JP4204840B2 - 基板処埋装置 - Google Patents

基板処埋装置 Download PDF

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Publication number
JP4204840B2
JP4204840B2 JP2002295323A JP2002295323A JP4204840B2 JP 4204840 B2 JP4204840 B2 JP 4204840B2 JP 2002295323 A JP2002295323 A JP 2002295323A JP 2002295323 A JP2002295323 A JP 2002295323A JP 4204840 B2 JP4204840 B2 JP 4204840B2
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JP
Japan
Prior art keywords
gas
substrate
reaction chamber
supplied
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2002295323A
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English (en)
Japanese (ja)
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JP2004134466A5 (enExample
JP2004134466A (ja
Inventor
正憲 境
徹 加賀谷
信人 嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2002295323A priority Critical patent/JP4204840B2/ja
Priority to PCT/JP2003/012786 priority patent/WO2004034454A1/ja
Priority to US10/530,527 priority patent/US20060150905A1/en
Priority to TW092127905A priority patent/TWI232518B/zh
Publication of JP2004134466A publication Critical patent/JP2004134466A/ja
Publication of JP2004134466A5 publication Critical patent/JP2004134466A5/ja
Priority to US12/039,686 priority patent/US7713582B2/en
Application granted granted Critical
Publication of JP4204840B2 publication Critical patent/JP4204840B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
JP2002295323A 2002-10-08 2002-10-08 基板処埋装置 Expired - Lifetime JP4204840B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2002295323A JP4204840B2 (ja) 2002-10-08 2002-10-08 基板処埋装置
PCT/JP2003/012786 WO2004034454A1 (ja) 2002-10-08 2003-10-06 基板処理装置
US10/530,527 US20060150905A1 (en) 2002-10-08 2003-10-06 Substrate processing apparatus
TW092127905A TWI232518B (en) 2002-10-08 2003-10-08 Substrate processing device
US12/039,686 US7713582B2 (en) 2002-10-08 2008-02-28 Substrate processing method for film formation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002295323A JP4204840B2 (ja) 2002-10-08 2002-10-08 基板処埋装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008176472A Division JP4814914B2 (ja) 2008-07-07 2008-07-07 基板処理装置及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2004134466A JP2004134466A (ja) 2004-04-30
JP2004134466A5 JP2004134466A5 (enExample) 2005-10-13
JP4204840B2 true JP4204840B2 (ja) 2009-01-07

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Family Applications (1)

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JP2002295323A Expired - Lifetime JP4204840B2 (ja) 2002-10-08 2002-10-08 基板処埋装置

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US (2) US20060150905A1 (enExample)
JP (1) JP4204840B2 (enExample)
TW (1) TWI232518B (enExample)
WO (1) WO2004034454A1 (enExample)

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JP4718141B2 (ja) * 2004-08-06 2011-07-06 東京エレクトロン株式会社 薄膜形成方法及び薄膜形成装置
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JP4506677B2 (ja) 2005-03-11 2010-07-21 東京エレクトロン株式会社 成膜方法、成膜装置及び記憶媒体
US8202367B2 (en) 2006-03-30 2012-06-19 Mitsui Engineering & Shipbuilding Co., Ltd. Atomic layer growing apparatus
JP4461441B2 (ja) 2006-08-07 2010-05-12 エルピーダメモリ株式会社 半導体装置の製造方法
JP5235293B2 (ja) * 2006-10-02 2013-07-10 東京エレクトロン株式会社 処理ガス供給機構および処理ガス供給方法ならびにガス処理装置
US20080213479A1 (en) * 2007-02-16 2008-09-04 Tokyo Electron Limited SiCN film formation method and apparatus
JP5383332B2 (ja) * 2008-08-06 2014-01-08 株式会社日立国際電気 基板処理装置、基板処理方法及び半導体装置の製造方法
JP2010084156A (ja) * 2008-09-29 2010-04-15 Tokyo Electron Ltd 処理ガス供給系及び成膜装置
JP5233562B2 (ja) * 2008-10-04 2013-07-10 東京エレクトロン株式会社 成膜方法及び成膜装置
JP5325759B2 (ja) * 2009-12-21 2013-10-23 ラムバス・インコーポレーテッド 半導体装置の製造方法
JP5742185B2 (ja) 2010-03-19 2015-07-01 東京エレクトロン株式会社 成膜装置、成膜方法、回転数の最適化方法及び記憶媒体
JP5872141B2 (ja) * 2010-05-20 2016-03-01 東京エレクトロン株式会社 基板処理装置、その制御装置およびその制御方法
JP2010206218A (ja) * 2010-06-07 2010-09-16 Hitachi Kokusai Electric Inc シリコン酸化膜の形成方法
JP5920242B2 (ja) 2012-06-02 2016-05-18 東京エレクトロン株式会社 成膜方法及び成膜装置
JP6222833B2 (ja) * 2013-01-30 2017-11-01 株式会社日立国際電気 基板処理装置、半導体装置の製造方法およびプログラム
DE102013020662A1 (de) 2013-12-06 2015-06-11 Kienle + Spiess Gmbh Verfahren zur Herstellung von Lamellen für ein Lamellenpaket, insbesondere für elektrische Maschinen und Generatoren,Vorrichtung mit wenigstens einer Stanzpresse sowie nach dem Verfahren hergestellte Lamelle und Lamellenpaket.
JP5859586B2 (ja) * 2013-12-27 2016-02-10 株式会社日立国際電気 基板処理システム、半導体装置の製造方法および記録媒体
WO2015041376A1 (ja) * 2014-09-30 2015-03-26 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および反応管
KR102264257B1 (ko) * 2014-12-30 2021-06-14 삼성전자주식회사 막 형성 방법 및 이를 이용한 반도체 장치 제조 방법
WO2017138087A1 (ja) * 2016-02-09 2017-08-17 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP6773880B2 (ja) 2017-02-23 2020-10-21 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法、コンピュータプログラムおよび処理容器
CN115513101B (zh) * 2022-11-15 2023-01-24 深圳仕上电子科技有限公司 一种等离子蚀刻清洗工艺

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JPS62106627A (ja) * 1985-11-05 1987-05-18 Hitachi Ltd 半導体製造装置
JPH01296613A (ja) * 1988-05-25 1989-11-30 Nec Corp ３−ｖ族化合物半導体の気相成長方法
JPH02199820A (ja) * 1989-01-30 1990-08-08 Fujitsu Ltd 気相処理装置
JP3126787B2 (ja) * 1992-01-30 2001-01-22 理化学研究所 成膜方法および成膜装置
JPH0645256A (ja) * 1992-07-21 1994-02-18 Rikagaku Kenkyusho ガスパルスの供給方法およびこれを用いた成膜方法
JPH07176519A (ja) * 1993-12-17 1995-07-14 Shibaura Eng Works Co Ltd 放電処理装置
JPH07325279A (ja) 1994-06-01 1995-12-12 Dainippon Screen Mfg Co Ltd 減圧処理装置及び方法
US5955037A (en) * 1996-12-31 1999-09-21 Atmi Ecosys Corporation Effluent gas stream treatment system having utility for oxidation treatment of semiconductor manufacturing effluent gases
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JP3529989B2 (ja) * 1997-09-12 2004-05-24 株式会社東芝 成膜方法及び半導体装置の製造方法
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KR100332313B1 (ko) * 2000-06-24 2002-04-12 서성기 Ａｌｄ 박막증착장치 및 증착방법
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Also Published As

Publication number Publication date
TW200423253A (en) 2004-11-01
US7713582B2 (en) 2010-05-11
WO2004034454A1 (ja) 2004-04-22
US20080160214A1 (en) 2008-07-03
TWI232518B (en) 2005-05-11
JP2004134466A (ja) 2004-04-30
US20060150905A1 (en) 2006-07-13

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