JP4243064B2 - マイクロメカニカル素子およびその製法 - Google Patents

マイクロメカニカル素子およびその製法 Download PDF

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Publication number
JP4243064B2
JP4243064B2 JP2002024155A JP2002024155A JP4243064B2 JP 4243064 B2 JP4243064 B2 JP 4243064B2 JP 2002024155 A JP2002024155 A JP 2002024155A JP 2002024155 A JP2002024155 A JP 2002024155A JP 4243064 B2 JP4243064 B2 JP 4243064B2
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Japan
Prior art keywords
layer
substrate
cap
bonding
functional structure
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Expired - Fee Related
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JP2002024155A
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English (en)
Japanese (ja)
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JP2002273699A (ja
JP2002273699A5 (enExample
Inventor
フィッシャー フランク
ハイン ペーター
グラフ エックハルト
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Robert Bosch GmbH
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Robert Bosch GmbH
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Publication of JP2002273699A5 publication Critical patent/JP2002273699A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Laminated Bodies (AREA)
JP2002024155A 2001-02-03 2002-01-31 マイクロメカニカル素子およびその製法 Expired - Fee Related JP4243064B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10104868A DE10104868A1 (de) 2001-02-03 2001-02-03 Mikromechanisches Bauelement sowie ein Verfahren zur Herstellung eines mikromechanischen Bauelements
DE10104868.8 2001-02-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008121530A Division JP2008183717A (ja) 2001-02-03 2008-05-07 マイクロメカニカル素子およびその製法

Publications (3)

Publication Number Publication Date
JP2002273699A JP2002273699A (ja) 2002-09-25
JP2002273699A5 JP2002273699A5 (enExample) 2005-08-18
JP4243064B2 true JP4243064B2 (ja) 2009-03-25

Family

ID=7672725

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2002024155A Expired - Fee Related JP4243064B2 (ja) 2001-02-03 2002-01-31 マイクロメカニカル素子およびその製法
JP2008121530A Pending JP2008183717A (ja) 2001-02-03 2008-05-07 マイクロメカニカル素子およびその製法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008121530A Pending JP2008183717A (ja) 2001-02-03 2008-05-07 マイクロメカニカル素子およびその製法

Country Status (4)

Country Link
US (2) US6876048B2 (enExample)
EP (3) EP1671924B1 (enExample)
JP (2) JP4243064B2 (enExample)
DE (4) DE10104868A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008183717A (ja) * 2001-02-03 2008-08-14 Robert Bosch Gmbh マイクロメカニカル素子およびその製法
JP2014122906A (ja) * 2006-05-19 2014-07-03 Robert Bosch Gmbh マイクロメカニカル素子およびマイクロメカニカル素子の製造方法

Families Citing this family (72)

* Cited by examiner, † Cited by third party
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DE10047189C1 (de) * 2000-09-23 2002-02-21 Bosch Gmbh Robert Verfahren zur Insassenklassifikation mit einer Sitzmatte im Fahrzeugsitz
TR200402634T2 (tr) * 2002-04-10 2005-10-21 Fisher&Paykel Appliances Limited Bir çamaşır yıkama cihazı
DE10231729B4 (de) * 2002-07-13 2011-08-11 Robert Bosch GmbH, 70469 Bauelement mit einer oberflächenmikromechanischen Struktur
DE10239306B4 (de) * 2002-08-27 2006-08-31 Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. Verfahren zum selektiven Verbinden von Substraten
AU2003271081A1 (en) * 2002-10-03 2004-04-23 Sharp Kabushiki Kaisha Micro movable device
US7098117B2 (en) * 2002-10-18 2006-08-29 The Regents Of The University Of Michigan Method of fabricating a package with substantially vertical feedthroughs for micromachined or MEMS devices
FR2856844B1 (fr) * 2003-06-24 2006-02-17 Commissariat Energie Atomique Circuit integre sur puce de hautes performances
US6952041B2 (en) * 2003-07-25 2005-10-04 Robert Bosch Gmbh Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
DE10347215A1 (de) 2003-10-10 2005-05-12 Bosch Gmbh Robert Mikromechanischer Sensor
FR2861497B1 (fr) 2003-10-28 2006-02-10 Soitec Silicon On Insulator Procede de transfert catastrophique d'une couche fine apres co-implantation
DE10356885B4 (de) * 2003-12-03 2005-11-03 Schott Ag Verfahren zum Gehäusen von Bauelementen und gehäustes Bauelement
GB0330010D0 (en) * 2003-12-24 2004-01-28 Cavendish Kinetics Ltd Method for containing a device and a corresponding device
US7410816B2 (en) * 2004-03-24 2008-08-12 Makarand Gore Method for forming a chamber in an electronic device and device formed thereby
WO2005104228A1 (en) * 2004-04-22 2005-11-03 Matsushita Electric Works, Ltd. Sensor device, sensor system and methods for manufacturing them
DE102004027501A1 (de) 2004-06-04 2005-12-22 Robert Bosch Gmbh Mikromechanisches Bauelement mit mehreren Kavernen und Herstellungsverfahren
JP2006043813A (ja) * 2004-08-04 2006-02-16 Denso Corp 保護膜付きマイクロシステム構造体及びその製造方法
US7416984B2 (en) * 2004-08-09 2008-08-26 Analog Devices, Inc. Method of producing a MEMS device
US7816745B2 (en) * 2005-02-25 2010-10-19 Medtronic, Inc. Wafer level hermetically sealed MEMS device
DE102005040789B4 (de) 2005-08-29 2014-12-24 Robert Bosch Gmbh Herstellungsverfahren für ein Mikromechanisches Bauelement mit anodisch gebondeter Kappe
FR2891281B1 (fr) 2005-09-28 2007-12-28 Commissariat Energie Atomique Procede de fabrication d'un element en couches minces.
DE102005053682A1 (de) * 2005-11-10 2007-05-16 Bosch Gmbh Robert Sensor, Sensorbauelement und Verfahren zur Herstellung eines Sensors
DE102005059905A1 (de) * 2005-12-15 2007-06-28 Robert Bosch Gmbh Mikromechanisches Bauelement und Herstellungsverfahren
DE102005061313A1 (de) 2005-12-20 2007-08-16 Otto Bock Healthcare Ip Gmbh & Co. Kg Handprothese
DE102005061312A1 (de) 2005-12-20 2007-08-16 Otto Bock Healthcare Ip Gmbh & Co. Kg Handprothese
DE102005062553A1 (de) * 2005-12-27 2007-07-05 Robert Bosch Gmbh Mikromechanisches Bauelement mit Kappe
DE102006010484A1 (de) 2006-03-07 2007-09-13 Robert Bosch Gmbh Bewegungssensor
FR2898597B1 (fr) * 2006-03-16 2008-09-19 Commissariat Energie Atomique Encapsulation dans une cavite hermetique d'un compose microelectronique, notamment d'un mems
US8323570B2 (en) * 2006-03-21 2012-12-04 Koninklijke Philips Electronics N.V. Microelectronic sensor device with sensor array
JP5545281B2 (ja) * 2006-06-13 2014-07-09 株式会社デンソー 力学量センサ
DE102006031772A1 (de) 2006-07-10 2008-01-17 Robert Bosch Gmbh Verfahren zur Herstellung eines Sensorelements sowie Sensorelement
JP2008256495A (ja) * 2007-04-04 2008-10-23 Denso Corp センサ装置
DE102007019639A1 (de) * 2007-04-26 2008-10-30 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
DE102007019647A1 (de) * 2007-04-26 2008-10-30 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements mit Auffüllschicht und Maskenschicht
JP2008304218A (ja) 2007-06-05 2008-12-18 Mitsubishi Electric Corp 加速度センサおよびその製造方法
US7932179B2 (en) * 2007-07-27 2011-04-26 Micron Technology, Inc. Method for fabricating semiconductor device having backside redistribution layers
JP2009053034A (ja) * 2007-08-27 2009-03-12 Mitsumi Electric Co Ltd 半導体圧力センサ及びその製造方法
DE102007044806A1 (de) * 2007-09-20 2009-04-02 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
JP2009090429A (ja) * 2007-10-10 2009-04-30 Disco Abrasive Syst Ltd マイクロマシンデバイスの加工方法
DE102007060785B4 (de) * 2007-12-17 2011-12-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines (Vielfach-) Bauelements auf Basis ultraplanarer Metallstrukturen
US7989262B2 (en) * 2008-02-22 2011-08-02 Cavendish Kinetics, Ltd. Method of sealing a cavity
US7993950B2 (en) * 2008-04-30 2011-08-09 Cavendish Kinetics, Ltd. System and method of encapsulation
JP4766143B2 (ja) 2008-09-15 2011-09-07 株式会社デンソー 半導体装置およびその製造方法
JP5314979B2 (ja) * 2008-09-22 2013-10-16 アルプス電気株式会社 Ｍｅｍｓセンサ
WO2010032819A1 (ja) * 2008-09-22 2010-03-25 アルプス電気株式会社 Ｍｅｍｓセンサ
JP5468242B2 (ja) * 2008-11-21 2014-04-09 株式会社東芝 Ｍｅｍｓパッケージおよびｍｅｍｓパッケージの製造方法
US8089144B2 (en) 2008-12-17 2012-01-03 Denso Corporation Semiconductor device and method for manufacturing the same
JP4858547B2 (ja) * 2009-01-09 2012-01-18 株式会社デンソー 半導体装置およびその製造方法
WO2010104064A1 (ja) * 2009-03-13 2010-09-16 アルプス電気株式会社 Ｍｅｍｓセンサ
JP4793496B2 (ja) 2009-04-06 2011-10-12 株式会社デンソー 半導体装置およびその製造方法
FR2947098A1 (fr) 2009-06-18 2010-12-24 Commissariat Energie Atomique Procede de transfert d'une couche mince sur un substrat cible ayant un coefficient de dilatation thermique different de celui de la couche mince
DE102010029504B4 (de) 2010-05-31 2014-02-27 Robert Bosch Gmbh Bauelement mit einer Durchkontaktierung und Verfahren zu dessen Herstellung
CN102398886B (zh) * 2010-09-15 2014-07-23 矽品精密工业股份有限公司 具微机电元件的封装结构及其制法
FR2977885A1 (fr) 2011-07-12 2013-01-18 Commissariat Energie Atomique Procede de realisation d'une structure a electrode enterree par report direct et structure ainsi obtenue
FR2977884B1 (fr) * 2011-07-12 2016-01-29 Commissariat Energie Atomique Procede de realisation d'une structure a membrane suspendue et a electrode enterree
CN102320558B (zh) * 2011-09-13 2014-03-26 上海先进半导体制造股份有限公司 全硅基微流体器件的腔体的制造方法
DE102012206854B4 (de) * 2012-04-25 2020-11-12 Robert Bosch Gmbh Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung
US8633088B2 (en) * 2012-04-30 2014-01-21 Freescale Semiconductor, Inc. Glass frit wafer bond protective structure
JP5950226B2 (ja) * 2012-06-07 2016-07-13 ローム株式会社 静電容量型圧力センサおよびその製造方法、圧力センサパッケージ
DE102012219616B4 (de) * 2012-10-26 2021-05-20 Robert Bosch Gmbh Mikromechanisches Bauelement mit Bondverbindung
JP6237440B2 (ja) * 2014-04-23 2017-11-29 株式会社デンソー 物理量センサおよびその製造方法
DE102014223926A1 (de) 2014-11-25 2016-05-25 Robert Bosch Gmbh Verfahren zum Herstellen eines MEMS-Bauelements mit zwei miteinander verbundenen Substraten und entsprechendes MEMS-Bauelement
US10315915B2 (en) * 2015-07-02 2019-06-11 Kionix, Inc. Electronic systems with through-substrate interconnects and MEMS device
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JP2017053742A (ja) * 2015-09-10 2017-03-16 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、および移動体
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Cited By (2)

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Publication number Priority date Publication date Assignee Title
JP2008183717A (ja) * 2001-02-03 2008-08-14 Robert Bosch Gmbh マイクロメカニカル素子およびその製法
JP2014122906A (ja) * 2006-05-19 2014-07-03 Robert Bosch Gmbh マイクロメカニカル素子およびマイクロメカニカル素子の製造方法

Also Published As

Publication number Publication date
EP1671923A2 (de) 2006-06-21
JP2002273699A (ja) 2002-09-25
EP1671924A2 (de) 2006-06-21
JP2008183717A (ja) 2008-08-14
DE50115279D1 (de) 2010-02-04
US20030001221A1 (en) 2003-01-02
DE50113572D1 (de) 2008-03-20
DE10104868A1 (de) 2002-08-22
US7153718B2 (en) 2006-12-26
EP1228998A2 (de) 2002-08-07
EP1671923A3 (de) 2006-08-09
DE50110147D1 (de) 2006-07-27
EP1671924A3 (de) 2006-08-16
EP1671924B1 (de) 2009-12-23
EP1228998A3 (de) 2004-06-16
EP1228998B1 (de) 2006-06-14
US20040195638A1 (en) 2004-10-07
US6876048B2 (en) 2005-04-05
EP1671923B1 (de) 2008-02-06

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