MY131476A - Gas collecting device, test head and ic device testing apparatus - Google Patents

Gas collecting device, test head and ic device testing apparatus

Info

Publication number
MY131476A
MY131476A MYPI20042598A MYPI20042598A MY131476A MY 131476 A MY131476 A MY 131476A MY PI20042598 A MYPI20042598 A MY PI20042598A MY PI20042598 A MYPI20042598 A MY PI20042598A MY 131476 A MY131476 A MY 131476A
Authority
MY
Malaysia
Prior art keywords
gas accumulation
testing apparatus
gas collecting
test head
coolant
Prior art date
Application number
MYPI20042598A
Other languages
English (en)
Inventor
Koei Nishiura
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of MY131476A publication Critical patent/MY131476A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
MYPI20042598A 2003-06-30 2004-06-30 Gas collecting device, test head and ic device testing apparatus MY131476A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/008299 WO2005004571A1 (ja) 2003-06-30 2003-06-30 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド

Publications (1)

Publication Number Publication Date
MY131476A true MY131476A (en) 2007-08-30

Family

ID=33549064

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20042598A MY131476A (en) 2003-06-30 2004-06-30 Gas collecting device, test head and ic device testing apparatus

Country Status (9)

Country Link
US (1) US7072180B2 (cg-RX-API-DMAC7.html)
EP (1) EP1645318A4 (cg-RX-API-DMAC7.html)
JP (1) JP4275668B2 (cg-RX-API-DMAC7.html)
KR (1) KR100813125B1 (cg-RX-API-DMAC7.html)
CN (1) CN100556495C (cg-RX-API-DMAC7.html)
AU (1) AU2003246165A1 (cg-RX-API-DMAC7.html)
MY (1) MY131476A (cg-RX-API-DMAC7.html)
TW (1) TW200511923A (cg-RX-API-DMAC7.html)
WO (2) WO2005004571A1 (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4889653B2 (ja) 2005-11-17 2012-03-07 株式会社アドバンテスト デバイス実装装置、テストヘッド及び電子部品試験装置
WO2009031415A1 (ja) * 2007-09-06 2009-03-12 Advantest Corporation 電子部品冷却装置、それを備えたテストヘッド及び電子部品試験装置
DE112007003652T5 (de) * 2007-09-14 2010-11-04 Advantest Corp. Kühlmantel zum Kühlen eines elektronischen Bauelements auf einer Platte
JP4703633B2 (ja) * 2007-12-04 2011-06-15 株式会社東芝 冷却プレート構造
CN102197313B (zh) 2008-10-28 2016-05-18 爱德万测试株式会社 测试装置及电路模块
US8289039B2 (en) 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
CN103093848B (zh) * 2011-10-28 2015-12-09 原子高科股份有限公司 85Kr源的制备及回收工艺
US20160081220A1 (en) * 2014-09-15 2016-03-17 Cisco Technology, Inc. Reduction of Intake Resistance for Air Flow Enhancement
JP2016188780A (ja) * 2015-03-30 2016-11-04 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
KR20160117082A (ko) 2015-03-31 2016-10-10 최민석 인터넷 검색 시스템
US10309732B2 (en) * 2015-12-11 2019-06-04 Hanon Systems Internal degas feature for plate-fin heat exchangers
JP7412277B2 (ja) * 2020-06-02 2024-01-12 東京エレクトロン株式会社 検査装置及び検査方法
CN112015253A (zh) * 2020-09-14 2020-12-01 深圳比特微电子科技有限公司 一种液冷板散热器和计算设备
CN114705972B (zh) * 2022-05-06 2023-05-09 中国软件评测中心(工业和信息化部软件与集成电路促进中心) 一种集成电路性能测试装置及其测试方法
US20240084821A1 (en) * 2022-09-13 2024-03-14 Us Hybrid Corporation Self-priming cooling jacket
TWI891269B (zh) * 2024-03-05 2025-07-21 英業達股份有限公司 電路板測試系統與電路板測試裝置

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1849196A (en) * 1930-06-27 1932-03-15 Bengt E Meurk Apparatus for separating air from water
US2924438A (en) * 1953-04-14 1960-02-09 Kramer Trenton Co Header construction for heating elements
US2841127A (en) * 1955-02-16 1958-07-01 White Motor Co Cooling system
US3139073A (en) * 1960-04-29 1964-06-30 Ford Motor Co Cooling system
US3132634A (en) * 1962-09-10 1964-05-12 Charles R Butler Cooling system for internal combustion engines
US3601181A (en) * 1970-03-09 1971-08-24 Saf Gard Products Inc Method and apparatus for purging air from internal combustion engine cooling systems
US3939901A (en) * 1973-04-19 1976-02-24 White Motor Corporation Method and apparatus for cooling and deaerating internal combustion engine coolant
US3989103A (en) * 1973-04-19 1976-11-02 White Motor Corporation Method and apparatus for cooling and deaerating internal combustion engine coolant
US4006775A (en) * 1974-03-07 1977-02-08 Avrea Walter C Automatic positive anti-aeration system for engine cooling system
US4047561A (en) * 1974-10-18 1977-09-13 General Electric Company Cooling liquid de-gassing system
US4785874A (en) * 1982-04-29 1988-11-22 Avrea Walter C Method and apparatus for continuously purging gaseous matter from the cooling system of an internal combustion engine
US4712609A (en) * 1984-11-21 1987-12-15 Iversen Arthur H Heat sink structure
JPS61222242A (ja) * 1985-03-28 1986-10-02 Fujitsu Ltd 冷却装置
US4776390A (en) * 1985-09-24 1988-10-11 Cummins Engine Company, Inc. Venting filler cap
EP0257111A1 (de) * 1986-08-14 1988-03-02 AURORA Konrad G. Schulz GmbH & Co Wärmetauscher für den Kühlkreislauf von Brennkraftmaschinen
JPH0534113Y2 (cg-RX-API-DMAC7.html) * 1987-07-29 1993-08-30
US4892140A (en) * 1988-11-21 1990-01-09 Honovich Tito D Condenser vent siphon line
JP2690585B2 (ja) * 1990-02-14 1997-12-10 富士通株式会社 半導体素子の冷却構造
JP2669924B2 (ja) * 1990-05-18 1997-10-29 富士通株式会社 浸漬冷却装置
JPH04243175A (ja) * 1991-01-17 1992-08-31 Nippon Denki Laser Kiki Eng Kk 冷却装置
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
US6067712A (en) * 1993-12-15 2000-05-30 Olin Corporation Heat exchange tube with embossed enhancement
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
JP3424717B2 (ja) * 1996-08-06 2003-07-07 株式会社アドバンテスト 発熱素子実装半導体装置
MY115676A (en) * 1996-08-06 2003-08-30 Advantest Corp Printed circuit board with electronic devices mounted thereon
US5810074A (en) * 1996-09-13 1998-09-22 American Standard Inc. Serial heat exchanger and cascade circuitry
US5920457A (en) * 1996-09-25 1999-07-06 International Business Machines Corporation Apparatus for cooling electronic devices using a flexible coolant conduit
US6079481A (en) * 1997-01-23 2000-06-27 Ail Research, Inc Thermal storage system
US6078187A (en) * 1997-05-23 2000-06-20 Credence Systems Corporation Hemispherical test head for integrated circuit tester employing radially distributed circuit cards
US6135067A (en) * 1998-08-21 2000-10-24 Uview Ultraviolet Systems, Inc. System removing entrapped gas from an engine cooling system
US6019171A (en) * 1998-11-18 2000-02-01 General Motors Corporation Down flow, two pass radiator with automatic air venting means
US6568466B2 (en) * 2000-06-23 2003-05-27 Andrew Lowenstein Heat exchange assembly
JP2002280507A (ja) * 2001-03-19 2002-09-27 Advantest Corp 発熱素子冷却装置および発熱素子実装装置
CA2383856A1 (en) * 2001-04-27 2002-10-27 Bombardier, Inc. Fluid reservoir
US6421240B1 (en) * 2001-04-30 2002-07-16 Hewlett-Packard Company Cooling arrangement for high performance electronic components
US6587343B2 (en) * 2001-08-29 2003-07-01 Sun Microsystems, Inc. Water-cooled system and method for cooling electronic components

Also Published As

Publication number Publication date
JP4275668B2 (ja) 2009-06-10
JPWO2005002294A1 (ja) 2006-08-10
KR100813125B1 (ko) 2008-03-17
US20050056102A1 (en) 2005-03-17
CN100556495C (zh) 2009-11-04
AU2003246165A1 (en) 2005-01-21
EP1645318A4 (en) 2009-05-13
TWI353211B (cg-RX-API-DMAC7.html) 2011-11-21
TW200511923A (en) 2005-03-16
WO2005002294A3 (ja) 2005-03-03
EP1645318A2 (en) 2006-04-12
WO2005002294A2 (ja) 2005-01-06
CN1812826A (zh) 2006-08-02
US7072180B2 (en) 2006-07-04
KR20060023569A (ko) 2006-03-14
WO2005004571A1 (ja) 2005-01-13

Similar Documents

Publication Publication Date Title
MY131476A (en) Gas collecting device, test head and ic device testing apparatus
US10520528B2 (en) Dew resistant module for test socket and electronic component testing device having the same
ATE426919T1 (de) Verfahren, system und gerat zur kuhlung integrierter hochleistungsvorrichtungen
EP1022085A3 (en) Power supply with obliquely impinging airflow
ATE422711T1 (de) Vorrichtung zur kühlung eines bauteiles
DE602007007061D1 (de) Temperatursteuerungsvorrichtung sowie verwaltungsvorrichtung, system und verfahren dafür
TW200621140A (en) Memory cooler
WO2005002294A1 (ja) 気体回収装置、テストヘッドおよびｉｃデバイス試験装置
TW200721341A (en) Vertical probe card and air cooled probe head system
US6628132B2 (en) Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques
EA200802225A1 (ru) Способ управления металлической полосой в печи термической обработки
ATE375484T1 (de) Vorrichtung und verfahren zur rückkühlung von kühlmitteln oder rückkühlmedien oder zur kältegewinnung
TW200725158A (en) Cooling device for use with a projection apparatus
ATE293349T1 (de) Kühlvorrichtung für eine elektrische und/oder elektronische einheit
TW200618722A (en) Electronic device having heat-dissipating structure for socket
GB2462353A (en) Sample analyser for trace detection
FI20055029A0 (fi) Elektroniikkalaitteen jäähdytyslaitteisto
TW200732680A (en) Device-mounted apparatus, test head, and electronic component testing apparatus
TW200735260A (en) Wafer holder, and wafer prober and semiconductor manufacturing apparatus provided therewith
DK1030279T3 (da) Fremgangsmåde til detektion af opståelse af brand og en aspirativ branderkendelsesindretning til udövelse af fremgangsmåden
DE10359064B3 (de) Kühlungseinrichtung zur Kühlung elektronischer Bauteile in einem Kraftfahrzeug
CN217511883U (zh) 一种复合盐雾试验箱加热装置及复合盐雾试验箱
KR100202675B1 (ko) 반도체 패키지의 냉각장치
EP1107657A3 (en) Means for dissipating heat in electrical apparatus
WO2011033067A3 (de) Kühleinrichtung in einer gleichrichtereinrichtung einer elektrischen maschine