CN104881097B - 导风罩 - Google Patents

导风罩 Download PDF

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CN104881097B
CN104881097B CN201410069872.3A CN201410069872A CN104881097B CN 104881097 B CN104881097 B CN 104881097B CN 201410069872 A CN201410069872 A CN 201410069872A CN 104881097 B CN104881097 B CN 104881097B
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plate
wind scooper
heat radiation
substrate
radiation module
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CN104881097A (zh
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李赞
王良津
肖宇鸣
王翠国
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Haining Economic Development Industrial Park Development And Construction Co Ltd
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Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks

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  • Engineering & Computer Science (AREA)
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Abstract

一种导风罩，用以固定安装到一散热模组上，所述导风罩及所述散热膜组均收容于一机壳内，所述导风罩包括一基板及一垂直连接在所述基板上的卡扣板，所述基板包括一能够弹性变形的伸缩部，所述卡扣板通过所述伸缩部弹性变形而卡扣到所述散热模组上，所述基板抵靠在所述机壳上从而防止热气流回流。

Description

导风罩
技术领域
本发明涉及一种导风罩，特别涉及一种用于电子装置的导风罩。
背景技术
在目前的计算机主机内部的散热机构中，通常使用风冷散热器对CPU等电子元件进行散热。当风扇工作时，风扇会产生气流而把冷空气吹向散热器，冷空气在带走散热器热量的同时，其自身温度也会升高；由于风扇入口处于负压状态，热空气因为排放不及时而被重新吸入入风口，这样就形成了热空气回流而被风扇循环加热，从而影响散热器的散热效果。
发明内容
鉴于以上内容，有必要提供一种避免热空气回流而被循环加热的导风罩。
一种导风罩，用以固定安装到一散热模组上，所述导风罩及所述散热膜组均收容于一机壳内，所述导风罩包括一基板及一垂直连接在所述基板上的卡扣板，所述基板包括一能够弹性变形的伸缩部，所述卡扣板通过所述伸缩部弹性变形而卡扣到所述散热模组上，所述基板抵靠在所述机壳上从而防止热气流回流。
优选地，所述机壳内设有一安装了电子元件及显卡的主板，所述散热模组及所述导风罩均固定在所述主板上。
优选地，所述基板包括两抵止板，所述机壳包括四侧板，所述两抵止板分别抵靠在所述显卡及其中一侧板上。
优选地，所述基板还包括一连接所述两抵止板的第一连接板，所述第一连接板两端均设有用于固定所述散热模组的固定板。
优选地，所述基板还包括一连接所述两抵止板的第二连接板，所述第二连接板平行于所述第一连接板，所述伸缩部开设在所述第二连接板上。
优选地，所述两抵止板、所述第一连接板及所述第二连接板共同围成一用以让气流通过的通风孔。
优选地，所述卡扣板包括一顶板及两连接在所述顶板两端的限位板，所述两限位板在远离所述顶板处之间形成一缺口，所述导风罩通过所述缺口安装到所述散热模组上。
优选地，所述限位板设有用以固定所述散热模组的一第一引导板、一第二引导板及一第三引导板，所述第一引导板及所述第二引导板之间的连线与所述引导限位板的延伸方向不在同一条直线上。
优选地，所述散热模组包括一风扇支架，所述风扇支架包括两框架，所述导风罩固定到所述两框架上。
优选地，所述导风罩包括两相互平行的限位板，所述框架包括四长度相等的连杆，所述两限位板之间的距离小于所述连杆长度。
相较于现有技术，在上述导风罩中，所述基板的第二连接板设有一可弹性变形的伸缩部，所述卡扣板通过所述伸缩部的弹性拉伸而紧紧卡扣在所述散热模组的风扇支架上，从而方便所述导风罩的安装及拆卸。同时，所述导风罩两侧的抵止板分别抵靠在所述侧板及所述显卡上从而有效避免热气流回流导致的循环加热现象发生，从而保证了散热模组的散热效果。
附图说明
图1是本发明导风罩与一散热模组的一立体分解图。
图2是图1中的导风罩的一立体示意图。
图3是图1中的导风罩与散热模组的一立体组装图。
图4是图1中的导风罩与散热模组的一另一视角的立体组装图。
图5是导风罩、散热模组及一机壳的一立体组装图。
主要元件符号说明
基板 10
第一连接板 11
固定板 111
第二连接板 12
伸缩部 121
抵止板 15
通风孔 16
卡扣板 20
顶板 21
限位板 22
第一引导板 221
第二引导板 222
第三引导板 223
操作部 225
缺口 23
散热模组 30
散热器 31
安装部 311
风扇 32
风扇支架 33
第一框架 331
第二框架 332
连杆 333
紧固件 40
机壳 50
底板 51
侧板 52
排风口 521
主板 55
显卡 551
导风罩 100
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明的一较佳实施方式中，一种导风罩100用以为一散热模组30引导气流，所述散热模组30用于对一安装在一机壳50（参阅图5）内的电子元件（图中未示）进行散热。
请参阅图1及图2，所述导风罩100包括一基板10及一垂直连接在所述基板10上的卡扣板20。所述基板10包括一第一连接板11、一第二连接板12及两抵止板15，所述第一连接板11及所述第二连接板12相互平行，所述两抵止板15通过所述第一连接板11及所述第二连接板12相连，所述第一连接板11、所述第二连接板12及两抵止板15共同围成一用以让气流进入所述散热模组30的通风孔16。所述第一连接板11两侧朝向所述通风孔16均凸设有一固定板111，所述第二连接板12包括一可弹性形变的伸缩部121。
所述卡扣板20开设在所述通风孔16周围，所述卡扣板20包括一顶板21及连接在所述顶板21两端的两限位板22，所述顶板21垂直连接于所述第一连接板11，所述两限位板22分别垂直连接于所述两抵止板15。所述两限位板22在远离所述顶板21处之间形成一缺口23，所述导风罩100通过所述缺口安装到所述散热模组30上。所述限位板22在远离所述顶板21一端设有一第一引导板221，所述限位板22在靠近所述顶板21处设有一第二引导板222，所述限位板22在所述第一引导板221及所述第二引导板222之间还设有一第三引导板223。所述第一引导板221及所述第二引导板222均开设在所述限位板22远离所述基板10的一侧上，所述第三引导板223开设在所述限位板22靠近所述基板10的一侧上，所述第一引导板221及所述第二引导板222之间的连线与所述第三引导板223的延伸方向不在同一条直线上。所述两限位板22上的第一引导板221、所述第二引导板222及所述第三引导板223均朝向所述通风孔16。所述两限位板22在相互远离的一侧还设有一操作部225。
请继续参阅图1，所述散热模组30包括一散热器31、一风扇32（参阅图4）及一用以收容所述风扇32的风扇支架33。所述散热器31包括四安装部311，一紧固件40可穿过所述安装部311从而将所述散热器31固定到一主板55（参阅图5）上。所述风扇32固定在所述风扇支架33上，气流通过所述风扇32的一入风口进入所述风扇32，然后穿过所述散热器31而带走热量，最后从所述风扇32的一出风口排出。所述风扇支架33包括两框架，所述两框架分别为一第一框架331及一第二框架332，所述第一框架331及所述第二框架332均包含长度相等的四连杆333，所述第一框架331可固定到所述散热器31上，所述卡扣板20的两限位板22之间的距离小于所述连杆333的长度，所述导风罩100能够固定到所述第二框架332上。
请参阅图5，所述机壳50包括一底板51及四依次相连的侧板52，所述主板55安装在所述底板51上，所述主板55上还设有若干显卡551。其中一与所述散热模组30的出风口对应的侧板52上设有一排风口521，气流能够从所述排风口521中排出机壳50。
请参阅图3至图5，组装时，将所述风扇32安装到所述风扇支架33上，再将所述风扇支架33的第一框架331固定到所述散热器31上，此时，所述散热模组30组装完成。将所述散热模组30与所述主板55上的电子元件对齐，并将所述散热模组30的四安装部311放置到所述主板55上，使用所述紧固件40将所述安装部311固定到所述主板55上从而将所述散热模组30固定到所述主板55上。将所述卡扣板20的缺口23对准所述第二框架332，朝所述主板55的方向按压所述导风罩100，所述第二连接板12的伸缩部121弹性变形而方便所述第二框架332通过所述缺口插入所述两限位板22之间，继续按压所述导风罩100，直至所述第二框架332抵靠在所述顶板21上，所述第一引导板221及所述第二引导板222固定在所述第二框架332一侧，且所述第三引导板223及所述固定板111固定在所述第二框架332另一侧，所述两限位板22由于所述第二连接板12的伸缩部121被弹性拉伸产生回复力而紧紧抵靠在所述第二框架332上。此时，所述导风罩100固定到所述散热模组30上。当需要将所述导风罩100拆下时，只要紧紧扣住所述两限位板22的操作部225并向远离所述主板55的方向拉动即可将所述导风罩100从所述散热模组30上拆卸下来。
请参阅图5，当所述风扇32工作时，气流穿过所述导风罩100的通风孔16并进入所述散热模组30中从而对所述电子元件进行散热，所述导风罩100两侧的抵止板15分别抵靠在其中一侧板52及所述显卡551上，从而阻挡热气流回流而从所述入风口被吸入所述散热模组30中，所述热气流直接从所述排风口521中排出。
在上述导风罩100中，所述基板10的第二连接板12设有可弹性变形的伸缩部121，所述卡扣板20通过所述伸缩部121弹性拉伸产生的回复力而紧紧卡扣在所述散热模组30的风扇支架33上，从而无需使用工具即可将所述导风罩100的安装及拆卸。同时，所述导风罩100两侧的抵止板15分别抵靠在其中以侧板52及所述显卡551上从而有效避免热气流回流导致的循环加热现象发生，从而保证了散热模组30的散热效果。

Claims (7)

1.一种导风罩，用以固定安装到一散热模组上，所述导风罩及所述散热模组均收容于一机壳内，其特征在于：所述导风罩包括一基板及一垂直连接在所述基板上的卡扣板，所述基板包括一能够弹性变形的伸缩部，所述卡扣板通过所述伸缩部弹性变形而卡扣到所述散热模组上，所述基板抵靠在所述机壳上从而防止热气流回流，所述机壳内设有一安装了电子元件及显卡的主板，所述散热模组及所述导风罩均固定在所述主板上，所述基板包括两抵止板，所述机壳包括四侧板，所述两抵止板分别抵靠在所述显卡及其中一侧板上，所述基板还包括一连接所述两抵止板的第一连接板，所述第一连接板两端均设有用于固定所述散热模组的固定板。
2.如权利要求1所述的导风罩，其特征在于：所述基板还包括一连接所述两抵止板的第二连接板，所述第二连接板平行于所述第一连接板，所述伸缩部开设在所述第二连接板上。
3.如权利要求2所述的导风罩，其特征在于：所述两抵止板、所述第一连接板及所述第二连接板共同围成一用以让气流通过的通风孔。
4.如权利要求1所述的导风罩，其特征在于：所述卡扣板包括一顶板及两限位板，所述两限位板分别连接在所述顶板的两端，所述两限位板在远离所述顶板处之间形成一缺口，所述导风罩通过所述缺口安装到所述散热模组上。
5.如权利要求4所述的导风罩，其特征在于：所述限位板设有用以固定所述散热模组的一第一引导板板、一第二引导板板及一第三引导板板，所述第一引导板及所述第二引导板之间的连线与所述第三引导板的延伸方向不在同一条直线上。
6.如权利要求1所述的导风罩，其特征在于：所述散热模组包括一风扇支架，所述风扇支架包括两框架，所述导风罩固定到所述两框架上。
7.如权利要求6所述的导风罩，其特征在于：所述导风罩包括两限位板，所述两限位板之间相互平行，所述框架包括四长度相等的连杆，所述两限位板之间的距离小于所述连杆长度。
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