JP4230679B2 - 半導体樹脂モールド装置および半導体樹脂モールド方法 - Google Patents

半導体樹脂モールド装置および半導体樹脂モールド方法 Download PDF

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Publication number
JP4230679B2
JP4230679B2 JP2001188772A JP2001188772A JP4230679B2 JP 4230679 B2 JP4230679 B2 JP 4230679B2 JP 2001188772 A JP2001188772 A JP 2001188772A JP 2001188772 A JP2001188772 A JP 2001188772A JP 4230679 B2 JP4230679 B2 JP 4230679B2
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JP
Japan
Prior art keywords
suction
resin
tape substrate
mold
resin tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001188772A
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English (en)
Japanese (ja)
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JP2002079547A (ja
JP2002079547A5 (https=
Inventor
美佳 桐谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
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Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2001188772A priority Critical patent/JP4230679B2/ja
Priority to US09/887,104 priority patent/US6787093B2/en
Publication of JP2002079547A publication Critical patent/JP2002079547A/ja
Publication of JP2002079547A5 publication Critical patent/JP2002079547A5/ja
Application granted granted Critical
Publication of JP4230679B2 publication Critical patent/JP4230679B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2001188772A 2000-06-26 2001-06-21 半導体樹脂モールド装置および半導体樹脂モールド方法 Expired - Fee Related JP4230679B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001188772A JP4230679B2 (ja) 2000-06-26 2001-06-21 半導体樹脂モールド装置および半導体樹脂モールド方法
US09/887,104 US6787093B2 (en) 2000-06-26 2001-06-25 Semiconductor resin molding method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000190547 2000-06-26
JP2000-190547 2000-06-26
JP2001188772A JP4230679B2 (ja) 2000-06-26 2001-06-21 半導体樹脂モールド装置および半導体樹脂モールド方法

Publications (3)

Publication Number Publication Date
JP2002079547A JP2002079547A (ja) 2002-03-19
JP2002079547A5 JP2002079547A5 (https=) 2005-10-20
JP4230679B2 true JP4230679B2 (ja) 2009-02-25

Family

ID=26594629

Family Applications (1)

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JP2001188772A Expired - Fee Related JP4230679B2 (ja) 2000-06-26 2001-06-21 半導体樹脂モールド装置および半導体樹脂モールド方法

Country Status (2)

Country Link
US (1) US6787093B2 (https=)
JP (1) JP4230679B2 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
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JP4769380B2 (ja) * 2001-05-18 2011-09-07 ルネサスエレクトロニクス株式会社 クリーニング用シートおよびそれを用いた半導体装置の製造方法
JP4583020B2 (ja) * 2003-11-17 2010-11-17 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP5128047B2 (ja) * 2004-10-07 2013-01-23 Ｔｏｗａ株式会社 光デバイス及び光デバイスの生産方法
JP4548199B2 (ja) * 2005-04-22 2010-09-22 株式会社デンソー 電子回路装置の製造方法
JP4744947B2 (ja) * 2005-06-23 2011-08-10 本田技研工業株式会社 電子制御ユニット及びその製造方法
US7985357B2 (en) * 2005-07-12 2011-07-26 Towa Corporation Method of resin-sealing and molding an optical device
US7712213B2 (en) * 2005-12-02 2010-05-11 Aai Corporation Angular encapsulation of tandem stacked printed circuit boards
JP2008066696A (ja) * 2006-08-10 2008-03-21 Denso Corp 半導体製造装置および半導体製造方法
US8252615B2 (en) 2006-12-22 2012-08-28 Stats Chippac Ltd. Integrated circuit package system employing mold flash prevention technology
US8852986B2 (en) * 2007-05-16 2014-10-07 Stats Chippac Ltd. Integrated circuit package system employing resilient member mold system technology
TWI344226B (en) * 2007-10-29 2011-06-21 Ind Tech Res Inst Method of packaging light emitted diode
JP5280102B2 (ja) * 2008-05-26 2013-09-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2010153466A (ja) * 2008-12-24 2010-07-08 Elpida Memory Inc 配線基板
US8705065B2 (en) * 2009-03-26 2014-04-22 Brother Kogyo Kabushiki Kaisha System, device and storage device storing a program for selectively preventing scanned images from being displayed
JP2013021199A (ja) * 2011-07-13 2013-01-31 Apic Yamada Corp 樹脂吸着搬送方法及び樹脂吸着搬送装置並びに樹脂封止方法
JP5877083B2 (ja) * 2012-02-14 2016-03-02 住友重機械工業株式会社 樹脂封止装置及び樹脂封止方法
JP5587464B2 (ja) * 2013-05-30 2014-09-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR102545290B1 (ko) * 2018-08-29 2023-06-16 삼성전자주식회사 반도체 패키지 몰딩 장치
CN110277323B (zh) * 2019-06-28 2021-05-11 广东工业大学 扇出型模块负压封装工艺、结构以及设备
DE102020214020A1 (de) 2020-11-09 2022-05-12 Robert Bosch Gesellschaft mit beschränkter Haftung Positionssensor und Führungswagen mit einem Positionssensor und Verfahren zur Herstellung eines Positionssensors
JP7468906B2 (ja) * 2021-04-26 2024-04-16 アピックヤマダ株式会社 樹脂封止装置
US11729915B1 (en) 2022-03-22 2023-08-15 Tactotek Oy Method for manufacturing a number of electrical nodes, electrical node module, electrical node, and multilayer structure
CN115648532B (zh) * 2022-10-31 2025-11-25 长电科技管理有限公司 半导体封装注塑模具、注塑装置及半导体封装注塑方法

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US4944908A (en) * 1988-10-28 1990-07-31 Eaton Corporation Method for forming a molded plastic article
JPH02295140A (ja) 1989-05-09 1990-12-06 Nec Corp 半導体装置の樹脂封止方法
US5029418A (en) * 1990-03-05 1991-07-09 Eastman Kodak Company Sawing method for substrate cutting operations
US5147821A (en) * 1990-09-28 1992-09-15 Motorola, Inc. Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation
JPH0555280A (ja) 1991-08-27 1993-03-05 Nec Corp 樹脂封止型半導体装置の樹脂封止方法
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JP2971834B2 (ja) * 1997-06-27 1999-11-08 松下電子工業株式会社 樹脂封止型半導体装置の製造方法
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JP2002079547A (ja) 2002-03-19
US6787093B2 (en) 2004-09-07
US20020020940A1 (en) 2002-02-21

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