JP4198166B2 - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
- Publication number
- JP4198166B2 JP4198166B2 JP2006204188A JP2006204188A JP4198166B2 JP 4198166 B2 JP4198166 B2 JP 4198166B2 JP 2006204188 A JP2006204188 A JP 2006204188A JP 2006204188 A JP2006204188 A JP 2006204188A JP 4198166 B2 JP4198166 B2 JP 4198166B2
- Authority
- JP
- Japan
- Prior art keywords
- gate electrode
- multiplication
- potential
- electrode
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003384 imaging method Methods 0.000 title claims description 59
- 239000000969 carrier Substances 0.000 claims description 21
- 230000005684 electric field Effects 0.000 claims description 17
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000009792 diffusion process Methods 0.000 description 36
- 238000009825 accumulation Methods 0.000 description 17
- 230000003321 amplification Effects 0.000 description 11
- 238000003199 nucleic acid amplification method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000005036 potential barrier Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000006641 stabilisation Effects 0.000 description 6
- 238000011105 stabilization Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
11 p型シリコン基板
12 p型ウェル領域
13 フォトダイオード部(蓄積部)
14 フローティングディフュージョン(保持部)
15 リセットドレイン(リセット用電荷排出部)
17、18、19 転送ゲート電極(転送電極)
20 増倍ゲート電極(増倍電極)
20a 増倍部
21 読出ゲート電極(読出電極)
23 リセットゲート電極
Claims (4)
- 光電変換機能を有するとともに、光電変換により生成されたキャリアを蓄積するための蓄積部と、
電界による衝突電離によりキャリアを増倍するための電界を印加する増倍電極を含む増倍部と、
前記キャリアを保持する保持部と、
前記増倍部から前記保持部へ前記キャリアを読み出すための読出電極とを備え、
少なくとも前記蓄積部、前記増倍部、前記保持部、および前記読出電極を1つの画素内に含み、
前記読出電極の電位をオン状態の電位にした後、前記増倍電極をオフ状態の電位にして前記キャリアを前記保持部に転送するとともに、少なくとも前記保持部に転送された前記キャリアに対応する信号を読み出すまでの間、前記読出電極のオン状態の電位を維持する、撮像装置。 - 前記保持部の電位を初期化するリセット電極をさらに備え、
前記読出電極の電位は、前記保持部の初期化前からオン状態の電位になっている、請求項1に記載の撮像装置。 - 前記増倍部は、前記読出電極に隣接するように配置されている、請求項1または2に記載の撮像装置。
- 前記蓄積部から前記増倍部にキャリアを転送するための転送電極をさらに備え、
前記読出電極の電位は、前記増倍部と前記転送電極との間で繰り返しキャリアの増倍が行われる増倍期間中にはオフ状態の電位になっている、請求項1〜3のいずれか1項に記載の撮像装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006204188A JP4198166B2 (ja) | 2006-07-27 | 2006-07-27 | 撮像装置 |
US11/782,220 US7834304B2 (en) | 2006-07-27 | 2007-07-24 | Imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006204188A JP4198166B2 (ja) | 2006-07-27 | 2006-07-27 | 撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008035015A JP2008035015A (ja) | 2008-02-14 |
JP4198166B2 true JP4198166B2 (ja) | 2008-12-17 |
Family
ID=38985800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006204188A Expired - Fee Related JP4198166B2 (ja) | 2006-07-27 | 2006-07-27 | 撮像装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7834304B2 (ja) |
JP (1) | JP4198166B2 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7969492B2 (en) * | 2007-08-28 | 2011-06-28 | Sanyo Electric Co., Ltd. | Image pickup apparatus |
JP2009130015A (ja) * | 2007-11-21 | 2009-06-11 | Sanyo Electric Co Ltd | 撮像装置 |
JP2009278241A (ja) | 2008-05-13 | 2009-11-26 | Canon Inc | 固体撮像装置の駆動方法および固体撮像装置 |
JP2010003868A (ja) * | 2008-06-20 | 2010-01-07 | Sanyo Electric Co Ltd | 撮像装置 |
JP2010027668A (ja) * | 2008-07-15 | 2010-02-04 | Sanyo Electric Co Ltd | 撮像装置 |
JP5258551B2 (ja) * | 2008-12-26 | 2013-08-07 | キヤノン株式会社 | 固体撮像装置、その駆動方法及び撮像システム |
JP2010204092A (ja) * | 2009-02-05 | 2010-09-16 | Sanyo Electric Co Ltd | 電荷増加装置 |
FR2973160B1 (fr) * | 2011-03-23 | 2013-03-29 | E2V Semiconductors | Capteur d'image a multiplication d'electrons |
JPWO2013084839A1 (ja) | 2011-12-09 | 2015-04-27 | ソニー株式会社 | 撮像装置、電子機器、輝尽発光検出スキャナーおよび撮像方法 |
CN104247399A (zh) | 2012-04-20 | 2014-12-24 | 索尼公司 | 半导体光电检测器和放射线检测器 |
JP5924132B2 (ja) * | 2012-05-28 | 2016-05-25 | 株式会社デンソー | 固体撮像素子 |
CN104838645A (zh) | 2012-12-20 | 2015-08-12 | 索尼公司 | 成像元件、成像装置、电子设备、阈值计算装置和成像方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3483261B2 (ja) | 1992-07-10 | 2004-01-06 | テキサス インスツルメンツ インコーポレイテツド | イメージセンサ |
GB2323471B (en) | 1997-03-22 | 2002-04-17 | Eev Ltd | CCd imagers |
US6278142B1 (en) | 1999-08-30 | 2001-08-21 | Isetex, Inc | Semiconductor image intensifier |
JP3689866B2 (ja) | 2002-05-30 | 2005-08-31 | 日本テキサス・インスツルメンツ株式会社 | Cmd及びcmd搭載ccd装置 |
JP2004165467A (ja) | 2002-11-14 | 2004-06-10 | Toshiba Corp | 半導体撮像装置及びイメージセンサ |
WO2006068107A1 (ja) | 2004-12-21 | 2006-06-29 | National University Corporation Toyohashi University Of Technology | 電荷蓄積増倍装置及びそれを用いたイメージセンサ |
JP2006204188A (ja) | 2005-01-28 | 2006-08-10 | Matsushita Electric Ind Co Ltd | Co2インキュベータ |
JP4807783B2 (ja) | 2006-05-31 | 2011-11-02 | ルネサスエレクトロニクス株式会社 | 電荷検出素子 |
JP2009130015A (ja) * | 2007-11-21 | 2009-06-11 | Sanyo Electric Co Ltd | 撮像装置 |
-
2006
- 2006-07-27 JP JP2006204188A patent/JP4198166B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-24 US US11/782,220 patent/US7834304B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008035015A (ja) | 2008-02-14 |
US20080024636A1 (en) | 2008-01-31 |
US7834304B2 (en) | 2010-11-16 |
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