JP4250949B2 - 発光装置及びその製造方法 - Google Patents

発光装置及びその製造方法 Download PDF

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Publication number
JP4250949B2
JP4250949B2 JP2002319485A JP2002319485A JP4250949B2 JP 4250949 B2 JP4250949 B2 JP 4250949B2 JP 2002319485 A JP2002319485 A JP 2002319485A JP 2002319485 A JP2002319485 A JP 2002319485A JP 4250949 B2 JP4250949 B2 JP 4250949B2
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Japan
Prior art keywords
light
light emitting
epoxy resin
emitting device
emitting element
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Expired - Lifetime
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JP2002319485A
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English (en)
Japanese (ja)
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JP2003224305A (ja
JP2003224305A5 (https=
Inventor
雅信 佐藤
智也 月岡
雅史 蔵本
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Nichia Corp
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Nichia Corp
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Priority to JP2002319485A priority Critical patent/JP4250949B2/ja
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Publication of JP2003224305A5 publication Critical patent/JP2003224305A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2002319485A 2001-11-01 2002-11-01 発光装置及びその製造方法 Expired - Lifetime JP4250949B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002319485A JP4250949B2 (ja) 2001-11-01 2002-11-01 発光装置及びその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-336944 2001-11-01
JP2001336944 2001-11-01
JP2002319485A JP4250949B2 (ja) 2001-11-01 2002-11-01 発光装置及びその製造方法

Publications (3)

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JP2003224305A JP2003224305A (ja) 2003-08-08
JP2003224305A5 JP2003224305A5 (https=) 2005-12-22
JP4250949B2 true JP4250949B2 (ja) 2009-04-08

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Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4337574B2 (ja) * 2003-09-25 2009-09-30 日亜化学工業株式会社 発光装置およびその形成方法
JP5262374B2 (ja) * 2004-11-30 2013-08-14 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2006193570A (ja) * 2005-01-12 2006-07-27 Stanley Electric Co Ltd 熱硬化性樹脂組成物、該組成物を熱硬化してなる透光性硬化物、該硬化物で封止された発光ダイオード
KR101139891B1 (ko) * 2005-01-31 2012-04-27 렌슬러 폴리테크닉 인스티튜트 확산 반사면을 구비한 발광 다이오드 소자
JP4557824B2 (ja) * 2005-07-04 2010-10-06 株式会社東芝 発光装置およびその製造方法
CN101268559B (zh) * 2005-08-04 2010-11-17 日亚化学工业株式会社 发光装置及其制造方法以及成形体及密封构件
CN101283016B (zh) * 2005-08-04 2011-05-11 信越化学工业株式会社 热固性环氧树脂组合物及半导体装置
WO2007135707A1 (ja) 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP5135735B2 (ja) * 2006-08-25 2013-02-06 日亜化学工業株式会社 発光装置
JP2008144127A (ja) * 2006-11-15 2008-06-26 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体素子搭載用基板、光半導体装置およびこれらの製造方法
CN102408543B (zh) * 2006-11-15 2014-10-29 日立化成工业株式会社 光反射用热固化性树脂组合物、用该组合物的光半导体元件搭载用基板及其光半导体装置
JP5168152B2 (ja) * 2006-12-28 2013-03-21 日亜化学工業株式会社 発光装置
JP5380774B2 (ja) 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
JP5470680B2 (ja) 2007-02-06 2014-04-16 日亜化学工業株式会社 発光装置及びその製造方法並びに成形体
KR101309765B1 (ko) * 2007-03-29 2013-09-23 서울반도체 주식회사 색 편차를 줄인 발광 다이오드 패키지
JP5207658B2 (ja) 2007-05-17 2013-06-12 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物およびその硬化体ならびにそれを用いた光半導体装置
JP4623322B2 (ja) 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
JP5463447B2 (ja) 2008-01-18 2014-04-09 三洋電機株式会社 発光装置及びそれを備えた灯具
JP4678415B2 (ja) 2008-03-18 2011-04-27 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース
JP2010021533A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2010018786A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP5218298B2 (ja) 2008-07-02 2013-06-26 信越化学工業株式会社 熱硬化性シリコーン樹脂−エポキシ樹脂組成物及び当該樹脂で成形したプレモールドパッケージ
JP5182512B2 (ja) 2008-12-15 2013-04-17 日亜化学工業株式会社 熱硬化性エポキシ樹脂組成物及び半導体装置
JP5488326B2 (ja) 2009-09-01 2014-05-14 信越化学工業株式会社 光半導体装置用白色熱硬化性シリコーンエポキシ混成樹脂組成物及びその製造方法並びにプレモールドパッケージ及びｌｅｄ装置
JP5246880B2 (ja) * 2009-09-15 2013-07-24 信越化学工業株式会社 アンダーフィル材組成物及び光半導体装置
CN102804430B (zh) 2010-01-19 2015-11-25 Lg伊诺特有限公司 封装结构及其制造方法
JP5650097B2 (ja) 2011-11-09 2015-01-07 信越化学工業株式会社 熱硬化性エポキシ樹脂組成物及び光半導体装置
KR101881604B1 (ko) 2011-11-21 2018-07-24 신에쓰 가가꾸 고교 가부시끼가이샤 Ｌｅｄ 리플렉터로서 유용한 백색 열경화성 실리콘 수지 조성물 및 상기 조성물을 이용한 광반도체 장치
JP5376014B2 (ja) * 2012-07-03 2013-12-25 日立化成株式会社 光反射用熱硬化性樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。
JP5725115B2 (ja) * 2013-09-25 2015-05-27 ウシオ電機株式会社 発光装置及びそれを備えた灯具
JP6194853B2 (ja) 2014-06-06 2017-09-13 信越化学工業株式会社 光半導体装置用白色熱硬化性シリコーン樹脂組成物、及び光半導体素子搭載用ケース
JP6311626B2 (ja) 2015-02-20 2018-04-18 信越化学工業株式会社 Ｌｅｄリフレクター用白色熱硬化性エポキシ樹脂組成物
JP6809518B2 (ja) * 2018-08-28 2021-01-06 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP7054019B2 (ja) * 2020-04-27 2022-04-13 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法

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