JP4234444B2 - 電子部品の冷却装置、および電子部品の冷却方法 - Google Patents
電子部品の冷却装置、および電子部品の冷却方法 Download PDFInfo
- Publication number
- JP4234444B2 JP4234444B2 JP2002590415A JP2002590415A JP4234444B2 JP 4234444 B2 JP4234444 B2 JP 4234444B2 JP 2002590415 A JP2002590415 A JP 2002590415A JP 2002590415 A JP2002590415 A JP 2002590415A JP 4234444 B2 JP4234444 B2 JP 4234444B2
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- Prior art keywords
- airflow
- heat sink
- electronic components
- fan
- board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (11)
- ファンからの気流によって、ボード上に第1電子部品と、前記ボード上の第1ラインに沿って配置された第1の複数電子部品と、及び前記第1ラインに対して角度関係を有する前記ボード上の第2ラインに沿って配置された第2の複数電子部品とを含む電子部品を冷却する装置であって、
前記ファンが搭載される表面を有するヒートシンクを具え、該ヒートシンクは前記第1電子部品に取付け可能であると共に、前記第1の複数電子部品と前記第2の複数電子部品の両方に隣接し、
冷却空気を前記ヒートシンクに接触させるための1本以上のダクトを具え、該1本以上のダクトは、トップ部材、および前記ヒートシンクの有する複数のフィンで形成され、且つ前記ファンに連通しており、且つ前記気流を前記ヒートシンクを介して実質的に前記第1の複数電子部品と前記第2の複数電子部品に向けるように構成され、
前記ヒートシンクの前記複数のフィンは、前記第1の複数電子部品および前記第2の複数電子部品の上に配置された複数の周辺ヒートシンクに前記ファンからの気流を指向させるために、サイズおよび向きが調整され、
前記トップ部材は、前記複数の周辺ヒートシンク上に前記気流を指向させるために、前記複数の周辺ヒートシンクの少なくとも一部の上まで延在する、電子部品の冷却装置。 - 前記1本以上のダクトが複数のダクトであり、該複数のダクトのそれぞれが、第1端と第2端を有する細長いダクトであり、前記指向気流が前記第1端群から前記第2端群に向かう請求項1に記載の装置。
- 前記ヒートシンクが、表面から突出している複数のフィンを有する表面を有し、前記複数のダクトが前記トップ部材と、前記表面と、前記複数のフィンとで形成されている請求項2に記載の装置。
- 前記トップ部材が、前記ファンが搭載される前記表面に隣接した孔を有し、提供された前記気流が該孔を通じて前記複数のダクトの方に更に向けられる請求項3に記載の装置。
- 前記トップ部材は、該トップ部材が前記複数の周辺ヒートシンクを完全に覆うように、前記第1の複数電子部品の少なくとも一部と、前記第2の複数電子部品の少なくとも一部の上まで延在し、前記トップ部材は前記気流を前記第1の複数電子部品の少なくとも一部と、前記第2の複数電子部品の少なくとも一部に向けるように構成されている請求項1に記載の装置。
- 前記第1電子部品がグラフィックプロセッサであり、前記第1の複数電子部品が第1の複数のメモリチップであり、前記第2の複数電子部品が第2の複数のメモリチップである請求項1に記載の装置。
- 前記ボードが、空気入口ポートを有するコンピュータハウジングの中に設置され、更に、該空気入口ポートと前記ファンに連通して、前記ハウジングの外の空気を前記ヒートシンクに提供する導管を具えている請求項6に記載の装置。
- 前記角度関係が垂直である請求項1に記載の装置。
- 第1のコンピュータチップと、プリント回路基板上で角度関係を有するコンピュータチップの二つの配列を形成している複数のコンピュータチップと、をファンからの気流によって冷却する方法であって、
前記気流を第1ヒートシンクに供給し、ここで該第1ヒートシンクは前記第1コンピュータチップに熱的に接触しており、該第1ヒートシンクは突出した複数のフィンを有し、トップ部材が前記複数のフィンをカバーして複数の細長いダクトを形成しており、
前記複数のダクトを通じて、気流を前記ヒートシンクを介して実質的に前記複数のコンピュータチップの方に向けて、前記複数の補助コンピュータチップのそれぞれをほぼ均一な温度まで充分に冷却するステップを含み、
前記ヒートシンクの前記複数のフィンは、前記第1の複数電子部品および前記第2の複数電子部品の上に配置された複数の周辺ヒートシンクに前記ファンからの気流を指向させるために、サイズおよび向きが調整され、
前記トップ部材は、前記複数の周辺ヒートシンク上に前記気流を指向させるために、前記複数の周辺ヒートシンクの少なくとも一部の上まで延在する、方法。 - 更に、前記プリント回路基板の入っているハウジングの外の空気を、前記ハウジングから前記プリント回路基板に導くステップを含む請求項9に記載の方法。
- 前記角度関係が垂直である請求項9に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/858,823 US6778390B2 (en) | 2001-05-15 | 2001-05-15 | High-performance heat sink for printed circuit boards |
PCT/US2002/015186 WO2002093643A1 (en) | 2001-05-15 | 2002-05-13 | High performance heat sink for printed circuit boards |
Related Child Applications (1)
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JP2008133558A Division JP2008235932A (ja) | 2001-05-15 | 2008-05-21 | グラフィックシステム |
Publications (2)
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JP2004526332A JP2004526332A (ja) | 2004-08-26 |
JP4234444B2 true JP4234444B2 (ja) | 2009-03-04 |
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JP2002590415A Expired - Lifetime JP4234444B2 (ja) | 2001-05-15 | 2002-05-13 | 電子部品の冷却装置、および電子部品の冷却方法 |
JP2008133558A Pending JP2008235932A (ja) | 2001-05-15 | 2008-05-21 | グラフィックシステム |
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JP2008133558A Pending JP2008235932A (ja) | 2001-05-15 | 2008-05-21 | グラフィックシステム |
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US (1) | US6778390B2 (ja) |
EP (1) | EP1393369A4 (ja) |
JP (2) | JP4234444B2 (ja) |
TW (1) | TWI230578B (ja) |
WO (1) | WO2002093643A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9750126B2 (en) | 2012-10-22 | 2017-08-29 | Thomson Licensing | Electronic device with combination heat sink/blower or fan assembly having air duct |
Families Citing this family (132)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7071587B2 (en) * | 2001-09-07 | 2006-07-04 | Rotys Inc. | Integrated cooler for electronic devices |
AT413163B (de) * | 2001-12-18 | 2005-11-15 | Fotec Forschungs Und Technolog | Kühlvorrichtung für einen chip sowie verfahren zur herstellung |
US6935419B2 (en) * | 2002-02-20 | 2005-08-30 | Hewlett-Packard Development Company, L.P. | Heat sink apparatus with air duct |
JP3651677B2 (ja) * | 2002-07-12 | 2005-05-25 | 株式会社東芝 | 発熱素子冷却装置及び電子機器 |
US6797998B2 (en) * | 2002-07-16 | 2004-09-28 | Nvidia Corporation | Multi-configuration GPU interface device |
US7100013B1 (en) * | 2002-08-30 | 2006-08-29 | Nvidia Corporation | Method and apparatus for partial memory power shutoff |
US7049691B2 (en) * | 2002-10-08 | 2006-05-23 | Chippac, Inc. | Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package |
US7034387B2 (en) * | 2003-04-04 | 2006-04-25 | Chippac, Inc. | Semiconductor multipackage module including processor and memory package assemblies |
DE10251540A1 (de) * | 2002-11-05 | 2004-05-19 | Medion Ag | Computer mit Kühlvorrichtung |
JP4173014B2 (ja) * | 2003-01-17 | 2008-10-29 | 富士通株式会社 | ヒートシンク及び電子機器の冷却装置及び電子機器 |
WO2004088218A1 (en) | 2003-03-25 | 2004-10-14 | Utah State University | Thermoacoustic cooling device |
US7079390B2 (en) * | 2003-06-05 | 2006-07-18 | Hewlett-Packard Development, L.P. | System and method for heat dissipation and air flow redirection in a chassis |
US7237599B2 (en) * | 2003-08-30 | 2007-07-03 | Rotys Inc. | Cooler with blower comprising heat-exchanging elements |
TWM246694U (en) * | 2003-11-11 | 2004-10-11 | Hon Hai Prec Ind Co Ltd | Heat dissipation device |
EP1531384A3 (en) * | 2003-11-14 | 2006-12-06 | LG Electronics Inc. | Cooling apparatus for portable computer |
US7221566B1 (en) * | 2004-01-28 | 2007-05-22 | Nvidia Corporation | System for cooling a processor while reducing air flow noise |
TWI402764B (zh) * | 2004-06-25 | 2013-07-21 | Nvidia Corp | 分離式圖形系統、用於分離式圖形系統的電腦系統、分離式圖形系統單元、分離式圖形系統(dgs)外罩、及其方法 |
US7405932B2 (en) * | 2004-07-19 | 2008-07-29 | Hewlett-Packard Development Company, L.P. | System and method for cooling electronic devices |
US20060021735A1 (en) * | 2004-07-27 | 2006-02-02 | Industrial Design Laboratories Inc. | Integrated cooler for electronic devices |
US7120019B2 (en) * | 2004-08-18 | 2006-10-10 | International Business Machines Corporation | Coaxial air ducts and fans for cooling and electronic component |
TW200609715A (en) * | 2004-09-01 | 2006-03-16 | Delta Electronics Inc | Electronic device and fan thereof |
US7265974B2 (en) * | 2004-09-16 | 2007-09-04 | Industrial Design Laboratories Inc. | Multi-heatsink integrated cooling device |
DE102004060497B3 (de) * | 2004-12-16 | 2006-01-12 | Rico Weber | Modulare Kühleinrichtung in Sandwichbauweise |
KR20060070176A (ko) * | 2004-12-20 | 2006-06-23 | 삼성전자주식회사 | 냉각장치와 이를 포함하는 액정표시장치 |
US20060144558A1 (en) * | 2004-12-30 | 2006-07-06 | Inventec Corporation | Fan-driven heat dissipating device with enhanced air blowing efficiency |
US7382616B2 (en) * | 2005-01-21 | 2008-06-03 | Nvidia Corporation | Cooling system for computer hardware |
US7333332B2 (en) * | 2005-02-14 | 2008-02-19 | Inventec Corporation | Heatsink thermal module with noise improvement |
DE202005018284U1 (de) * | 2005-04-08 | 2006-02-02 | Rittal Gmbh & Co. Kg | Kühleinheit |
KR100731482B1 (ko) * | 2005-05-31 | 2007-06-21 | 삼성에스디아이 주식회사 | 구동회로기판 및 이를 구비한 평판형 디스플레이 장치 |
KR101327722B1 (ko) * | 2005-07-20 | 2013-11-11 | 엘지전자 주식회사 | 전자기기의 방열장치 |
CN100530616C (zh) * | 2005-09-23 | 2009-08-19 | 富准精密工业(深圳)有限公司 | 散热模组 |
WO2007043119A1 (ja) | 2005-09-30 | 2007-04-19 | Fujitsu Limited | ファン装置 |
US7342786B2 (en) * | 2005-10-25 | 2008-03-11 | Hewlett-Packard Development Company, L.P. | Air duct with airtight seal |
CN100464278C (zh) * | 2005-11-02 | 2009-02-25 | 富准精密工业(深圳)有限公司 | 散热装置 |
US20070193724A1 (en) * | 2006-02-17 | 2007-08-23 | Sheng-Huang Lin | Heat dissipating device |
US7365989B2 (en) * | 2006-03-08 | 2008-04-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipating device for computer add-on cards |
TW200734859A (en) * | 2006-03-15 | 2007-09-16 | Asustek Comp Inc | Electronic device with airflow guiding function |
US7215548B1 (en) * | 2006-03-20 | 2007-05-08 | Foxconn Technology Co., Ltd. | Heat dissipating device having a fin also functioning as a fan duct |
US20070256812A1 (en) * | 2006-04-19 | 2007-11-08 | Wen-Chen Wei | Multidirectional heat dissipating structure |
US20070251677A1 (en) * | 2006-04-26 | 2007-11-01 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus with guilding plates for guiding airflow flowing through a fin assembly |
CN100464621C (zh) * | 2006-05-12 | 2009-02-25 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN100584171C (zh) * | 2006-07-12 | 2010-01-20 | 富准精密工业(深圳)有限公司 | 散热装置 |
US7434610B2 (en) * | 2006-07-13 | 2008-10-14 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus |
US7520314B2 (en) * | 2006-07-20 | 2009-04-21 | Furui Precise Component (Kunshan) Co., Ltd. | Heat dissipation apparatus |
US8313284B2 (en) * | 2006-07-21 | 2012-11-20 | Panasonic Corporation | Centrifugal fan device and eletronic device having the same |
US20080024985A1 (en) * | 2006-07-31 | 2008-01-31 | Zong-Jui Lee | Computer casing with high heat dissipation efficiency |
US7450380B2 (en) * | 2006-10-25 | 2008-11-11 | Hewlett-Packard Development Company, L.P. | Computer system having multi-direction blower |
US20080105410A1 (en) * | 2006-11-03 | 2008-05-08 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
US7967208B2 (en) * | 2006-11-15 | 2011-06-28 | Nvidia Corporation | System, method and computer program product for marking an article of manufacture with a supplemental identifier |
CN101193542A (zh) * | 2006-11-23 | 2008-06-04 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及导风片 |
CN101207995B (zh) * | 2006-12-20 | 2010-12-29 | 富准精密工业(深圳)有限公司 | 散热模组及采用该散热模组的电子装置 |
US7495920B2 (en) * | 2006-12-21 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
JP4846610B2 (ja) * | 2007-01-31 | 2011-12-28 | 株式会社東芝 | 電子機器 |
KR101380752B1 (ko) * | 2007-03-21 | 2014-04-02 | 삼성전자 주식회사 | 컴퓨터 |
EP1998108B1 (en) * | 2007-05-30 | 2015-04-29 | OSRAM GmbH | Cooling apparatus |
US7447024B1 (en) * | 2007-07-17 | 2008-11-04 | Kuan-Yin Chou | Heat sink for a memory |
CN101370370B (zh) * | 2007-08-17 | 2011-11-09 | 富准精密工业(深圳)有限公司 | 散热模组 |
TW200910070A (en) * | 2007-08-28 | 2009-03-01 | Inventec Corp | Heat dissipation module |
US7529090B2 (en) * | 2007-08-29 | 2009-05-05 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20090059525A1 (en) * | 2007-09-05 | 2009-03-05 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device for computer add-on cards |
CN101436092B (zh) * | 2007-11-12 | 2012-03-28 | 鸿富锦精密工业(深圳)有限公司 | 显卡散热装置组合及使用该组合的刀锋式服务器 |
US8327173B2 (en) * | 2007-12-17 | 2012-12-04 | Nvidia Corporation | Integrated circuit device core power down independent of peripheral device operation |
TWM334959U (en) * | 2008-01-07 | 2008-06-21 | Cooler Master Co Ltd | Lateral extension radiator of heat-pipe |
US9411390B2 (en) | 2008-02-11 | 2016-08-09 | Nvidia Corporation | Integrated circuit device having power domains and partitions based on use case power optimization |
US8762759B2 (en) * | 2008-04-10 | 2014-06-24 | Nvidia Corporation | Responding to interrupts while in a reduced power state |
US9423846B2 (en) | 2008-04-10 | 2016-08-23 | Nvidia Corporation | Powered ring to maintain IO state independent of the core of an integrated circuit device |
TWM339033U (en) * | 2008-04-16 | 2008-08-21 | Asia Vital Components Co Ltd | Heat sink |
CN101605442B (zh) * | 2008-06-13 | 2013-01-23 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN201226635Y (zh) * | 2008-07-04 | 2009-04-22 | 北京奇宏科技研发中心有限公司 | 一种利用热管集中热源式液冷散热装置 |
CN101676569A (zh) * | 2008-09-19 | 2010-03-24 | 富准精密工业(深圳)有限公司 | 散热装置及其所采用的离心风扇 |
TWI418291B (zh) * | 2008-10-03 | 2013-12-01 | Foxconn Tech Co Ltd | 散熱裝置及其所採用的離心風扇 |
TWM363612U (en) * | 2008-11-05 | 2009-08-21 | Power Data Comm Co Ltd | Heat dissipating apparatus of laptop computer |
US10914308B2 (en) * | 2009-01-05 | 2021-02-09 | Intel Corporation | Crossflow blower apparatus and system |
CN101832280A (zh) * | 2009-03-13 | 2010-09-15 | 富准精密工业(深圳)有限公司 | 散热装置及其离心风扇与使用该散热装置的电子装置 |
CN101896054A (zh) * | 2009-05-21 | 2010-11-24 | 富准精密工业(深圳)有限公司 | 散热装置 |
US7933119B2 (en) * | 2009-07-31 | 2011-04-26 | Hewlett-Packard Development Company, L.P. | Heat transfer systems and methods |
JP4660620B1 (ja) * | 2009-09-30 | 2011-03-30 | 株式会社東芝 | 電子機器 |
TWI377465B (en) * | 2010-03-11 | 2012-11-21 | Delta Electronics Inc | Heat dissipating module and electronic device using such heat dissipating module |
US10103089B2 (en) | 2010-03-26 | 2018-10-16 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
US9249803B2 (en) * | 2010-06-30 | 2016-02-02 | Intel Corporation | Integrated crossflow blower motor apparatus and system |
US9140502B2 (en) | 2010-07-08 | 2015-09-22 | Hamilton Sundstrand Corporation | Active structures for heat exchanger |
US8295046B2 (en) | 2010-07-19 | 2012-10-23 | Hamilton Sundstrand Corporation | Non-circular radial heat sink |
US9845805B2 (en) | 2010-07-29 | 2017-12-19 | Dell Products, L.P. | Dual operation centrifugal fan apparatus and methods of using same |
JP2012049315A (ja) * | 2010-08-26 | 2012-03-08 | Sae Magnetics(H.K.)Ltd | 回路基板 |
US20120211214A1 (en) * | 2010-12-09 | 2012-08-23 | Panasonic Avionics Corporation | Heatsink Device and Method |
TWM410247U (en) * | 2010-12-21 | 2011-08-21 | Wistron Corp | Electronic device |
CN102110664A (zh) * | 2010-12-30 | 2011-06-29 | 广东易事特电源股份有限公司 | 一种大功率逆变器mos管散热结构 |
CN102655727B (zh) * | 2011-03-01 | 2016-06-29 | 华北理工大学 | 导风件 |
US9075581B2 (en) * | 2011-04-19 | 2015-07-07 | Germane Systems, Llc | Apparatus and method for cooling electrical components of a computer |
AU2012272752B2 (en) | 2011-06-22 | 2016-11-24 | EcoTech LLC | Lighting unit and method of controlling |
DE102011107316A1 (de) * | 2011-07-06 | 2013-06-06 | Abb Ag | Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Steuerungssystems |
TWI458932B (zh) * | 2011-09-02 | 2014-11-01 | Giga Byte Tech Co Ltd | 散熱器 |
US8699226B2 (en) | 2012-04-03 | 2014-04-15 | Google Inc. | Active cooling debris bypass fin pack |
US9471395B2 (en) | 2012-08-23 | 2016-10-18 | Nvidia Corporation | Processor cluster migration techniques |
US8947137B2 (en) | 2012-09-05 | 2015-02-03 | Nvidia Corporation | Core voltage reset systems and methods with wide noise margin |
US9301395B2 (en) | 2012-12-27 | 2016-03-29 | Nvidia Corporation | Voltage noise reduction through co-layouts of multilayer ceramic capacitors and solid electrolytic polymer capacitors |
US9317083B2 (en) * | 2013-02-22 | 2016-04-19 | Skyera, Llc | Thermal regulation for solid state memory |
JP5971403B2 (ja) | 2013-03-19 | 2016-08-17 | 富士電機株式会社 | 冷却装置及びこれを備えた電力変換装置 |
US20160345468A1 (en) * | 2013-04-26 | 2016-11-24 | CoolChip Technologies, Inc. | Kinetic heat sink with stationary fins |
EP2819279B1 (en) * | 2013-06-27 | 2017-01-18 | ABB Research Ltd. | Cooling apparatus |
TWI508652B (zh) * | 2013-07-29 | 2015-11-11 | Wistron Corp | 導流裝置及具有該導流裝置之電子裝置 |
CN105849495A (zh) * | 2013-08-21 | 2016-08-10 | 酷奇普科技股份有限公司 | 具有交叉传热翼片的动力热沉 |
US9639125B2 (en) * | 2013-10-31 | 2017-05-02 | Microsoft Technology Licensing, Llc | Centrifugal fan with integrated thermal transfer unit |
CN104881097B (zh) * | 2014-02-28 | 2019-02-01 | 鸿富锦精密工业(武汉)有限公司 | 导风罩 |
JP2016004872A (ja) * | 2014-06-16 | 2016-01-12 | 日立金属株式会社 | 信号伝送装置および冷却装置 |
US9746888B2 (en) * | 2014-09-12 | 2017-08-29 | Microsoft Technology Licensing, Llc | Uniform flow heat sink |
CN110017293B (zh) * | 2014-11-25 | 2021-07-30 | 台达电子工业股份有限公司 | 离心式风扇 |
US10718342B2 (en) | 2014-11-25 | 2020-07-21 | Delta Electronics, Inc. | Centrifugal fan comprising a sidewall and plurality of air deflectors forming a plurality of airflow entry tunnels to sequentially expand a flow channel outwardly in a radial direction |
CN105988546A (zh) * | 2015-02-10 | 2016-10-05 | 鸿富锦精密工业(武汉)有限公司 | 散热模组 |
US10299403B2 (en) * | 2015-09-23 | 2019-05-21 | Advanced Micro Devices, Inc. | Modular thermal solution for high-performance processors |
EP3460623A4 (en) * | 2016-05-16 | 2020-01-01 | Exascaler Inc. | ELECTRONIC DEVICE COOLED BY LIQUID IMMERSION |
SG10201609616TA (en) | 2016-09-06 | 2018-04-27 | Apple Inc | Electronic device with cooling fan |
US10285303B2 (en) * | 2017-07-14 | 2019-05-07 | Apple Inc. | Electronic device with integrated passive and active cooling |
CN107289373A (zh) * | 2017-07-17 | 2017-10-24 | 海南金渔创新科技有限公司 | 一种轻便型超大功率防水诱鱼灯 |
US11106256B2 (en) * | 2018-01-12 | 2021-08-31 | Intel Corporation | Heat dissipation using airflow diversion with cooling fins |
CN108776535B (zh) * | 2018-06-28 | 2020-01-21 | 深圳市南方亿信计算机信息系统有限公司 | 一种扰流式双向通风的水冷计算机主机箱 |
JP7196470B2 (ja) * | 2018-08-30 | 2022-12-27 | 日本電気株式会社 | 電子機器の放熱構造 |
CN109257868B (zh) * | 2018-09-30 | 2020-08-25 | 联想(北京)有限公司 | 一种电子设备 |
US11116116B1 (en) | 2018-12-14 | 2021-09-07 | Smart Wires Inc. | Interference limiting enclosure for power flow devices |
US10584717B1 (en) | 2019-04-25 | 2020-03-10 | Dell Products, Lp | Blower system with dual opposite outlets and fan diameter approaching to blower housing dimension for information handling systems |
US11109509B2 (en) * | 2019-05-03 | 2021-08-31 | Dell Products, Lp | Cooling module with blower system having dual opposite outlets for information handling systems |
US11028857B2 (en) | 2019-09-18 | 2021-06-08 | Dell Products, Lp | Cooling module with blower system having opposite, blower and impeller outlets for information handling systems |
US11375612B2 (en) | 2019-11-22 | 2022-06-28 | Bio-Rad Laboratories, Inc. | Thermal management for thermal cyclers using air tubes |
US11762437B2 (en) * | 2019-12-13 | 2023-09-19 | Hewlett Packard Enterprise Development Lp | Expansion fan device with adjustable fan |
TWI745928B (zh) * | 2020-04-13 | 2021-11-11 | 宏碁股份有限公司 | 離心式散熱風扇與電子裝置的散熱系統 |
US12055149B2 (en) | 2020-07-16 | 2024-08-06 | Dell Products Lp | Blower fan with through hole and fan support rod |
US11240931B1 (en) | 2020-07-16 | 2022-02-01 | Dell Products, Lp | Variable height fan |
TWI790494B (zh) * | 2020-10-26 | 2023-01-21 | 宏碁股份有限公司 | 可攜式電子裝置的散熱系統 |
US11994144B2 (en) | 2020-10-30 | 2024-05-28 | Dell Products Lp | Blower system with an inner axial fan blade set and an outer centrifugal fan blade set |
CN112584679A (zh) * | 2020-12-15 | 2021-03-30 | 深圳市爱协生科技有限公司 | 一种屏幕总成烧录和测试盒的制作方法 |
US20230284371A1 (en) * | 2022-03-01 | 2023-09-07 | Nvidia Corporation | Airflow in a card-based computing device |
CN114822607B (zh) * | 2022-04-01 | 2023-12-12 | 长鑫存储技术有限公司 | 散热装置和计算机系统 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3101746B2 (ja) * | 1992-04-28 | 2000-10-23 | 株式会社日立製作所 | 半導体冷却装置 |
US5760333A (en) | 1992-08-06 | 1998-06-02 | Pfu Limited | Heat-generating element cooling device |
JP3369723B2 (ja) * | 1994-05-27 | 2003-01-20 | 株式会社日立製作所 | 局所冷却方法および局所冷却装置 |
JPH08195456A (ja) * | 1995-01-17 | 1996-07-30 | Toto Ltd | 電子機器冷却装置 |
JP2625398B2 (ja) * | 1995-03-17 | 1997-07-02 | 日本電気株式会社 | マルチチップ冷却装置 |
JP3578825B2 (ja) | 1995-03-17 | 2004-10-20 | 富士通株式会社 | ヒートシンク |
US5535094A (en) | 1995-04-26 | 1996-07-09 | Intel Corporation | Integrated circuit package with an integral heat sink and fan |
GB2303970A (en) * | 1995-07-31 | 1997-03-05 | Ming Der Chiou | CPU heat dissipating apparatus |
US5661638A (en) * | 1995-11-03 | 1997-08-26 | Silicon Graphics, Inc. | High performance spiral heat sink |
JPH09149598A (ja) * | 1995-11-20 | 1997-06-06 | Seiko Epson Corp | 冷却ファンおよび冷却ファン組立体 |
US5785116A (en) * | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
US5966286A (en) | 1996-05-31 | 1999-10-12 | Intel Corporation | Cooling system for thin profile electronic and computer devices |
JP3768598B2 (ja) | 1996-05-31 | 2006-04-19 | 山洋電気株式会社 | 発熱体冷却装置 |
JPH1012781A (ja) * | 1996-06-20 | 1998-01-16 | Hitachi Ltd | 強制冷却用ヒートシンク |
US6167948B1 (en) | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
JPH10154889A (ja) * | 1996-11-25 | 1998-06-09 | Yaskawa Electric Corp | 冷却装置 |
US5794685A (en) | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
JP2959506B2 (ja) | 1997-02-03 | 1999-10-06 | 日本電気株式会社 | マルチチップモジュールの冷却構造 |
US5727624A (en) | 1997-03-18 | 1998-03-17 | Liken Lin | CPU heat dissipating device with airguiding units |
US5867365A (en) * | 1997-06-10 | 1999-02-02 | Chiou; Ming Chin | CPU heat sink assembly |
JP3403012B2 (ja) * | 1997-07-14 | 2003-05-06 | 三菱電機株式会社 | 発熱体冷却装置 |
US5852547A (en) | 1997-07-14 | 1998-12-22 | Sun Microsystems, Inc. | Module shroud attachment to motherboard |
US5917697A (en) | 1998-01-27 | 1999-06-29 | Wang; Daniel | CPU cooling arrangement |
JPH11214638A (ja) * | 1998-01-29 | 1999-08-06 | Mitsubishi Electric Corp | 半導体記憶装置 |
US6130819A (en) | 1998-01-29 | 2000-10-10 | Intel Corporation | Fan duct module |
US5917698A (en) | 1998-02-10 | 1999-06-29 | Hewlett-Packard Company | Computer unit having duct-mounted fan |
US6088225A (en) | 1998-03-17 | 2000-07-11 | Northern Telecom Limited | Cabinet with enhanced convection cooling |
US6109341A (en) | 1998-04-30 | 2000-08-29 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus including elongated heat sink |
US6058009A (en) | 1998-07-14 | 2000-05-02 | Dell Usa, L.P. | Computer with improved internal cooling system |
US6179561B1 (en) * | 1998-12-02 | 2001-01-30 | Sunonwealth Electric Machine Industry Co., Ltd. | Fan wheel structures |
US6173576B1 (en) | 1999-03-25 | 2001-01-16 | Intel Corporation | Cooling unit for an integrated circuit package |
US6125924A (en) | 1999-05-03 | 2000-10-03 | Lin; Hao-Cheng | Heat-dissipating device |
US6181556B1 (en) * | 1999-07-21 | 2001-01-30 | Richard K. Allman | Thermally-coupled heat dissipation apparatus for electronic devices |
-
2001
- 2001-05-15 US US09/858,823 patent/US6778390B2/en not_active Expired - Lifetime
- 2001-08-23 TW TW090120773A patent/TWI230578B/zh not_active IP Right Cessation
-
2002
- 2002-05-13 JP JP2002590415A patent/JP4234444B2/ja not_active Expired - Lifetime
- 2002-05-13 WO PCT/US2002/015186 patent/WO2002093643A1/en active Application Filing
- 2002-05-13 EP EP02736806A patent/EP1393369A4/en not_active Ceased
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2008
- 2008-05-21 JP JP2008133558A patent/JP2008235932A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9750126B2 (en) | 2012-10-22 | 2017-08-29 | Thomson Licensing | Electronic device with combination heat sink/blower or fan assembly having air duct |
Also Published As
Publication number | Publication date |
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WO2002093643A1 (en) | 2002-11-21 |
US6778390B2 (en) | 2004-08-17 |
JP2008235932A (ja) | 2008-10-02 |
TWI230578B (en) | 2005-04-01 |
EP1393369A1 (en) | 2004-03-03 |
US20020172008A1 (en) | 2002-11-21 |
JP2004526332A (ja) | 2004-08-26 |
EP1393369A4 (en) | 2006-08-23 |
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