JP4074434B2 - 半導体の製造に適した構造化ウェハを修正するための加工液およびその方法 - Google Patents

半導体の製造に適した構造化ウェハを修正するための加工液およびその方法 Download PDF

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Publication number
JP4074434B2
JP4074434B2 JP2000603322A JP2000603322A JP4074434B2 JP 4074434 B2 JP4074434 B2 JP 4074434B2 JP 2000603322 A JP2000603322 A JP 2000603322A JP 2000603322 A JP2000603322 A JP 2000603322A JP 4074434 B2 JP4074434 B2 JP 4074434B2
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Japan
Prior art keywords
wafer
abrasive
exposed
copper
polishing
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Expired - Fee Related
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JP2000603322A
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English (en)
Japanese (ja)
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JP2002538284A5 (https=
JP2002538284A (ja
Inventor
エル・チャールズ・ハーディ
ジェニファー・エル・トライス
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP2000603322A 1999-03-10 1999-06-08 半導体の製造に適した構造化ウェハを修正するための加工液およびその方法 Expired - Fee Related JP4074434B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/266,208 US6238592B1 (en) 1999-03-10 1999-03-10 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
US09/266,208 1999-03-10
PCT/US1999/012762 WO2000053691A1 (en) 1999-03-10 1999-06-08 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication

Publications (3)

Publication Number Publication Date
JP2002538284A JP2002538284A (ja) 2002-11-12
JP2002538284A5 JP2002538284A5 (https=) 2006-08-03
JP4074434B2 true JP4074434B2 (ja) 2008-04-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000603322A Expired - Fee Related JP4074434B2 (ja) 1999-03-10 1999-06-08 半導体の製造に適した構造化ウェハを修正するための加工液およびその方法

Country Status (13)

Country Link
US (1) US6238592B1 (https=)
EP (1) EP1163311B1 (https=)
JP (1) JP4074434B2 (https=)
KR (1) KR100577127B1 (https=)
CN (1) CN1141353C (https=)
AT (1) ATE234906T1 (https=)
AU (1) AU4336399A (https=)
BR (1) BR9917199A (https=)
DE (1) DE69906155T2 (https=)
HK (1) HK1043807B (https=)
MY (1) MY117212A (https=)
TW (1) TWI260342B (https=)
WO (1) WO2000053691A1 (https=)

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US6238592B1 (en) 2001-05-29
TWI260342B (en) 2006-08-21
EP1163311B1 (en) 2003-03-19
DE69906155T2 (de) 2004-02-12
AU4336399A (en) 2000-09-28
HK1043807A1 (en) 2002-09-27
DE69906155D1 (de) 2003-04-24
CN1337983A (zh) 2002-02-27
JP2002538284A (ja) 2002-11-12
WO2000053691A1 (en) 2000-09-14
KR20010110655A (ko) 2001-12-13
CN1141353C (zh) 2004-03-10
HK1043807B (en) 2004-03-05
BR9917199A (pt) 2002-01-08
MY117212A (en) 2004-05-31
ATE234906T1 (de) 2003-04-15
KR100577127B1 (ko) 2006-05-10
EP1163311A1 (en) 2001-12-19

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