JP4267595B2 - Acf供給装置 - Google Patents
Acf供給装置 Download PDFInfo
- Publication number
- JP4267595B2 JP4267595B2 JP2005187152A JP2005187152A JP4267595B2 JP 4267595 B2 JP4267595 B2 JP 4267595B2 JP 2005187152 A JP2005187152 A JP 2005187152A JP 2005187152 A JP2005187152 A JP 2005187152A JP 4267595 B2 JP4267595 B2 JP 4267595B2
- Authority
- JP
- Japan
- Prior art keywords
- acf
- unit
- supply
- reel
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0003—Apparatus or processes specially adapted for manufacturing conductors or cables for feeding conductors or cables
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Replacement Of Web Rolls (AREA)
Description
11 ゲートパッド
12 データパッド
13 ACF
20 TABパッケージ
21 駆動チップ
22 入力リード
23 出力リード
110,210,310 供給部
111,211,311 ACFリール
112,312 リール据置台
113,313 ACFテープ
113a,313a ACF支持層
114,314 ローラ
120,320 ボンディング部
121,321 ステージ
122,322 プレス
130,330 回収部
131 回収用リール
132 リール据置台
133 ローラ
140,340 キャリア
215 装着部材
216 回転部材
217 引張用レバー
315 把持部
316 移送ガイド
317,332 アイドルローラ
318,333 ガイド
331 接触ローラ
334 ガイドローラ
Claims (8)
- ACF層とACF支持層からなるACFテープを供給する供給部と、前記供給部から前記ACFテープを引き出して前記ACF層を作業台上にボンディングさせるボンディング部と、前記ACF層が分離された前記ACF支持層を回収する回収部とを含むACF供給装置において、
前記供給部は、ACFテープを巻き取る複数のACFリールを同一平面内で回転可能に支持する複数のリール据置台と、
前記複数のリール据置台のうちのいずれか一つに据え置かれたACFリールから引き出されたACFテープの引き出し端部を、所定の供給待機場所に位置固定させる把持手段と、
前記供給待機場所に位置する前記ACFテープの引き出し端部を把持した後、前記作業台に沿って移動して前記回収部に引き出すキャリアとを含むことを特徴とするACF供給装置。 - 前記複数のリール据置台は垂直面上に上下に配置されることを特徴とする請求項1に記載のACF供給装置。
- 前記把持手段は、前記供給待機場所に固定されて設けられ、把持部と、前記把持部を把持駆動する駆動部と、前記駆動部を制御する制御部とを含むことを特徴とする請求項1に記載のACF供給装置。
- 前記把持手段は、前記供給待機場所に連結される移送ガイドと、前記移送ガイド上で移送される把持部と、前記把持部の移送及び把持を駆動する駆動部と、前記駆動部を制御する制御部とを含むことを特徴とする請求項1に記載のACF供給装置。
- 前記回収部は、前記ボンディング部から移送されるACF支持層を引き寄せるために、互いに噛み合って回転する一対の接触ローラと、前記一対の接触ローラを駆動する駆動部と、前記駆動部を制御する制御部とを含むことを特徴とする請求項1に記載のACF供給装置。
- 前記ACFリールから引き出される前記ACFテープと前記回収部に回収される前記ACF支持層に、一定の大きさの張力を加える張力維持手段をさらに含むことを特徴とする請求項1に記載のACF供給装置。
- 前記張力維持手段は、前記ACFテープ及び前記ACF支持層を各々一定の力で加圧する複数のアイドルローラを含むことを特徴とする請求項6に記載のACF供給装置。
- 前記複数のアイドルローラは、各々自重によって前記ACFテープ及び前記ACF支持層を垂直下方に加圧することを特徴とする請求項7に記載のACF供給装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040098090A KR100633159B1 (ko) | 2004-11-26 | 2004-11-26 | Acf공급장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006156940A JP2006156940A (ja) | 2006-06-15 |
JP4267595B2 true JP4267595B2 (ja) | 2009-05-27 |
Family
ID=36634792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005187152A Expired - Fee Related JP4267595B2 (ja) | 2004-11-26 | 2005-06-27 | Acf供給装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4267595B2 (ja) |
KR (1) | KR100633159B1 (ja) |
CN (1) | CN100414417C (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100832774B1 (ko) * | 2006-09-07 | 2008-05-27 | 주식회사 에스에프에이 | 보호필름 박리헤드 유닛 및 그를 구비한 편광판 부착장치 |
CN101315500B (zh) * | 2007-05-29 | 2010-08-18 | 纳瑞精密设备有限公司 | 用于连续地供给和收集各向异性导电薄膜的装置以及具有该装置的粘接设备 |
JP4392766B2 (ja) * | 2007-08-21 | 2010-01-06 | 株式会社日立ハイテクノロジーズ | Acf貼り付け装置 |
KR100909487B1 (ko) * | 2008-01-31 | 2009-07-28 | 주식회사 나래나노텍 | 전원 공급 필름 상에 이방성 전도성 필름을 공급 및본딩하기 위한 장치 및 방법, 및 이를 구비한 전원 공급필름 공급 장치 및 방법 |
JP5115460B2 (ja) * | 2008-11-28 | 2013-01-09 | パナソニック株式会社 | 異方性導電テープの貼付装置 |
KR101421450B1 (ko) * | 2009-01-19 | 2014-07-24 | 삼성테크윈 주식회사 | 테이프 릴 거치장치 |
JP2011164308A (ja) * | 2010-02-08 | 2011-08-25 | Hitachi High-Technologies Corp | Fpdモジュールの組立装置 |
JP5315273B2 (ja) * | 2010-03-19 | 2013-10-16 | 株式会社日立ハイテクノロジーズ | Fpdモジュールの組立装置 |
JP5424976B2 (ja) * | 2010-04-27 | 2014-02-26 | 株式会社日立ハイテクノロジーズ | Fpdモジュールの組立装置 |
KR101385586B1 (ko) * | 2012-01-06 | 2014-04-16 | 주식회사 에스에프에이 | 구동용 회로기판 본딩장치 |
KR101443707B1 (ko) * | 2013-07-18 | 2014-09-26 | 주식회사 에이에스티젯텍 | 연속식 acf 본딩장치 |
KR101443708B1 (ko) * | 2013-07-18 | 2014-09-26 | 주식회사 에이에스티젯텍 | Acf 공급 탈부착장치 |
CN106571331B (zh) * | 2016-10-31 | 2019-01-11 | 长春光华微电子设备工程中心有限公司 | 一种晶圆蓝膜张紧和角度调节装置 |
CN107082310B (zh) * | 2017-04-10 | 2018-07-31 | 惠科股份有限公司 | 送料回收机构和贴附装置 |
JP7049822B2 (ja) * | 2017-12-18 | 2022-04-07 | 株式会社ディスコ | テープ貼着装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5643395A (en) * | 1992-09-01 | 1997-07-01 | Cms Gilbreth Packaging Systems, Inc. | Automatic splicing apparatus |
JP3543676B2 (ja) * | 1999-06-02 | 2004-07-14 | セイコーエプソン株式会社 | マルチチップの実装構造及びその実装構造の製造方法、ならびに電気光学装置及び電子機器 |
JP3588444B2 (ja) * | 2000-10-26 | 2004-11-10 | 松下電器産業株式会社 | 電子部品、部品実装装置及び部品実装方法 |
KR20010099068A (ko) * | 2001-08-23 | 2001-11-09 | 안동철 | Acf본딩기의 이송 필름 박리장치 |
JP3852378B2 (ja) * | 2002-07-09 | 2006-11-29 | 株式会社日立ハイテクノロジーズ | Acf供給装置及びacf供給方法 |
-
2004
- 2004-11-26 KR KR1020040098090A patent/KR100633159B1/ko not_active IP Right Cessation
-
2005
- 2005-06-27 JP JP2005187152A patent/JP4267595B2/ja not_active Expired - Fee Related
- 2005-09-20 CN CNB2005101099532A patent/CN100414417C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006156940A (ja) | 2006-06-15 |
KR100633159B1 (ko) | 2006-10-11 |
KR20060059004A (ko) | 2006-06-01 |
CN100414417C (zh) | 2008-08-27 |
CN1779539A (zh) | 2006-05-31 |
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