JP4162246B2 - シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 - Google Patents

シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 Download PDF

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Publication number
JP4162246B2
JP4162246B2 JP2005234650A JP2005234650A JP4162246B2 JP 4162246 B2 JP4162246 B2 JP 4162246B2 JP 2005234650 A JP2005234650 A JP 2005234650A JP 2005234650 A JP2005234650 A JP 2005234650A JP 4162246 B2 JP4162246 B2 JP 4162246B2
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Japan
Prior art keywords
silver
acid
salt
plating bath
cyanide
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Expired - Lifetime
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JP2005234650A
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English (en)
Japanese (ja)
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JP2007046142A5 (enrdf_load_stackoverflow
JP2007046142A (ja
Inventor
哲治 西川
惠吾 小幡
雅一 吉本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
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Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
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Priority to JP2005234650A priority Critical patent/JP4162246B2/ja
Publication of JP2007046142A publication Critical patent/JP2007046142A/ja
Publication of JP2007046142A5 publication Critical patent/JP2007046142A5/ja
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Publication of JP4162246B2 publication Critical patent/JP4162246B2/ja
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Expired - Lifetime legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
JP2005234650A 2005-08-12 2005-08-12 シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 Expired - Lifetime JP4162246B2 (ja)

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JP2005234650A JP4162246B2 (ja) 2005-08-12 2005-08-12 シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法

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JP2005234650A JP4162246B2 (ja) 2005-08-12 2005-08-12 シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法

Publications (3)

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JP2007046142A JP2007046142A (ja) 2007-02-22
JP2007046142A5 JP2007046142A5 (enrdf_load_stackoverflow) 2008-02-28
JP4162246B2 true JP4162246B2 (ja) 2008-10-08

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4230775A4 (en) * 2020-11-25 2025-02-26 Mitsubishi Materials Corporation Tin alloy plating solution

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5247142B2 (ja) * 2007-12-19 2013-07-24 株式会社大和化成研究所 銀めっき方法
JP5481282B2 (ja) * 2010-06-07 2014-04-23 神鋼リードミック株式会社 電子部品材
JP5789430B2 (ja) * 2011-06-27 2015-10-07 イハラニッケイ化学工業株式会社 ２−クロロメチルベンズアルデヒドの製造方法、２−クロロメチルベンズアルデヒド含有組成物及びその保管方法
US8980077B2 (en) * 2012-03-30 2015-03-17 Rohm And Haas Electronic Materials Llc Plating bath and method
CN104402784B (zh) * 2014-12-15 2015-10-21 黄河三角洲京博化工研究院有限公司 羟基化合物、巯基化合物及其制备方法、用于制备光学树脂的硫醇组合物
US10385458B2 (en) 2014-12-17 2019-08-20 Atotech Deutschland Gmbh Plating bath composition and method for electroless plating of palladium
JP6432667B2 (ja) 2017-01-31 2018-12-05 三菱マテリアル株式会社 錫合金めっき液
WO2018142776A1 (ja) 2017-01-31 2018-08-09 三菱マテリアル株式会社 錫合金めっき液
EP3835458B1 (en) 2018-07-27 2023-08-16 Mitsubishi Materials Corporation Tin alloy plating solution
JP6645609B2 (ja) 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
JP6822618B1 (ja) * 2019-08-09 2021-01-27 三菱マテリアル株式会社 コネクタ用端子材
WO2021029254A1 (ja) * 2019-08-09 2021-02-18 三菱マテリアル株式会社 コネクタ用端子材
JP7040544B2 (ja) * 2020-02-20 2022-03-23 三菱マテリアル株式会社 コネクタ用端子材
US11578418B2 (en) * 2021-03-29 2023-02-14 Rohm And Haas Electronic Materials Llc (Rhem) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
CN113930814B (zh) * 2021-11-12 2023-07-11 国网山东省电力公司电力科学研究院 一种银合金镀液、电刷镀工艺、银合金镀层及应用

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4230775A4 (en) * 2020-11-25 2025-02-26 Mitsubishi Materials Corporation Tin alloy plating solution

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