JP4141004B2 - チップ部品供給装置 - Google Patents
チップ部品供給装置 Download PDFInfo
- Publication number
- JP4141004B2 JP4141004B2 JP05199198A JP5199198A JP4141004B2 JP 4141004 B2 JP4141004 B2 JP 4141004B2 JP 05199198 A JP05199198 A JP 05199198A JP 5199198 A JP5199198 A JP 5199198A JP 4141004 B2 JP4141004 B2 JP 4141004B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- stopper
- chip
- slider
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000006073 displacement reaction Methods 0.000 claims description 19
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 7
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05199198A JP4141004B2 (ja) | 1998-03-04 | 1998-03-04 | チップ部品供給装置 |
| TW088202950U TW422484U (en) | 1998-03-04 | 1999-02-25 | Electronic component supplying apparatus |
| US09/262,024 US6135264A (en) | 1998-03-04 | 1999-03-04 | Electronic component supplying apparatus |
| US09/676,246 US6253902B1 (en) | 1998-03-04 | 2000-09-29 | Electronic component supplying apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05199198A JP4141004B2 (ja) | 1998-03-04 | 1998-03-04 | チップ部品供給装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11251788A JPH11251788A (ja) | 1999-09-17 |
| JPH11251788A5 JPH11251788A5 (enExample) | 2005-09-02 |
| JP4141004B2 true JP4141004B2 (ja) | 2008-08-27 |
Family
ID=12902331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05199198A Expired - Fee Related JP4141004B2 (ja) | 1998-03-04 | 1998-03-04 | チップ部品供給装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US6135264A (enExample) |
| JP (1) | JP4141004B2 (enExample) |
| TW (1) | TW422484U (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11177285A (ja) * | 1997-12-09 | 1999-07-02 | Taiyo Yuden Co Ltd | チップ部品供給装置 |
| JP4141004B2 (ja) * | 1998-03-04 | 2008-08-27 | 太陽誘電株式会社 | チップ部品供給装置 |
| US6938530B1 (en) * | 1999-09-28 | 2005-09-06 | Sanyo Electric Co., Ltd. | Tablet conveying apparatus and tablet cutting apparatus |
| JP3520008B2 (ja) * | 1999-12-24 | 2004-04-19 | 太陽誘電株式会社 | 電子部品供給装置 |
| US6752291B2 (en) * | 2001-03-29 | 2004-06-22 | Taiyo Yuden Co., Ltd. | Component feeding method, component feeding apparatus, and component feeding unit |
| JP4425146B2 (ja) | 2002-12-02 | 2010-03-03 | パナソニック株式会社 | 部品供給装置 |
| EP2001275A1 (en) * | 2007-06-07 | 2008-12-10 | ISMECA Semiconductor Holding SA | Apparatus and method for separating electronic components |
| JP4533967B2 (ja) * | 2008-12-12 | 2010-09-01 | 太陽誘電株式会社 | バルクフィーダ |
| JP4499182B1 (ja) | 2008-12-12 | 2010-07-07 | 太陽誘電株式会社 | バルクフィーダ |
| GB201405342D0 (en) | 2014-03-25 | 2014-05-07 | British American Tobacco Co | Feed unit |
| GB201405340D0 (en) * | 2014-03-25 | 2014-05-07 | British American Tobacco Co | Feed Unit |
| GB201405341D0 (en) | 2014-03-25 | 2014-05-07 | British American Tobacco Co | Feed unit |
| GB201405337D0 (en) | 2014-03-25 | 2014-05-07 | British American Tobacco Co | Feed unit |
| KR20170125327A (ko) * | 2015-03-06 | 2017-11-14 | 구라시키 보세키 가부시키가이샤 | 물품 공급 장치 |
| EP3438025A4 (en) * | 2016-03-31 | 2019-11-13 | Kurashiki Boseki Kabushiki Kaisha | ARTICLE FEEDER |
| WO2022162916A1 (ja) * | 2021-01-29 | 2022-08-04 | 株式会社Fuji | バルクフィーダ |
| CN115092647B (zh) * | 2022-07-26 | 2023-03-24 | 深圳市良机自动化设备有限公司 | 一种高压低压测试装置及测试系统 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3171291D1 (en) * | 1981-03-12 | 1985-08-14 | Seewer Ag Maschf | Feeding method and device using such method |
| JP3453809B2 (ja) * | 1992-12-10 | 2003-10-06 | 松下電器産業株式会社 | チップ部品供給装置およびチップ部品供給方法 |
| TW348933U (en) * | 1992-12-10 | 1998-12-21 | Matsushita Electric Industrial Co Ltd | Chip component supply equipment |
| DE69535269T2 (de) * | 1994-05-18 | 2007-05-03 | Taiyo Yuden Co., Ltd. | Einrichtung und Verfahren für die Lieferung von Chipkomponenten |
| TW394496U (en) * | 1996-10-31 | 2000-06-11 | Taiyo Yuden Kk | Chip component feeding apparatus |
| JPH1120933A (ja) * | 1997-07-02 | 1999-01-26 | Fuji Mach Mfg Co Ltd | 回路部品供給方法およびパーツフィーダ |
| JP4141004B2 (ja) * | 1998-03-04 | 2008-08-27 | 太陽誘電株式会社 | チップ部品供給装置 |
-
1998
- 1998-03-04 JP JP05199198A patent/JP4141004B2/ja not_active Expired - Fee Related
-
1999
- 1999-02-25 TW TW088202950U patent/TW422484U/zh not_active IP Right Cessation
- 1999-03-04 US US09/262,024 patent/US6135264A/en not_active Expired - Lifetime
-
2000
- 2000-09-29 US US09/676,246 patent/US6253902B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6253902B1 (en) | 2001-07-03 |
| JPH11251788A (ja) | 1999-09-17 |
| US6135264A (en) | 2000-10-24 |
| TW422484U (en) | 2001-02-11 |
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