JP4174263B2 - 樹脂モールド方法 - Google Patents

樹脂モールド方法 Download PDF

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Publication number
JP4174263B2
JP4174263B2 JP2002234669A JP2002234669A JP4174263B2 JP 4174263 B2 JP4174263 B2 JP 4174263B2 JP 2002234669 A JP2002234669 A JP 2002234669A JP 2002234669 A JP2002234669 A JP 2002234669A JP 4174263 B2 JP4174263 B2 JP 4174263B2
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Japan
Prior art keywords
mold
clamper
lower mold
cavity
air
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JP2002234669A
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English (en)
Japanese (ja)
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JP2004074461A5 (cg-RX-API-DMAC7.html
JP2004074461A (ja
Inventor
直也 後藤
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Apic Yamada Corp
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Apic Yamada Corp
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Priority to JP2002234669A priority Critical patent/JP4174263B2/ja
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Publication of JP2004074461A5 publication Critical patent/JP2004074461A5/ja
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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2002234669A 2002-08-12 2002-08-12 樹脂モールド方法 Expired - Lifetime JP4174263B2 (ja)

Priority Applications (1)

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JP2002234669A JP4174263B2 (ja) 2002-08-12 2002-08-12 樹脂モールド方法

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Application Number Priority Date Filing Date Title
JP2002234669A JP4174263B2 (ja) 2002-08-12 2002-08-12 樹脂モールド方法

Publications (3)

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JP2004074461A JP2004074461A (ja) 2004-03-11
JP2004074461A5 JP2004074461A5 (cg-RX-API-DMAC7.html) 2005-11-04
JP4174263B2 true JP4174263B2 (ja) 2008-10-29

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JP2002234669A Expired - Lifetime JP4174263B2 (ja) 2002-08-12 2002-08-12 樹脂モールド方法

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JP (1) JP4174263B2 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220079787A (ko) * 2020-12-04 2022-06-14 아피쿠 야마다 가부시키가이샤 압력감시장치, 수지밀봉장치 및 압력감시방법

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP2006027098A (ja) * 2004-07-16 2006-02-02 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP4778751B2 (ja) * 2004-08-26 2011-09-21 アピックヤマダ株式会社 樹脂モールド金型
JP5128047B2 (ja) 2004-10-07 2013-01-23 Ｔｏｗａ株式会社 光デバイス及び光デバイスの生産方法
US7985357B2 (en) 2005-07-12 2011-07-26 Towa Corporation Method of resin-sealing and molding an optical device
JP4729367B2 (ja) * 2005-08-22 2011-07-20 アピックヤマダ株式会社 樹脂モールド金型
JP4834407B2 (ja) * 2006-01-17 2011-12-14 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
JP2007301950A (ja) * 2006-05-15 2007-11-22 Sumitomo Heavy Ind Ltd 熱硬化性樹脂の成形方法及び成形装置
JP5196925B2 (ja) * 2007-09-13 2013-05-15 住友重機械工業株式会社 樹脂封止金型
JP4551931B2 (ja) * 2008-01-08 2010-09-29 住友重機械工業株式会社 樹脂封止方法
JP4553944B2 (ja) * 2008-01-10 2010-09-29 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
JP5020897B2 (ja) * 2008-06-17 2012-09-05 住友重機械工業株式会社 圧縮成形金型に対する離型フィルム吸着方法および圧縮成形金型
KR101015586B1 (ko) * 2008-07-23 2011-02-17 세크론 주식회사 전자 부품 몰딩 장치
KR200460501Y1 (ko) * 2008-12-15 2012-05-25 타이완 네임 플레이트 컴퍼니 리미티드 도광판 제작을 위한 핫 프레스 장치
JP5234971B2 (ja) * 2009-02-04 2013-07-10 住友重機械工業株式会社 樹脂封止装置及び樹脂封止方法
JP2010161425A (ja) * 2010-04-26 2010-07-22 Panasonic Corp モジュールの製造方法と、その製造設備
JP5786918B2 (ja) * 2013-10-23 2015-09-30 第一精工株式会社 樹脂封止金型およびこれを用いた樹脂封止装置、樹脂封止方法
JP2017212419A (ja) * 2016-05-27 2017-11-30 Ｔｏｗａ株式会社 樹脂封止品製造方法及び樹脂封止装置
JP6886416B2 (ja) * 2018-03-09 2021-06-16 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7177623B2 (ja) * 2018-08-03 2022-11-24 三井化学東セロ株式会社 樹脂モールド成形品の製造方法、樹脂モールド成形品、及びその用途。
JP7505430B2 (ja) * 2021-03-24 2024-06-25 トヨタ自動車株式会社 セパレータの加工装置および加工方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220079787A (ko) * 2020-12-04 2022-06-14 아피쿠 야마다 가부시키가이샤 압력감시장치, 수지밀봉장치 및 압력감시방법
KR102566228B1 (ko) * 2020-12-04 2023-08-14 아피쿠 야마다 가부시키가이샤 압력감시장치, 수지밀봉장치 및 압력감시방법

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