JP4275668B2 - 気体回収装置、テストヘッドおよびｉｃデバイス試験装置 - Google Patents

気体回収装置、テストヘッドおよびｉｃデバイス試験装置 Download PDF

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Publication number
JP4275668B2
JP4275668B2 JP2005511119A JP2005511119A JP4275668B2 JP 4275668 B2 JP4275668 B2 JP 4275668B2 JP 2005511119 A JP2005511119 A JP 2005511119A JP 2005511119 A JP2005511119 A JP 2005511119A JP 4275668 B2 JP4275668 B2 JP 4275668B2
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Japan
Prior art keywords
coolant
gas recovery
gas
substrate
cooling liquid
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Expired - Fee Related
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JP2005511119A
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Japanese (ja)
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JPWO2005002294A1 (ja
Inventor
孝英 西浦
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Advantest Corp
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Advantest Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2005511119A 2003-06-30 2004-06-25 気体回収装置、テストヘッドおよびｉｃデバイス試験装置 Expired - Fee Related JP4275668B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2003/008299 WO2005004571A1 (ja) 2003-06-30 2003-06-30 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド
JPPCT/JP03/08299 2003-06-30
PCT/JP2004/009374 WO2005002294A2 (ja) 2003-06-30 2004-06-25 気体回収装置、テストヘッドおよびｉｃデバイス試験装置

Publications (2)

Publication Number Publication Date
JPWO2005002294A1 JPWO2005002294A1 (ja) 2006-08-10
JP4275668B2 true JP4275668B2 (ja) 2009-06-10

Family

ID=33549064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005511119A Expired - Fee Related JP4275668B2 (ja) 2003-06-30 2004-06-25 気体回収装置、テストヘッドおよびｉｃデバイス試験装置

Country Status (9)

Country Link
US (1) US7072180B2 (cg-RX-API-DMAC7.html)
EP (1) EP1645318A4 (cg-RX-API-DMAC7.html)
JP (1) JP4275668B2 (cg-RX-API-DMAC7.html)
KR (1) KR100813125B1 (cg-RX-API-DMAC7.html)
CN (1) CN100556495C (cg-RX-API-DMAC7.html)
AU (1) AU2003246165A1 (cg-RX-API-DMAC7.html)
MY (1) MY131476A (cg-RX-API-DMAC7.html)
TW (1) TW200511923A (cg-RX-API-DMAC7.html)
WO (2) WO2005004571A1 (cg-RX-API-DMAC7.html)

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JP4889653B2 (ja) 2005-11-17 2012-03-07 株式会社アドバンテスト デバイス実装装置、テストヘッド及び電子部品試験装置
WO2009031415A1 (ja) * 2007-09-06 2009-03-12 Advantest Corporation 電子部品冷却装置、それを備えたテストヘッド及び電子部品試験装置
DE112007003652T5 (de) * 2007-09-14 2010-11-04 Advantest Corp. Kühlmantel zum Kühlen eines elektronischen Bauelements auf einer Platte
JP4703633B2 (ja) * 2007-12-04 2011-06-15 株式会社東芝 冷却プレート構造
CN102197313B (zh) 2008-10-28 2016-05-18 爱德万测试株式会社 测试装置及电路模块
US8289039B2 (en) 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
CN103093848B (zh) * 2011-10-28 2015-12-09 原子高科股份有限公司 85Kr源的制备及回收工艺
US20160081220A1 (en) * 2014-09-15 2016-03-17 Cisco Technology, Inc. Reduction of Intake Resistance for Air Flow Enhancement
JP2016188780A (ja) * 2015-03-30 2016-11-04 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
KR20160117082A (ko) 2015-03-31 2016-10-10 최민석 인터넷 검색 시스템
US10309732B2 (en) * 2015-12-11 2019-06-04 Hanon Systems Internal degas feature for plate-fin heat exchangers
JP7412277B2 (ja) * 2020-06-02 2024-01-12 東京エレクトロン株式会社 検査装置及び検査方法
CN112015253A (zh) * 2020-09-14 2020-12-01 深圳比特微电子科技有限公司 一种液冷板散热器和计算设备
CN114705972B (zh) * 2022-05-06 2023-05-09 中国软件评测中心(工业和信息化部软件与集成电路促进中心) 一种集成电路性能测试装置及其测试方法
US20240084821A1 (en) * 2022-09-13 2024-03-14 Us Hybrid Corporation Self-priming cooling jacket
TWI891269B (zh) * 2024-03-05 2025-07-21 英業達股份有限公司 電路板測試系統與電路板測試裝置

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Also Published As

Publication number Publication date
JPWO2005002294A1 (ja) 2006-08-10
KR100813125B1 (ko) 2008-03-17
US20050056102A1 (en) 2005-03-17
CN100556495C (zh) 2009-11-04
AU2003246165A1 (en) 2005-01-21
EP1645318A4 (en) 2009-05-13
TWI353211B (cg-RX-API-DMAC7.html) 2011-11-21
TW200511923A (en) 2005-03-16
WO2005002294A3 (ja) 2005-03-03
EP1645318A2 (en) 2006-04-12
MY131476A (en) 2007-08-30
WO2005002294A2 (ja) 2005-01-06
CN1812826A (zh) 2006-08-02
US7072180B2 (en) 2006-07-04
KR20060023569A (ko) 2006-03-14
WO2005004571A1 (ja) 2005-01-13

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