JP4199914B2 - ポジ型レジスト組成物 - Google Patents
ポジ型レジスト組成物 Download PDFInfo
- Publication number
- JP4199914B2 JP4199914B2 JP2000363338A JP2000363338A JP4199914B2 JP 4199914 B2 JP4199914 B2 JP 4199914B2 JP 2000363338 A JP2000363338 A JP 2000363338A JP 2000363338 A JP2000363338 A JP 2000363338A JP 4199914 B2 JP4199914 B2 JP 4199914B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- substituent
- acid
- represented
- hydrogen atom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 0 C*C(C1*C)C(C2)SC1C2S[*+]C Chemical compound C*C(C1*C)C(C2)SC1C2S[*+]C 0.000 description 11
- KWOLFJPFCHCOCG-UHFFFAOYSA-N CC(c1ccccc1)=O Chemical compound CC(c1ccccc1)=O KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D213/00—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members
- C07D213/02—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members
- C07D213/04—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom
- C07D213/60—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
- C07D213/62—Oxygen or sulfur atoms
- C07D213/63—One oxygen atom
- C07D213/64—One oxygen atom attached in position 2 or 6
- C07D213/643—2-Phenoxypyridines; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D498/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms
- C07D498/02—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms in which the condensed system contains two hetero rings
- C07D498/04—Ortho-condensed systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000363338A JP4199914B2 (ja) | 2000-11-29 | 2000-11-29 | ポジ型レジスト組成物 |
TW090127859A TW538315B (en) | 2000-11-29 | 2001-11-09 | Positive resist composition |
KR1020010075065A KR100817189B1 (ko) | 2000-11-29 | 2001-11-29 | 포지티브 레지스트 조성물 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000363338A JP4199914B2 (ja) | 2000-11-29 | 2000-11-29 | ポジ型レジスト組成物 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002169287A JP2002169287A (ja) | 2002-06-14 |
JP2002169287A5 JP2002169287A5 (enrdf_load_stackoverflow) | 2006-01-12 |
JP4199914B2 true JP4199914B2 (ja) | 2008-12-24 |
Family
ID=18834462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000363338A Expired - Lifetime JP4199914B2 (ja) | 2000-11-29 | 2000-11-29 | ポジ型レジスト組成物 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4199914B2 (enrdf_load_stackoverflow) |
KR (1) | KR100817189B1 (enrdf_load_stackoverflow) |
TW (1) | TW538315B (enrdf_load_stackoverflow) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1035441A1 (en) * | 1999-03-09 | 2000-09-13 | Matsushita Electric Industrial Co., Ltd. | Pattern formation method |
JP4190167B2 (ja) * | 2000-09-26 | 2008-12-03 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
JPWO2003007080A1 (ja) * | 2001-07-12 | 2004-11-04 | 株式会社半導体先端テクノロジーズ | 微細パターン形成方法 |
US20040248042A1 (en) * | 2001-10-03 | 2004-12-09 | Minoru Toriumi | Method of forming fine pattern |
JP2003140345A (ja) * | 2001-11-02 | 2003-05-14 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
WO2004040376A1 (ja) | 2002-10-29 | 2004-05-13 | Jsr Corporation | 感放射線性樹脂組成物 |
JP4502715B2 (ja) * | 2004-03-05 | 2010-07-14 | 東京応化工業株式会社 | 液浸露光用ポジ型レジスト組成物およびレジストパターンの形成方法 |
JP5353043B2 (ja) * | 2008-04-11 | 2013-11-27 | 信越化学工業株式会社 | 環状オレフィン付加重合体及びその製造方法 |
CN111285963A (zh) * | 2020-02-28 | 2020-06-16 | 宁波南大光电材料有限公司 | 含羟基的酸扩散抑制剂及其制备方法与光刻胶组合物 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2659025B2 (ja) * | 1990-01-24 | 1997-09-30 | 富士通株式会社 | 放射線用レジスト及びその製造方法及びパターン形成方法 |
JP2944857B2 (ja) * | 1993-06-25 | 1999-09-06 | 日本電信電話株式会社 | オーバーコート材料 |
JPH0954437A (ja) * | 1995-06-05 | 1997-02-25 | Fuji Photo Film Co Ltd | 化学増幅型ポジレジスト組成物 |
JP3922673B2 (ja) * | 1998-04-22 | 2007-05-30 | 富士フイルム株式会社 | ポジ型感光性樹脂組成物及びパターン形成方法 |
JP3824288B2 (ja) * | 1998-05-26 | 2006-09-20 | 富士写真フイルム株式会社 | ポジ型感光性樹脂組成物 |
TWI250379B (en) * | 1998-08-07 | 2006-03-01 | Az Electronic Materials Japan | Chemical amplified radiation-sensitive composition which contains onium salt and generator |
JP4161358B2 (ja) * | 1998-12-22 | 2008-10-08 | Jsr株式会社 | 感放射線性樹脂組成物 |
JP4019403B2 (ja) * | 1999-03-08 | 2007-12-12 | Jsr株式会社 | レジストパターンの形成方法 |
JP2000298346A (ja) * | 1999-04-14 | 2000-10-24 | Toray Ind Inc | ポジ型感放射線性組成物およびこれを用いたレジストパターンの製造法 |
JP4281152B2 (ja) * | 1999-05-14 | 2009-06-17 | Jsr株式会社 | スルホン酸オニウム塩化合物および感放射線性樹脂組成物 |
JP3861966B2 (ja) * | 2000-02-16 | 2006-12-27 | 信越化学工業株式会社 | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 |
US6468712B1 (en) * | 2000-02-25 | 2002-10-22 | Massachusetts Institute Of Technology | Resist materials for 157-nm lithography |
JP3410707B2 (ja) * | 2000-04-19 | 2003-05-26 | 松下電器産業株式会社 | パターン形成材料及びパターン形成方法 |
JP4019247B2 (ja) * | 2000-06-02 | 2007-12-12 | 信越化学工業株式会社 | 高分子化合物、レジスト材料及びパターン形成方法 |
JP2002107932A (ja) * | 2000-10-03 | 2002-04-10 | Toray Ind Inc | 感放射線性組成物 |
JP2002194085A (ja) * | 2000-10-20 | 2002-07-10 | Jsr Corp | ポリシロキサン |
-
2000
- 2000-11-29 JP JP2000363338A patent/JP4199914B2/ja not_active Expired - Lifetime
-
2001
- 2001-11-09 TW TW090127859A patent/TW538315B/zh not_active IP Right Cessation
- 2001-11-29 KR KR1020010075065A patent/KR100817189B1/ko not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2002169287A (ja) | 2002-06-14 |
KR20020042503A (ko) | 2002-06-05 |
KR100817189B1 (ko) | 2008-03-27 |
TW538315B (en) | 2003-06-21 |
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