JP4294910B2 - 半導体デバイス製造プラントにおける物質供給システム - Google Patents

半導体デバイス製造プラントにおける物質供給システム Download PDF

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Publication number
JP4294910B2
JP4294910B2 JP2002088153A JP2002088153A JP4294910B2 JP 4294910 B2 JP4294910 B2 JP 4294910B2 JP 2002088153 A JP2002088153 A JP 2002088153A JP 2002088153 A JP2002088153 A JP 2002088153A JP 4294910 B2 JP4294910 B2 JP 4294910B2
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JP
Japan
Prior art keywords
pure water
primary
water
supply system
water supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002088153A
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English (en)
Japanese (ja)
Other versions
JP2003282386A5 (https=
JP2003282386A (ja
Inventor
邦浩 宮崎
壮一 灘原
欣也 臼田
晶ニ 赤堀
創太 中川
健 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Toshiba Corp
Original Assignee
Ebara Corp
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Toshiba Corp filed Critical Ebara Corp
Priority to JP2002088153A priority Critical patent/JP4294910B2/ja
Priority to PCT/JP2003/003874 priority patent/WO2003081647A1/en
Priority to US10/507,699 priority patent/US7305275B2/en
Priority to CNA03809536XA priority patent/CN1650400A/zh
Publication of JP2003282386A publication Critical patent/JP2003282386A/ja
Publication of JP2003282386A5 publication Critical patent/JP2003282386A5/ja
Application granted granted Critical
Publication of JP4294910B2 publication Critical patent/JP4294910B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32082—Planing, material requiring planning MRP, request
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S210/00—Liquid purification or separation
    • Y10S210/90—Ultra pure water, e.g. conductivity water

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
JP2002088153A 2002-03-27 2002-03-27 半導体デバイス製造プラントにおける物質供給システム Expired - Fee Related JP4294910B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002088153A JP4294910B2 (ja) 2002-03-27 2002-03-27 半導体デバイス製造プラントにおける物質供給システム
PCT/JP2003/003874 WO2003081647A1 (en) 2002-03-27 2003-03-27 Material supply system in semiconductor device manufacturing plant
US10/507,699 US7305275B2 (en) 2002-03-27 2003-03-27 Material supply system in semiconductor device manufacturing plant
CNA03809536XA CN1650400A (zh) 2002-03-27 2003-03-27 半导体器件制造工厂中的原料供给系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002088153A JP4294910B2 (ja) 2002-03-27 2002-03-27 半導体デバイス製造プラントにおける物質供給システム

Publications (3)

Publication Number Publication Date
JP2003282386A JP2003282386A (ja) 2003-10-03
JP2003282386A5 JP2003282386A5 (https=) 2005-08-25
JP4294910B2 true JP4294910B2 (ja) 2009-07-15

Family

ID=28449425

Family Applications (1)

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JP2002088153A Expired - Fee Related JP4294910B2 (ja) 2002-03-27 2002-03-27 半導体デバイス製造プラントにおける物質供給システム

Country Status (4)

Country Link
US (1) US7305275B2 (https=)
JP (1) JP4294910B2 (https=)
CN (1) CN1650400A (https=)
WO (1) WO2003081647A1 (https=)

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US7862662B2 (en) * 2005-12-30 2011-01-04 Lam Research Corporation Method and material for cleaning a substrate
US20070084793A1 (en) * 2005-10-18 2007-04-19 Nigel Wenden Method and apparatus for producing ultra-high purity water
JP4018726B2 (ja) * 2006-02-07 2007-12-05 東洋炭素株式会社 半導体製造プラント
EP1994456A4 (en) 2006-03-16 2010-05-19 Applied Materials Inc METHOD AND DEVICE FOR PRESSURE CONTROL IN MANUFACTURING SYSTEMS FOR ELECTRONIC DEVICES
WO2008147522A1 (en) * 2007-05-25 2008-12-04 Applied Materials, Inc. Methods and apparatus for assembling and operating electronic device manufacturing systems
KR101551170B1 (ko) * 2007-05-25 2015-09-09 어플라이드 머티어리얼스, 인코포레이티드 저감 시스템의 효율적 작동을 위한 방법들 및 장치
US20090018688A1 (en) * 2007-06-15 2009-01-15 Applied Materials, Inc. Methods and systems for designing and validating operation of abatement systems
EP2009532A1 (en) * 2007-06-29 2008-12-31 Siemens Aktiengesellschaft A method for real-time scheduling of processes at distributed manufacturing sites
WO2009055750A1 (en) * 2007-10-26 2009-04-30 Applied Materials, Inc. Methods and apparatus for smart abatement using an improved fuel circuit
WO2009100163A1 (en) * 2008-02-05 2009-08-13 Applied Materials, Inc. Methods and apparatus for operating an electronic device manufacturing system
KR101581673B1 (ko) * 2008-02-05 2015-12-31 어플라이드 머티어리얼스, 인코포레이티드 제조 프로세스들로부터의 가연성 폐기물 가스들을 처리하기 위한 시스템 및 방법
JP2013115117A (ja) * 2011-11-25 2013-06-10 Tokyo Electron Ltd 資源再利用装置、処理装置群コントローラ、資源再利用システム、資源再利用方法、及び資源再利用プログラム
TW201312638A (zh) * 2012-03-03 2013-03-16 Hong Tung Resource Co Ltd 矽晶圓切割廢料之處理方法
JP6368458B2 (ja) * 2013-05-24 2018-08-01 株式会社荏原製作所 除害機能付真空ポンプ
JP2016134569A (ja) * 2015-01-21 2016-07-25 株式会社東芝 半導体製造装置
CN109571227B (zh) * 2018-12-27 2021-08-31 西安奕斯伟硅片技术有限公司 抛光液供给系统、方法及抛光系统
JP7665482B2 (ja) 2021-09-24 2025-04-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システム、及び群管理装置
CN118928972B (zh) * 2024-10-14 2025-01-14 内蒙古大全半导体有限公司 一种电子级多晶硅料暂存系统

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533495B2 (ja) * 1986-07-25 1996-09-11 株式会社日立製作所 ワ−クスケジユ−リング方法及び装置
JPS6362325A (ja) * 1986-09-03 1988-03-18 Nec Corp ドライエツチング装置
US5023787A (en) * 1988-02-01 1991-06-11 Rainbird Sprinkler Mfg. Corp. Irrigation control and flow management system
JP3277340B2 (ja) * 1993-04-22 2002-04-22 日本酸素株式会社 半導体製造工場向け各種ガスの製造方法及び装置
WO1996029598A1 (en) 1995-03-17 1996-09-26 Hitachi, Ltd. Waste water control system
JPH0947750A (ja) 1995-08-10 1997-02-18 Ricoh Co Ltd 水処理システム
US6217659B1 (en) * 1998-10-16 2001-04-17 Air Products And Chemical, Inc. Dynamic blending gas delivery system and method
JP2000135426A (ja) 1998-10-30 2000-05-16 Tokico Ltd 混合装置
DE19900805C2 (de) * 1999-01-12 2002-06-13 Infineon Technologies Ag Verfahren und Vorrichtung zur Erzeugung von Reinstwasser
TW495819B (en) * 2000-05-31 2002-07-21 Toshiba Corp Method and system for electronic commerce of semiconductor product, system and method of production, and design system, design method and manufacturing method of production equipment
US7317972B2 (en) * 2001-10-31 2008-01-08 Aqua Conserve, Inc. Management of peak water use
JP2003271218A (ja) * 2002-03-15 2003-09-26 Toshiba Corp 半導体製造装置、半導体製造システム及び基板処理方法

Also Published As

Publication number Publication date
US20050177273A1 (en) 2005-08-11
US7305275B2 (en) 2007-12-04
WO2003081647A1 (en) 2003-10-02
JP2003282386A (ja) 2003-10-03
CN1650400A (zh) 2005-08-03

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