JP4206359B2 - 処理液供給装置 - Google Patents
処理液供給装置 Download PDFInfo
- Publication number
- JP4206359B2 JP4206359B2 JP2004131037A JP2004131037A JP4206359B2 JP 4206359 B2 JP4206359 B2 JP 4206359B2 JP 2004131037 A JP2004131037 A JP 2004131037A JP 2004131037 A JP2004131037 A JP 2004131037A JP 4206359 B2 JP4206359 B2 JP 4206359B2
- Authority
- JP
- Japan
- Prior art keywords
- ceiling plate
- liquid supply
- liquid
- substrate
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0422—Apparatus for fluid treatment for etching for wet etching
- H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
- Chemically Coating (AREA)
Description
10 下部処理部
20 上部処理部
11、21 筐体
12、22 天井板
13、23 液供給路
14、24 液排出路
30 支持コロ
31,32 回転軸(支持軸)
221 凹部
222 軸受部
223 底部
224 液抜き路
225 液孔
226 共通路
321 液孔
322 貫通液孔
40 液抜き路
Claims (6)
- 通過する基板の上面に対向する上部天井板、前記上部天井板の基板搬送方向の一方側に設けられ、前記上部天井板の下面側に処理液を供給する上部液供給路部、及び他方側に設けられ、前記供給された処理液を前記上部天井板の下面側から吸引排出する上部液排出路部とを備えた上部処理部と、前記上部処理部に対向配置され、通過する基板の下面に対向する下部天井板、前記下部天井板の基板搬送方向の一方側に設けられ、前記下部天井板の上面側に処理液を供給する下部液供給路部、及び他方側に設けられ、前記供給された処理液を前記下部天井板の上面側から吸引排出する下部液排出路部とを備えた下部処理部とを備えた処理液供給装置において、
前記下部天井板は、上面側に形成された所要個数の凹部と、この凹部に上端が前記下部天井板の上面から突出する高さ位置で支持軸回りに回転可能に取り付けられた回転支持体とを有し、前記凹部には、その底部に液抜き路が形成されていることを特徴とする処理液供給装置。 - 前記凹部は、前記下部天井板に形成された切欠部であり、前記回転支持体は、前記切欠部に支持された、幅方向に平行な支持軸に回転可能に軸支され、前記液抜き路は、前記切欠部の底部から下方に向けて形成された小孔であることを特徴とする請求項1記載の処理液供給装置。
- 前記凹部は、幅方向に所定個数、かつ搬送方向に所定個数だけ設けられていることを特徴とする請求項1又は2記載の処理液供給装置。
- 前記液抜き路は、前記下部処理部に形成された共通路に連通されていることを特徴とする請求項1〜3のいずれか1項に記載の処理液供給装置。
- 前記支持軸は、前記回転支持体の内周面に対向する外周面まで延長された洗浄液供給孔が形成されていることを特徴とする請求項1〜4のいずれか1項に記載の処理液供給装置。
- 前記回転支持体は、外周面が紡錘形状に形成されたものであることを特徴とする請求項1〜5のいずれか1項に記載の処理液供給装置。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004131037A JP4206359B2 (ja) | 2004-04-27 | 2004-04-27 | 処理液供給装置 |
| TW094110730A TW200609562A (en) | 2004-04-27 | 2005-04-04 | Treatment liquid supply apparatus |
| KR1020050034450A KR100670630B1 (ko) | 2004-04-27 | 2005-04-26 | 처리액 공급장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004131037A JP4206359B2 (ja) | 2004-04-27 | 2004-04-27 | 処理液供給装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005313014A JP2005313014A (ja) | 2005-11-10 |
| JP4206359B2 true JP4206359B2 (ja) | 2009-01-07 |
Family
ID=35441015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004131037A Expired - Fee Related JP4206359B2 (ja) | 2004-04-27 | 2004-04-27 | 処理液供給装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4206359B2 (ja) |
| KR (1) | KR100670630B1 (ja) |
| TW (1) | TW200609562A (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100753498B1 (ko) | 2005-08-02 | 2007-08-31 | 가부시키가이샤 퓨쳐비전 | 처리액 공급장치 |
| KR100785403B1 (ko) * | 2006-11-27 | 2007-12-13 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
| KR100873236B1 (ko) * | 2007-06-14 | 2008-12-10 | 주식회사 실트론 | 웨이퍼 처리 장치 |
| JP5372695B2 (ja) * | 2009-10-19 | 2013-12-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| KR101307006B1 (ko) * | 2012-03-14 | 2013-09-26 | 주식회사 디엠에스 | 기판처리장치 |
| KR102872414B1 (ko) * | 2022-07-06 | 2025-10-23 | 주식회사 티에스에어텍 | 스파이럴 덕트의 내부 절삭유 청소장치 |
| CN116175869B (zh) * | 2022-10-31 | 2023-07-25 | 江苏正力新能电池技术有限公司 | 一种电池顶盖的表面处理装置 |
-
2004
- 2004-04-27 JP JP2004131037A patent/JP4206359B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-04 TW TW094110730A patent/TW200609562A/zh not_active IP Right Cessation
- 2005-04-26 KR KR1020050034450A patent/KR100670630B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060046703A (ko) | 2006-05-17 |
| TW200609562A (en) | 2006-03-16 |
| JP2005313014A (ja) | 2005-11-10 |
| TWI306960B (ja) | 2009-03-01 |
| KR100670630B1 (ko) | 2007-01-17 |
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