WO2005002294A3 - 気体回収装置、テストヘッドおよびｉｃデバイス試験装置 - Google Patents

気体回収装置、テストヘッドおよびｉｃデバイス試験装置 Download PDF

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Publication number
WO2005002294A3
WO2005002294A3 PCT/JP2004/009374 JP2004009374W WO2005002294A3 WO 2005002294 A3 WO2005002294 A3 WO 2005002294A3 JP 2004009374 W JP2004009374 W JP 2004009374W WO 2005002294 A3 WO2005002294 A3 WO 2005002294A3
Authority
WO
WIPO (PCT)
Prior art keywords
gas
cover
collecting unit
testing apparatus
test head
Prior art date
Application number
PCT/JP2004/009374
Other languages
English (en)
French (fr)
Other versions
WO2005002294A1 (ja
WO2005002294A2 (ja
Inventor
Koei Nishiura
Original Assignee
Advantest Corp
Koei Nishiura
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp, Koei Nishiura filed Critical Advantest Corp
Priority to EP04746843A priority Critical patent/EP1645318A4/en
Priority to JP2005511119A priority patent/JP4275668B2/ja
Priority to US10/974,724 priority patent/US7072180B2/en
Publication of WO2005002294A1 publication Critical patent/WO2005002294A1/ja
Publication of WO2005002294A2 publication Critical patent/WO2005002294A2/ja
Publication of WO2005002294A3 publication Critical patent/WO2005002294A3/ja

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

　基板４に実装されたＩＣデバイス４４を覆い、内部に冷却液を流通させることによりＩＣデバイス４４に対して冷却液を接触させることのできる発熱素子冷却用カバー５において、発熱素子冷却用カバー５の内部にて気体溜りの発生し易い気体溜り部から、流通する冷却液が気体溜り部よりも下流となる位置まで、空気および冷却液が通過し得る溝５４（バイパス）を設ける。　このような発熱素子冷却用カバー５によれば、気体溜り部の空気はバイパスを通って抜け得るため、気体溜りを効果的に除去することができる。
PCT/JP2004/009374 2003-06-30 2004-06-25 気体回収装置、テストヘッドおよびｉｃデバイス試験装置 WO2005002294A2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP04746843A EP1645318A4 (en) 2003-06-30 2004-06-25 GASSAMMELEINHEIT, TEST HEAD AND IC COMPONENT TEST APPARATUS
JP2005511119A JP4275668B2 (ja) 2003-06-30 2004-06-25 気体回収装置、テストヘッドおよびｉｃデバイス試験装置
US10/974,724 US7072180B2 (en) 2003-06-30 2004-10-28 Gas collecting device, test head and IC device testing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2003/008299 WO2005004571A1 (ja) 2003-06-30 2003-06-30 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド
JPPCT/JP03/08299 2003-06-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/974,724 Continuation US7072180B2 (en) 2003-06-30 2004-10-28 Gas collecting device, test head and IC device testing apparatus

Publications (3)

Publication Number Publication Date
WO2005002294A1 WO2005002294A1 (ja) 2005-01-06
WO2005002294A2 WO2005002294A2 (ja) 2005-01-06
WO2005002294A3 true WO2005002294A3 (ja) 2005-03-03

Family

ID=33549064

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2003/008299 WO2005004571A1 (ja) 2003-06-30 2003-06-30 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド
PCT/JP2004/009374 WO2005002294A2 (ja) 2003-06-30 2004-06-25 気体回収装置、テストヘッドおよびｉｃデバイス試験装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/008299 WO2005004571A1 (ja) 2003-06-30 2003-06-30 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド

Country Status (9)

Country Link
US (1) US7072180B2 (ja)
EP (1) EP1645318A4 (ja)
JP (1) JP4275668B2 (ja)
KR (1) KR100813125B1 (ja)
CN (1) CN100556495C (ja)
AU (1) AU2003246165A1 (ja)
MY (1) MY131476A (ja)
TW (1) TW200511923A (ja)
WO (2) WO2005004571A1 (ja)

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JP4889653B2 (ja) 2005-11-17 2012-03-07 株式会社アドバンテスト デバイス実装装置、テストヘッド及び電子部品試験装置
WO2009031415A1 (ja) * 2007-09-06 2009-03-12 Advantest Corporation 電子部品冷却装置、それを備えたテストヘッド及び電子部品試験装置
US8391006B2 (en) * 2007-09-14 2013-03-05 Advantest Corporation Water jacket for cooling an electronic device on a board
JP4703633B2 (ja) * 2007-12-04 2011-06-15 株式会社東芝 冷却プレート構造
KR101214036B1 (ko) 2008-10-28 2012-12-20 가부시키가이샤 어드밴티스트 시험 장치 및 회로 모듈
US8289039B2 (en) 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
CN103093848B (zh) * 2011-10-28 2015-12-09 原子高科股份有限公司 85Kr源的制备及回收工艺
US20160081220A1 (en) * 2014-09-15 2016-03-17 Cisco Technology, Inc. Reduction of Intake Resistance for Air Flow Enhancement
JP2016188780A (ja) * 2015-03-30 2016-11-04 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
KR20160117082A (ko) 2015-03-31 2016-10-10 최민석 인터넷 검색 시스템
US10309732B2 (en) * 2015-12-11 2019-06-04 Hanon Systems Internal degas feature for plate-fin heat exchangers
JP7412277B2 (ja) * 2020-06-02 2024-01-12 東京エレクトロン株式会社 検査装置及び検査方法
CN112015253A (zh) * 2020-09-14 2020-12-01 深圳比特微电子科技有限公司 一种液冷板散热器和计算设备
CN114705972B (zh) * 2022-05-06 2023-05-09 中国软件评测中心(工业和信息化部软件与集成电路促进中心) 一种集成电路性能测试装置及其测试方法
US20240084821A1 (en) * 2022-09-13 2024-03-14 Us Hybrid Corporation Self-priming cooling jacket

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JPH1051169A (ja) * 1996-08-06 1998-02-20 Advantest Corp 発熱素子実装半導体装置
JP2002280507A (ja) * 2001-03-19 2002-09-27 Advantest Corp 発熱素子冷却装置および発熱素子実装装置

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JP2002280507A (ja) * 2001-03-19 2002-09-27 Advantest Corp 発熱素子冷却装置および発熱素子実装装置

Also Published As

Publication number Publication date
MY131476A (en) 2007-08-30
AU2003246165A1 (en) 2005-01-21
JPWO2005002294A1 (ja) 2006-08-10
TWI353211B (ja) 2011-11-21
KR20060023569A (ko) 2006-03-14
WO2005004571A1 (ja) 2005-01-13
US20050056102A1 (en) 2005-03-17
CN100556495C (zh) 2009-11-04
TW200511923A (en) 2005-03-16
CN1812826A (zh) 2006-08-02
EP1645318A4 (en) 2009-05-13
EP1645318A2 (en) 2006-04-12
WO2005002294A2 (ja) 2005-01-06
KR100813125B1 (ko) 2008-03-17
JP4275668B2 (ja) 2009-06-10
US7072180B2 (en) 2006-07-04

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