JP7049822B2 - テープ貼着装置 - Google Patents
テープ貼着装置 Download PDFInfo
- Publication number
- JP7049822B2 JP7049822B2 JP2017241724A JP2017241724A JP7049822B2 JP 7049822 B2 JP7049822 B2 JP 7049822B2 JP 2017241724 A JP2017241724 A JP 2017241724A JP 2017241724 A JP2017241724 A JP 2017241724A JP 7049822 B2 JP7049822 B2 JP 7049822B2
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- JP
- Japan
- Prior art keywords
- tape
- roll
- protective film
- adhesive
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/68395—Separation by peeling using peeling wheel
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Replacement Of Web Rolls (AREA)
- Package Closures (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Basic Packing Technique (AREA)
Description
また、本発明によれば、切断された残りのテープセットをロールテープ支持部で巻き取るため、テープセットを無駄にすることなく、有効に利用することができる。
また、本発明によれば、切断された残りのテープセット3,3Aをロールテープ支持部20,20Aで巻き取ることから、テープセット3,3Aを無駄にせず、有効に利用することができる。
4:粘着テープ 4a:基材 4b:粘着剤層 5:保護フィルム
10:テーブル 11:フレーム支持部 12:支持台 13:テーブル移動手段
14:ベース 15:移動基台
20,20A:ロールテープ支持部 21,21A:ロールテープ支持手段
210:枠体 211:開口 22:回転手段 23:2次元コード
24:先端検出部 25:ガイドローラ 26:ガイドローラ
30:第1のローラユニット 31:駆動ローラ 32:従動ローラ 33:移動機構
34:ガイドレール 35:移動部
40:位置づけ手段 41:支持部材 42:第1の挟持部 43:回転機構
44:スライド機構 45:ベース 46:スライダ
50:貼着手段 51:貼着ローラ 52:貼着ローラ押付手段
53:ピールプレート 54:アーム部 55:押圧部
60:廃棄手段 61:巻き取り部 62:モータ 63:廃棄ボックス
70:第2のローラユニット 71:駆動ローラ 72:従動ローラ 73:移動機構
74:ガイドレール 75:移動部
80:テープセット導き手段 81:支持部材 82:第2の挟持部
83:載置台 84:逃げ溝 85:スライド機構 86:ベース 87:スライダ
90:切断手段 91:テープカッター 92:昇降機構 93:押さえ部
Claims (1)
- 開口を有するリングフレームを支持するとともに該開口に位置づけられたウェーハを支持するテーブルを備え、該テーブルに支持されたリングフレームとウェーハとに粘着テープを貼着して一体化させるテープ貼着装置であって、
予め該リングフレームに対応して成形された複数の該粘着テープが間隔を設けて帯状の保護フィルムに配設したテープセットをロール状にしたロールテープを回転可能に支持するロールテープ支持部と、
該ロールテープ支持部が2つ以上配設されたロールテープ支持手段と、
該ロールテープから引き出した該テープセットを該ロールテープ支持手段から該テーブルまで導く第1のローラユニットと、
該テーブルまで導かれた該テープセットから該粘着テープを剥離し該テーブルが支持する該リングフレームとウェーハとに該粘着テープを貼着させる貼着手段と、
該粘着テープが剥離された該保護フィルムを巻き取り廃棄する廃棄手段と、
該粘着テープが剥離された該保護フィルムを該テーブルから該廃棄手段まで導く第2のローラユニットと、
該ロールテープ支持手段と該第1のローラユニットとの間に配設され、2つ以上の該ロールテープ支持部に支持された該ロールテープのいずれかを選択して該テープセットの端部を把持して引き出し該テーブルに位置づける位置づけ手段と、
該位置づけ手段が位置づけた該テープセットの端部を把持して該第2のローラユニットを通して該廃棄手段まで導くテープセット導き手段と、
該テーブルと該廃棄手段との間に配設され該粘着テープが剥離された該保護フィルムを切断する切断手段と、を少なくとも備え、
該ロールテープ支持手段は、該テープセットの先端を検出する先端検出部を備え、
新たに選択された該テープセットを該位置づけ手段によって該ロールテープ支持手段から引き出す際に、該切断手段によって現在使用されている該テープセットの該保護フィルムを切断し該廃棄手段が巻き取って廃棄するとともに、現在使用している該ロールテープ支持部を作動させ該テープセットを巻き取り、該先端検出部が該保護フィルムを検出すると、該ロールテープ支持部の回転を停止させる、
テープ貼着装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017241724A JP7049822B2 (ja) | 2017-12-18 | 2017-12-18 | テープ貼着装置 |
KR1020180155875A KR102640590B1 (ko) | 2017-12-18 | 2018-12-06 | 테이프 접착 장치 |
CN201811530912.4A CN110010540B (zh) | 2017-12-18 | 2018-12-14 | 带粘贴装置 |
TW107145418A TWI779140B (zh) | 2017-12-18 | 2018-12-17 | 膠帶黏貼裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017241724A JP7049822B2 (ja) | 2017-12-18 | 2017-12-18 | テープ貼着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019110189A JP2019110189A (ja) | 2019-07-04 |
JP7049822B2 true JP7049822B2 (ja) | 2022-04-07 |
Family
ID=67104881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017241724A Active JP7049822B2 (ja) | 2017-12-18 | 2017-12-18 | テープ貼着装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7049822B2 (ja) |
KR (1) | KR102640590B1 (ja) |
CN (1) | CN110010540B (ja) |
TW (1) | TWI779140B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7351703B2 (ja) * | 2019-10-09 | 2023-09-27 | 株式会社ディスコ | テープマウンタ |
JP7544576B2 (ja) | 2020-11-26 | 2024-09-03 | 株式会社ディスコ | テープ剥離装置 |
JP2022103995A (ja) | 2020-12-28 | 2022-07-08 | 株式会社ディスコ | テープマウンタ |
KR102663485B1 (ko) * | 2021-11-16 | 2024-05-03 | 세메스 주식회사 | 필름 박리 장치, 및 이를 포함하는 디라미네이션 모듈 및 반도체 제조 설비 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020092621A1 (en) | 1998-09-03 | 2002-07-18 | Hiroshi Suzuki | Adhesive tape piece sticking device |
JP2006341989A (ja) | 2005-06-10 | 2006-12-21 | Toyo Network Systems Co Ltd | 印刷装置、及び自動券売機 |
JP2014075382A (ja) | 2012-10-02 | 2014-04-24 | Lintec Corp | シート貼付装置およびシート貼付方法 |
JP2015056613A (ja) | 2013-09-13 | 2015-03-23 | リンテック株式会社 | シート貼付装置および貼付方法 |
JP2016008104A (ja) | 2014-06-24 | 2016-01-18 | 株式会社ディスコ | テープ貼着装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57159391A (en) * | 1981-03-28 | 1982-10-01 | Nippon Signal Co Ltd | Residual paper disposal for ticketing apparatus |
KR100633159B1 (ko) * | 2004-11-26 | 2006-10-11 | 삼성전자주식회사 | Acf공급장치 |
JP4836827B2 (ja) * | 2007-02-22 | 2011-12-14 | 日東電工株式会社 | 粘着テープ貼付け装置 |
JP4868591B2 (ja) * | 2007-02-23 | 2012-02-01 | 株式会社タカトリ | 基板へのテープの貼付方法及び装置 |
JP4995796B2 (ja) * | 2008-09-30 | 2012-08-08 | 日東電工株式会社 | 粘着テープ貼付け方法および粘着テープ貼付け装置 |
JP2014027171A (ja) | 2012-07-27 | 2014-02-06 | Lintec Corp | シート貼付装置およびシート貼付方法 |
-
2017
- 2017-12-18 JP JP2017241724A patent/JP7049822B2/ja active Active
-
2018
- 2018-12-06 KR KR1020180155875A patent/KR102640590B1/ko active IP Right Grant
- 2018-12-14 CN CN201811530912.4A patent/CN110010540B/zh active Active
- 2018-12-17 TW TW107145418A patent/TWI779140B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020092621A1 (en) | 1998-09-03 | 2002-07-18 | Hiroshi Suzuki | Adhesive tape piece sticking device |
JP2006341989A (ja) | 2005-06-10 | 2006-12-21 | Toyo Network Systems Co Ltd | 印刷装置、及び自動券売機 |
JP2014075382A (ja) | 2012-10-02 | 2014-04-24 | Lintec Corp | シート貼付装置およびシート貼付方法 |
JP2015056613A (ja) | 2013-09-13 | 2015-03-23 | リンテック株式会社 | シート貼付装置および貼付方法 |
JP2016008104A (ja) | 2014-06-24 | 2016-01-18 | 株式会社ディスコ | テープ貼着装置 |
Also Published As
Publication number | Publication date |
---|---|
CN110010540B (zh) | 2023-10-03 |
KR102640590B1 (ko) | 2024-02-23 |
CN110010540A (zh) | 2019-07-12 |
KR20190073269A (ko) | 2019-06-26 |
TW201927674A (zh) | 2019-07-16 |
TWI779140B (zh) | 2022-10-01 |
JP2019110189A (ja) | 2019-07-04 |
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