TWI353211B - - Google Patents

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Publication number
TWI353211B
TWI353211B TW093118507A TW93118507A TWI353211B TW I353211 B TWI353211 B TW I353211B TW 093118507 A TW093118507 A TW 093118507A TW 93118507 A TW93118507 A TW 93118507A TW I353211 B TWI353211 B TW I353211B
Authority
TW
Taiwan
Prior art keywords
coolant
gas
heat generating
substrate
test
Prior art date
Application number
TW093118507A
Other languages
English (en)
Chinese (zh)
Other versions
TW200511923A (en
Inventor
Nishiura Koei
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200511923A publication Critical patent/TW200511923A/zh
Application granted granted Critical
Publication of TWI353211B publication Critical patent/TWI353211B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW093118507A 2003-06-30 2004-06-25 Gas collection device, test connector, and testing apparatus for IC device TW200511923A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/008299 WO2005004571A1 (ja) 2003-06-30 2003-06-30 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド

Publications (2)

Publication Number Publication Date
TW200511923A TW200511923A (en) 2005-03-16
TWI353211B true TWI353211B (cg-RX-API-DMAC7.html) 2011-11-21

Family

ID=33549064

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118507A TW200511923A (en) 2003-06-30 2004-06-25 Gas collection device, test connector, and testing apparatus for IC device

Country Status (9)

Country Link
US (1) US7072180B2 (cg-RX-API-DMAC7.html)
EP (1) EP1645318A4 (cg-RX-API-DMAC7.html)
JP (1) JP4275668B2 (cg-RX-API-DMAC7.html)
KR (1) KR100813125B1 (cg-RX-API-DMAC7.html)
CN (1) CN100556495C (cg-RX-API-DMAC7.html)
AU (1) AU2003246165A1 (cg-RX-API-DMAC7.html)
MY (1) MY131476A (cg-RX-API-DMAC7.html)
TW (1) TW200511923A (cg-RX-API-DMAC7.html)
WO (2) WO2005004571A1 (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4889653B2 (ja) 2005-11-17 2012-03-07 株式会社アドバンテスト デバイス実装装置、テストヘッド及び電子部品試験装置
WO2009031415A1 (ja) * 2007-09-06 2009-03-12 Advantest Corporation 電子部品冷却装置、それを備えたテストヘッド及び電子部品試験装置
DE112007003652T5 (de) * 2007-09-14 2010-11-04 Advantest Corp. Kühlmantel zum Kühlen eines elektronischen Bauelements auf einer Platte
JP4703633B2 (ja) * 2007-12-04 2011-06-15 株式会社東芝 冷却プレート構造
CN102197313B (zh) 2008-10-28 2016-05-18 爱德万测试株式会社 测试装置及电路模块
US8289039B2 (en) 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
CN103093848B (zh) * 2011-10-28 2015-12-09 原子高科股份有限公司 85Kr源的制备及回收工艺
US20160081220A1 (en) * 2014-09-15 2016-03-17 Cisco Technology, Inc. Reduction of Intake Resistance for Air Flow Enhancement
JP2016188780A (ja) * 2015-03-30 2016-11-04 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
KR20160117082A (ko) 2015-03-31 2016-10-10 최민석 인터넷 검색 시스템
US10309732B2 (en) * 2015-12-11 2019-06-04 Hanon Systems Internal degas feature for plate-fin heat exchangers
JP7412277B2 (ja) * 2020-06-02 2024-01-12 東京エレクトロン株式会社 検査装置及び検査方法
CN112015253A (zh) * 2020-09-14 2020-12-01 深圳比特微电子科技有限公司 一种液冷板散热器和计算设备
CN114705972B (zh) * 2022-05-06 2023-05-09 中国软件评测中心(工业和信息化部软件与集成电路促进中心) 一种集成电路性能测试装置及其测试方法
US20240084821A1 (en) * 2022-09-13 2024-03-14 Us Hybrid Corporation Self-priming cooling jacket
TWI891269B (zh) * 2024-03-05 2025-07-21 英業達股份有限公司 電路板測試系統與電路板測試裝置

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JP3424717B2 (ja) * 1996-08-06 2003-07-07 株式会社アドバンテスト 発熱素子実装半導体装置
MY115676A (en) * 1996-08-06 2003-08-30 Advantest Corp Printed circuit board with electronic devices mounted thereon
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US5920457A (en) * 1996-09-25 1999-07-06 International Business Machines Corporation Apparatus for cooling electronic devices using a flexible coolant conduit
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Also Published As

Publication number Publication date
JP4275668B2 (ja) 2009-06-10
JPWO2005002294A1 (ja) 2006-08-10
KR100813125B1 (ko) 2008-03-17
US20050056102A1 (en) 2005-03-17
CN100556495C (zh) 2009-11-04
AU2003246165A1 (en) 2005-01-21
EP1645318A4 (en) 2009-05-13
TW200511923A (en) 2005-03-16
WO2005002294A3 (ja) 2005-03-03
EP1645318A2 (en) 2006-04-12
MY131476A (en) 2007-08-30
WO2005002294A2 (ja) 2005-01-06
CN1812826A (zh) 2006-08-02
US7072180B2 (en) 2006-07-04
KR20060023569A (ko) 2006-03-14
WO2005004571A1 (ja) 2005-01-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees