alkoxy group Chemical group 0.000 claims description 9
- 125000003342 alkenyl group Chemical group 0.000 claims description 8
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 125000000542 sulfonic acid group Chemical group 0.000 claims description 3
- 238000001579 optical reflectometry Methods 0.000 claims description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 26
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 16
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 13
- 229960002446 octanoic acid Drugs 0.000 description 13
- 239000010409 thin film Substances 0.000 description 13
- 229910021417 amorphous silicon Inorganic materials 0.000 description 12
- LAUFPZPAKULAGB-UHFFFAOYSA-N 4-butoxybenzoic acid Chemical compound CCCCOC1=CC=C(C(O)=O)C=C1 LAUFPZPAKULAGB-UHFFFAOYSA-N 0.000 description 10
- 235000014113 dietary fatty acids Nutrition 0.000 description 10
- 229930195729 fatty acid Natural products 0.000 description 10
- 239000000194 fatty acid Substances 0.000 description 10
- 150000004665 fatty acids Chemical class 0.000 description 10
- 239000010408 film Substances 0.000 description 10
- 239000012535 impurity Substances 0.000 description 10
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 9
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- 238000006243 chemical reaction Methods 0.000 description 7
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- 239000007864 aqueous solution Substances 0.000 description 6
- KAWUBNUJMFOOOE-UHFFFAOYSA-N 3-amino-3-(3,5-dibromo-4-hydroxyphenyl)propanoic acid Chemical compound OC(=O)CC(N)C1=CC(Br)=C(O)C(Br)=C1 KAWUBNUJMFOOOE-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- KDVYCTOWXSLNNI-UHFFFAOYSA-N 4-t-Butylbenzoic acid Chemical compound CC(C)(C)C1=CC=C(C(O)=O)C=C1 KDVYCTOWXSLNNI-UHFFFAOYSA-N 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- SVHOVVJFOWGYJO-UHFFFAOYSA-N pentabromophenol Chemical compound OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br SVHOVVJFOWGYJO-UHFFFAOYSA-N 0.000 description 4
- -1 4-pentyl Chemical group 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000003245 coal Substances 0.000 description 3
- 239000003240 coconut oil Substances 0.000 description 3
- 235000019864 coconut oil Nutrition 0.000 description 3
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- 239000000126 substance Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- CGMMPMYKMDITEA-UHFFFAOYSA-N 2-ethylbenzoic acid Chemical compound CCC1=CC=CC=C1C(O)=O CGMMPMYKMDITEA-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- 235000019482 Palm oil Nutrition 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- SNMVRZFUUCLYTO-UHFFFAOYSA-N n-propyl chloride Chemical compound CCCCl SNMVRZFUUCLYTO-UHFFFAOYSA-N 0.000 description 2
- 229930014626 natural product Natural products 0.000 description 2
- 239000002540 palm oil Substances 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- MSOTUIWEAQEETA-UHFFFAOYSA-N 4-octylbenzenesulfonic acid Chemical compound CCCCCCCCC1=CC=C(S(O)(=O)=O)C=C1 MSOTUIWEAQEETA-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 238000003547 Friedel-Crafts alkylation reaction Methods 0.000 description 1
- 238000003747 Grignard reaction Methods 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005893 bromination reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/14—Arrangements for connecting different sections, e.g. in water heaters
- F24H9/148—Arrangements of boiler components on a frame or within a casing to build the fluid heater, e.g. boiler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/075—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PIN type, e.g. amorphous silicon PIN solar cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
- Weting (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
R6〜R9は、炭素数1〜3のアルキル基であることがさらに好ましい。上記一般式(1)において、R1〜R5のうちのいずれか1つが炭素数3以上のアルキル基、アルケニル基またはアルコキシ基であり、それ以外は水素原子あるいは炭素数2以下のアルキル基、アルケニル基またはアルコキシ基であることが好ましい。また、炭素数3以上のアルキル基、アルケニル基またはアルコキシ基は、炭素数3以上8以下のアルキル基、アルケニル基またはアルコキシ基であることがさらに好ましい。
5重量%の水酸化ナトリウム水溶液に、以下に示す構造を有する4−プロピル安息香酸(PrBA)、4−t−ブチル安息香酸(TBBA)、4−n−ブチル安息香酸(NBBA)、4−ペンチル安息香酸(PeBA)、4−ブトキシ安息香酸(BOBA)、及び4−n−オクチルベンゼンスルホン酸(NOBS)の各添加剤を添加して溶解し、基板エッチング液を調製した。また、比較の添加剤として2−エチル安息香酸(EBA)を同様に水酸化ナトリウム水溶液に添加して比較のエッチング液を調製した。添加剤の濃度は、1〜0.0001モル/リットルの範囲とし、具体的には、PrBA、TBBA、NBBA、PeBA、BOBAは0.05モル/リットル、NOBSは0.0004モル/リットルとした。
4−ブトキシ安息香酸(BOBA)について、ロットの異なる4種類のものを用い、ロットによる影響を検討した。エッチング液としては、NaOH5重量%水溶液に、4−ブトキシ安息香酸を0.05モル/リットルとなるように溶解させたものを用いた。このエッチング溶液を約85℃に加温し、加温したエッチング溶液に、(100)面を有するn型単結晶シリコン基板を約30分間浸漬し、基板の表面をエッチングした。
比較として、カプリル酸を用いたエッチング液を調製し、評価した。NaOH1.5重量%水溶液に、カプリル酸が0.05モル/リットルとなるように溶解してエッチング液を調製した。このエッチング液を約85℃に加温し、n型単結晶シリコン基板を約30分間浸漬して、基板の表面をエッチングした。
以上のようにして、より効率的に生産できる本発明の方法で表面にテクスチャ構造を形成した基板の上に、該基板と半導体接合を形成する半導体層を形成することにより、良好な光電変換特性を有する光起電力素子を製造することができる。
1a…基板の表面
1b…基板の裏面
2…真性非晶質シリコン薄膜
3…p型非晶質シリコン薄膜
4…透明導電膜
5…真性非晶質シリコン薄膜
6…n型非晶質シリコン薄膜
7…透明導電膜
8…集電極
Claims (5)
- 前記一般式(1)において、R1〜R5のうちのR3が炭素数3以上のアルキル基、アルケニル基またはアルコキシ基であり、それ以外は水素原子あるいは炭素数2以下のアルキル基、アルケニル基、またはアルコキシ基であることを特徴とする請求項1に記載の光起電力素子用凹凸基板の製造方法。
- 前記添加剤の前記アルカリ性溶液中の濃度が、1〜0.0001モル/リットルであることを特徴とする請求項1または2に記載の光起電力素子用凹凸基板の製造方法。
- 前記アルカリ性溶液が、水酸化ナトリウム水溶液または水酸化カリウム水溶液であることを特徴とする請求項1〜3のいずれか1項に記載の光起電力素子用凹凸基板の製造方法。
- 請求項1〜4のいずれか1項に記載の方法により表面に凹凸構造を有する結晶系シリコン基板を製造する工程と、
前記結晶系シリコン基板の前記凹凸構造が形成された表面上に、該結晶系シリコン基板と半導体接合を形成する半導体層を形成する工程とを備えることを特徴とする光起電力素子の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2006176958A JP4326545B2 (ja) | 2006-02-23 | 2006-06-27 | 凹凸基板の製造方法及び光起電力素子の製造方法 |
TW096103129A TW200736368A (en) | 2006-02-23 | 2007-01-29 | Method for making undulated substrate and method for making light emitting element |
EP07003433A EP1826829B1 (en) | 2006-02-23 | 2007-02-19 | Method for fabrication of a photovoltaic device including making an irregularly surfaced substrate |
KR1020070017778A KR101064854B1 (ko) | 2006-02-23 | 2007-02-22 | 광기전력 소자용 요철 기판의 제조 방법 및 광기전력 소자의 제조 방법 |
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JP2006176958A JP4326545B2 (ja) | 2006-02-23 | 2006-06-27 | 凹凸基板の製造方法及び光起電力素子の製造方法 |
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JP2007258656A JP2007258656A (ja) | 2007-10-04 |
JP4326545B2 true JP4326545B2 (ja) | 2009-09-09 |
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EP (1) | EP1826829B1 (ja) |
JP (1) | JP4326545B2 (ja) |
KR (1) | KR101064854B1 (ja) |
TW (1) | TW200736368A (ja) |
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DE102007026081A1 (de) * | 2007-05-25 | 2008-11-27 | Gebr. Schmid Gmbh & Co. | Verfahren zur Behandlung von Siliziumwafern, Behandlungsflüssigkeit und Siliziumwafer |
TW201001508A (en) * | 2008-03-25 | 2010-01-01 | Applied Materials Inc | Surface cleaning and texturing process for crystalline solar cells |
KR101168589B1 (ko) * | 2008-03-26 | 2012-07-30 | 엘지전자 주식회사 | 계면 활성제를 이용한 실리콘 태양전지의 텍스처링 방법 |
DE102009012827A1 (de) * | 2009-03-03 | 2010-10-07 | Gebr. Schmid Gmbh & Co. | Verfahren zur Texturierung von Siliziumwafern für Solarzellen und Behandlungsflüssigkeit dafür |
DE112010001432T5 (de) | 2009-03-31 | 2012-10-25 | Kurita Water Industries, Ltd. | Vorrichtung und Verfahren zur Aufbereitung einer Ätzlösung |
JP5479301B2 (ja) | 2010-05-18 | 2014-04-23 | 株式会社新菱 | エッチング液およびシリコン基板の表面加工方法 |
TW201221626A (en) * | 2010-08-20 | 2012-06-01 | Tokuyama Corp | Composition for texture formation, kit for preparation thereof, and method for manufacturing silicon substrates |
WO2012157908A2 (ko) * | 2011-05-13 | 2012-11-22 | 주식회사 엘지생활건강 | 기판의 텍스처링 조성물 및 이를 이용하는 방법 |
EP2717321B1 (en) * | 2011-06-03 | 2020-07-29 | Panasonic Intellectual Property Management Co., Ltd. | Method for manufacturing solar cell |
TW201402785A (zh) * | 2012-05-11 | 2014-01-16 | Wako Pure Chem Ind Ltd | 蝕刻液及使用其的矽系基板的製造方法 |
JPWO2014010471A1 (ja) * | 2012-07-09 | 2016-06-23 | 攝津製油株式会社 | エッチング液、エッチング力回復剤、太陽電池用半導体基板の製造方法、及び太陽電池用半導体基板 |
JPWO2014064769A1 (ja) * | 2012-10-23 | 2016-09-05 | パナソニックIpマネジメント株式会社 | 太陽電池 |
JP5824618B2 (ja) * | 2013-03-01 | 2015-11-25 | パナソニックIpマネジメント株式会社 | シリコン基板 |
CN105518834B (zh) * | 2013-09-19 | 2018-02-16 | 摄津制油株式会社 | 半导体基板用蚀刻液 |
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JP2001332529A (ja) | 2000-05-19 | 2001-11-30 | Daido Steel Co Ltd | 単結晶半導体基板の表面処理方法、および単結晶半導体基板の電極層形成方法 |
JP2004349379A (ja) * | 2003-05-21 | 2004-12-09 | Hitachi Cable Ltd | 凹凸基板の製造方法 |
JP2005251266A (ja) * | 2004-03-03 | 2005-09-15 | Shin Etsu Chem Co Ltd | 磁気記録媒用基板体およびその製造方法 |
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EP1826829B1 (en) | 2012-04-11 |
JP2007258656A (ja) | 2007-10-04 |
KR101064854B1 (ko) | 2011-09-14 |
EP1826829A3 (en) | 2010-07-28 |
EP1826829A2 (en) | 2007-08-29 |
KR20070087508A (ko) | 2007-08-28 |
TW200736368A (en) | 2007-10-01 |
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