KR100577127B1 - 반도체 가공에 적합한 구조 웨이퍼 수정용 작동 액체 및방법 - Google Patents

반도체 가공에 적합한 구조 웨이퍼 수정용 작동 액체 및방법 Download PDF

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Publication number
KR100577127B1
KR100577127B1 KR1020017011435A KR20017011435A KR100577127B1 KR 100577127 B1 KR100577127 B1 KR 100577127B1 KR 1020017011435 A KR1020017011435 A KR 1020017011435A KR 20017011435 A KR20017011435 A KR 20017011435A KR 100577127 B1 KR100577127 B1 KR 100577127B1
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South Korea
Prior art keywords
wafer
abrasive
copper
liquid
working liquid
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Expired - Fee Related
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KR1020017011435A
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English (en)
Korean (ko)
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KR20010110655A (ko
Inventor
엘. 찰스 하디
제니퍼 엘. 트리스
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
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Publication of KR20010110655A publication Critical patent/KR20010110655A/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
KR1020017011435A 1999-03-10 1999-06-08 반도체 가공에 적합한 구조 웨이퍼 수정용 작동 액체 및방법 Expired - Fee Related KR100577127B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/266,208 US6238592B1 (en) 1999-03-10 1999-03-10 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
US09/266,208 1999-03-10

Publications (2)

Publication Number Publication Date
KR20010110655A KR20010110655A (ko) 2001-12-13
KR100577127B1 true KR100577127B1 (ko) 2006-05-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017011435A Expired - Fee Related KR100577127B1 (ko) 1999-03-10 1999-06-08 반도체 가공에 적합한 구조 웨이퍼 수정용 작동 액체 및방법

Country Status (13)

Country Link
US (1) US6238592B1 (https=)
EP (1) EP1163311B1 (https=)
JP (1) JP4074434B2 (https=)
KR (1) KR100577127B1 (https=)
CN (1) CN1141353C (https=)
AT (1) ATE234906T1 (https=)
AU (1) AU4336399A (https=)
BR (1) BR9917199A (https=)
DE (1) DE69906155T2 (https=)
HK (1) HK1043807B (https=)
MY (1) MY117212A (https=)
TW (1) TWI260342B (https=)
WO (1) WO2000053691A1 (https=)

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US6238592B1 (en) 2001-05-29
TWI260342B (en) 2006-08-21
EP1163311B1 (en) 2003-03-19
DE69906155T2 (de) 2004-02-12
AU4336399A (en) 2000-09-28
HK1043807A1 (en) 2002-09-27
DE69906155D1 (de) 2003-04-24
CN1337983A (zh) 2002-02-27
JP2002538284A (ja) 2002-11-12
WO2000053691A1 (en) 2000-09-14
KR20010110655A (ko) 2001-12-13
CN1141353C (zh) 2004-03-10
HK1043807B (en) 2004-03-05
BR9917199A (pt) 2002-01-08
MY117212A (en) 2004-05-31
ATE234906T1 (de) 2003-04-15
JP4074434B2 (ja) 2008-04-09
EP1163311A1 (en) 2001-12-19

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