JP4258887B2 - 熱可塑性樹脂組成物およびその製造方法 - Google Patents

熱可塑性樹脂組成物およびその製造方法 Download PDF

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Publication number
JP4258887B2
JP4258887B2 JP12079899A JP12079899A JP4258887B2 JP 4258887 B2 JP4258887 B2 JP 4258887B2 JP 12079899 A JP12079899 A JP 12079899A JP 12079899 A JP12079899 A JP 12079899A JP 4258887 B2 JP4258887 B2 JP 4258887B2
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Japan
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liquid crystalline
resin
melt viscosity
parts
crystalline resin
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Expired - Fee Related
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JP12079899A
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Japanese (ja)
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JP2000313812A (ja
JP2000313812A5 (https=
Inventor
浩司 立川
秀之 梅津
芳樹 真壁
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Toray Industries Inc
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Toray Industries Inc
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Priority to JP12079899A priority Critical patent/JP4258887B2/ja
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JP12079899A 1999-04-27 1999-04-27 熱可塑性樹脂組成物およびその製造方法 Expired - Fee Related JP4258887B2 (ja)

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JP12079899A JP4258887B2 (ja) 1999-04-27 1999-04-27 熱可塑性樹脂組成物およびその製造方法

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JP12079899A JP4258887B2 (ja) 1999-04-27 1999-04-27 熱可塑性樹脂組成物およびその製造方法

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JP2000313812A JP2000313812A (ja) 2000-11-14
JP2000313812A5 JP2000313812A5 (https=) 2006-06-15
JP4258887B2 true JP4258887B2 (ja) 2009-04-30

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JP12079899A Expired - Fee Related JP4258887B2 (ja) 1999-04-27 1999-04-27 熱可塑性樹脂組成物およびその製造方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12104010B2 (en) 2021-02-04 2024-10-01 Ticona Llc Polymer composition for an electric circuit protection device

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3530829B2 (ja) 2001-03-12 2004-05-24 日本ピラー工業株式会社 電子部品用フッ素樹脂組成物
JP4901015B2 (ja) * 2001-04-20 2012-03-21 旭化成ケミカルズ株式会社 ポリフェニレンエーテル系樹脂組成物
JP4517554B2 (ja) * 2001-08-02 2010-08-04 東レ株式会社 熱可塑性樹脂組成物および成形品ならびにシャーシまたは筐体
JP2003073530A (ja) * 2001-09-05 2003-03-12 Asahi Kasei Corp 樹脂組成物
JP2004083065A (ja) * 2002-08-27 2004-03-18 Sumitomo Bakelite Co Ltd 電子部品搬送用容器及びシート
JP4194888B2 (ja) * 2003-06-16 2008-12-10 日本ポリオレフィン株式会社 複合成形品およびその製造方法
JP4498810B2 (ja) * 2004-04-16 2010-07-07 ポリプラスチックス株式会社 液晶樹脂組成物
JP2006182877A (ja) * 2004-12-27 2006-07-13 Nippon Petrochemicals Co Ltd 摺動部材
JP4815875B2 (ja) * 2005-05-25 2011-11-16 Ｊｓｒ株式会社 環状オレフィン系樹脂組成物およびその成形体
WO2007144963A1 (ja) * 2006-06-13 2007-12-21 Polyplastics Co., Ltd. 熱可塑性樹脂組成物
CN101585963B (zh) * 2009-06-10 2011-09-21 惠州市沃特新材料有限公司 一种彩色导电耐高温模塑料及其制备方法
KR102490028B1 (ko) 2017-02-24 2023-01-18 삼성전자주식회사 유무기 복합 조성물, 및 이를 포함하는 성형품 및 광학부품
CN111741841B (zh) 2018-02-20 2023-05-30 提克纳有限责任公司 导热聚合物组合物
JP2018119162A (ja) * 2018-04-18 2018-08-02 旭化成株式会社 成形体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12104010B2 (en) 2021-02-04 2024-10-01 Ticona Llc Polymer composition for an electric circuit protection device

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JP2000313812A (ja) 2000-11-14

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