DE10347215A1 - Mikromechanischer Sensor - Google Patents

Mikromechanischer Sensor Download PDF

Info

Publication number
DE10347215A1
DE10347215A1 DE10347215A DE10347215A DE10347215A1 DE 10347215 A1 DE10347215 A1 DE 10347215A1 DE 10347215 A DE10347215 A DE 10347215A DE 10347215 A DE10347215 A DE 10347215A DE 10347215 A1 DE10347215 A1 DE 10347215A1
Authority
DE
Germany
Prior art keywords
sensor
component
micromechanical
evaluation circuit
micromechanical sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10347215A
Other languages
English (en)
Inventor
Hubert Benzel
Frank Schaefer
Christoph Schelling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE10347215A priority Critical patent/DE10347215A1/de
Priority to US10/958,014 priority patent/US7213465B2/en
Priority to FR0452287A priority patent/FR2860779B1/fr
Priority to IT001901A priority patent/ITMI20041901A1/it
Publication of DE10347215A1 publication Critical patent/DE10347215A1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • G01K7/015—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions using microstructures, e.g. made of silicon
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0757—Topology for facilitating the monolithic integration
    • B81C2203/0778—Topology for facilitating the monolithic integration not provided for in B81C2203/0764 - B81C2203/0771
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)

Abstract

Die vorliegende Erfindung beschreibt einen mikromechanischen Sensor bzw. ein Verfahren zur Herstellung eines mikromechanischen Sensors, der neben einem Sensorelement wenigstens einen Teil einer Auswerteschaltung aufweist. Dabei ist vorgesehen, dass der mikromechanische Sensor wenigstens ein erstes Bauelement auf einem ersten Material enthält. In dem ersten Bauelement ist dabei wenigstens ein Sensorbereich und ein Teil einer Auswerteschaltung untergebracht, wobei in dem Sensorbereich wenigstens ein Sensorelement vorhanden ist. Weiterhin ist bei dem ersten Bauelement wenigstens eine erste und eine zweite Seite voneinander zu unterscheiden. Erfindungsgemäß weist die erste Seite des ersten Bauelements wenigstens das Sensorelement und die zweite Seite des ersten Bauelements wenigstens ein Teil der Auswerteschaltung auf. Dabei ist vorgesehen, wenigstens Teile des Sensorbereichs und/oder der Auswerteschaltung durch mikromechanische Bearbeitung aus dem ersten Material herauszubilden.
DE10347215A 2003-10-10 2003-10-10 Mikromechanischer Sensor Ceased DE10347215A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE10347215A DE10347215A1 (de) 2003-10-10 2003-10-10 Mikromechanischer Sensor
US10/958,014 US7213465B2 (en) 2003-10-10 2004-10-04 Micromechanical sensor
FR0452287A FR2860779B1 (fr) 2003-10-10 2004-10-07 Procede de fabrication d'un capteur micromecanique et capteur obtenu
IT001901A ITMI20041901A1 (it) 2003-10-10 2004-10-07 Sensore micromeccanico e procedimento per la fabbricazione di un sensore micromeccanico.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10347215A DE10347215A1 (de) 2003-10-10 2003-10-10 Mikromechanischer Sensor

Publications (1)

Publication Number Publication Date
DE10347215A1 true DE10347215A1 (de) 2005-05-12

Family

ID=34353370

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10347215A Ceased DE10347215A1 (de) 2003-10-10 2003-10-10 Mikromechanischer Sensor

Country Status (4)

Country Link
US (1) US7213465B2 (de)
DE (1) DE10347215A1 (de)
FR (1) FR2860779B1 (de)
IT (1) ITMI20041901A1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006045653A1 (de) * 2004-10-22 2006-05-04 Robert Bosch Gmbh Verfahren zum montieren von halbleiterchips und entsprechende halbleiterchipanordnung
DE102007008518A1 (de) * 2007-02-21 2008-08-28 Infineon Technologies Ag Modul mit einem ein bewegliches Element umfassenden Halbleiterchip
US7557417B2 (en) 2007-02-21 2009-07-07 Infineon Technologies Ag Module comprising a semiconductor chip comprising a movable element
DE102008044177A1 (de) 2008-11-28 2010-06-02 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements sowie mit dem Verfahren hergestelltes Bauelement bzw. dessen Verwendung

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1946060A1 (de) 2005-08-23 2008-07-23 Continental Teves AG & Co. oHG Drucksensor für hydraulische medien in kraftfahrzeugbremssystemen und dessen verwendung
DE102005053682A1 (de) * 2005-11-10 2007-05-16 Bosch Gmbh Robert Sensor, Sensorbauelement und Verfahren zur Herstellung eines Sensors
US20100081954A1 (en) * 2008-09-30 2010-04-01 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Method, device, and system to control pH in pulmonary tissue of a subject
US9021887B2 (en) 2011-12-19 2015-05-05 Infineon Technologies Ag Micromechanical semiconductor sensing device
DE102012203135B4 (de) 2012-02-29 2020-11-12 Robert Bosch Gmbh Mikromechanische Sensoranordnung und ein entsprechendes Herstellungsverfahren sowie entsprechende Verwendung
DE102012224424A1 (de) * 2012-12-27 2014-07-17 Robert Bosch Gmbh Sensorsystem und Abdeckvorrichtung für ein Sensorsystem
US11302611B2 (en) * 2018-11-28 2022-04-12 Texas Instruments Incorporated Semiconductor package with top circuit and an IC with a gap over the IC

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624505B2 (en) * 1998-02-06 2003-09-23 Shellcase, Ltd. Packaged integrated circuits and methods of producing thereof
DE19847455A1 (de) 1998-10-15 2000-04-27 Bosch Gmbh Robert Verfahren zur Bearbeitung von Silizium mittels Ätzprozessen
DE10040537B4 (de) * 2000-08-18 2004-05-13 Eads Deutschland Gmbh Mikromechanischer Drehratensensor und Verfahren zu seiner Herstellung
DE10042945A1 (de) 2000-08-31 2002-03-28 Siemens Ag Bauelement für Sensoren mit integrierter Elektronik und Verfahren zu seiner Herstellung, sowie Sensor mit integrierter Elektronik
DE10104868A1 (de) 2001-02-03 2002-08-22 Bosch Gmbh Robert Mikromechanisches Bauelement sowie ein Verfahren zur Herstellung eines mikromechanischen Bauelements
DE10114036A1 (de) 2001-03-22 2002-10-02 Bosch Gmbh Robert Verfahren zur Herstellung von mikromechanischen Sensoren und damit hergestellte Sensoren
US6635506B2 (en) 2001-11-07 2003-10-21 International Business Machines Corporation Method of fabricating micro-electromechanical switches on CMOS compatible substrates

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006045653A1 (de) * 2004-10-22 2006-05-04 Robert Bosch Gmbh Verfahren zum montieren von halbleiterchips und entsprechende halbleiterchipanordnung
US7563634B2 (en) 2004-10-22 2009-07-21 Robert Bosch Gmbh Method for mounting semiconductor chips, and corresponding semiconductor chip system
DE102007008518A1 (de) * 2007-02-21 2008-08-28 Infineon Technologies Ag Modul mit einem ein bewegliches Element umfassenden Halbleiterchip
US7557417B2 (en) 2007-02-21 2009-07-07 Infineon Technologies Ag Module comprising a semiconductor chip comprising a movable element
DE102008044177A1 (de) 2008-11-28 2010-06-02 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements sowie mit dem Verfahren hergestelltes Bauelement bzw. dessen Verwendung

Also Published As

Publication number Publication date
US20050115321A1 (en) 2005-06-02
FR2860779A1 (fr) 2005-04-15
ITMI20041901A1 (it) 2005-01-07
US7213465B2 (en) 2007-05-08
FR2860779B1 (fr) 2007-09-21

Similar Documents

Publication Publication Date Title
DE10347215A1 (de) Mikromechanischer Sensor
EP2023093A3 (de) Drehgeber und Verfahren zu dessen Betrieb
EP3573043A3 (de) Bauteil mit basisteil, zusatzteil und deckschicht aus lack sowie verfahren zur herstellung eines solchen bauteils
DE60300407T2 (de) Vorrichtung zur Impedanzmessung lebender Körper
EP2070555A3 (de) Fluorirtes Implantat
EP1193472A3 (de) Verfahren und Vorrichtung zur Bestimmung der Absolutposition bei Weg- und Winkelgebern
EP2600611A8 (de) Verfahren und Vorrichtung zur überwachung eines Überwachungsbereichs
EP1061328A3 (de) Verfahren und Schaltkreis zur Einstellung einer Schaltschwelle eines Tastschalters
EP2246158A3 (de) Bewegung eines Menschen durch einen Manipulator
EP2073182A3 (de) Anordnung, System und Verfahren zur drahtlosen Steuerung eines Gerätes
EP2933163A3 (de) Verfahren und Vorrichtung zum Betreiben eines Fahrzeugs, Computerprogramm, Computer-Programmprodukt
EP3590811A3 (de) Leistungsmessanordnung
EP1684056A3 (de) Anordnung und Verfahren zur Kompensation der Temperaturabhängigkeit von Detektoren in Spektrometern
EP2151256A3 (de) Endoprothese und Verfahren zur Herstellung derselben
DE102009007412A1 (de) Verfahren zur Verfolgung wenigstens eines Objekts
EP1314953A3 (de) Interferometer und interferometrisches Messverfahren
EP1000797A3 (de) Vorrichtung und Verfahren zum Erkennen der Belegungsart eines Fahrzeugsitzes
DE102007045222A1 (de) Verfahren zur Korrektur eines Brennrauminnendrucksignals einer Verbrennungskraftmaschine
EP3127763A3 (de) Verfahren zur betriebsvalidierung einer sensoreinheit, sensoreinheit und tachographsystem
DE102009047474A1 (de) Bewegungsmonitor sowie Verwendung
DE10344617A1 (de) Verfahren zur Ermittlung von Messeigenschaften einer Radar-Sensoreinrichtung eines Kraftfahrzeuges
EP2169364A3 (de) Verfahren und Messeinheit zur Bestimmung des Gewichts eines Fahrzeugs
DE10343332A1 (de) Verfahren zur Unterdrückung von Störungen in einem Signalverarbeitungssystem und Signalverarbeitungssystem
EP1955911A3 (de) Verfahren und Vorrichtung zur Ansteuerung von Personenschutzmitteln
EP1865755A3 (de) Vorrichtung zur Beleuchtungssteuerung

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final

Effective date: 20120825