JP4037958B2 - 熱硬化性樹脂組成物 - Google Patents
熱硬化性樹脂組成物 Download PDFInfo
- Publication number
- JP4037958B2 JP4037958B2 JP12796598A JP12796598A JP4037958B2 JP 4037958 B2 JP4037958 B2 JP 4037958B2 JP 12796598 A JP12796598 A JP 12796598A JP 12796598 A JP12796598 A JP 12796598A JP 4037958 B2 JP4037958 B2 JP 4037958B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- carbodiimide
- thermosetting resin
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title claims description 30
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 27
- 229920005989 resin Polymers 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 55
- 150000001718 carbodiimides Chemical class 0.000 claims description 48
- 239000003822 epoxy resin Substances 0.000 claims description 28
- 229920000647 polyepoxide Polymers 0.000 claims description 28
- 150000004984 aromatic diamines Chemical class 0.000 claims description 12
- 125000000962 organic group Chemical group 0.000 claims description 11
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical group C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical group C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 8
- 229920003986 novolac Polymers 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 4
- 239000000843 powder Substances 0.000 description 17
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 12
- 239000005056 polyisocyanate Substances 0.000 description 9
- 229920001228 polyisocyanate Polymers 0.000 description 9
- 238000002156 mixing Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 5
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- ZRALSGWEFCBTJO-UHFFFAOYSA-N guanidine group Chemical group NC(=N)N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- -1 lysine diisocyanate methyl ester Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- NOHQUGRVHSJYMR-UHFFFAOYSA-N 1-chloro-2-isocyanatobenzene Chemical compound ClC1=CC=CC=C1N=C=O NOHQUGRVHSJYMR-UHFFFAOYSA-N 0.000 description 1
- JIABEENURMZTTI-UHFFFAOYSA-N 1-isocyanato-2-[(2-isocyanatophenyl)methyl]benzene Chemical class O=C=NC1=CC=CC=C1CC1=CC=CC=C1N=C=O JIABEENURMZTTI-UHFFFAOYSA-N 0.000 description 1
- QZTWVDCKDWZCLV-UHFFFAOYSA-N 1-isocyanato-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(N=C=O)C=C1 QZTWVDCKDWZCLV-UHFFFAOYSA-N 0.000 description 1
- BDQNKCYCTYYMAA-UHFFFAOYSA-N 1-isocyanatonaphthalene Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1 BDQNKCYCTYYMAA-UHFFFAOYSA-N 0.000 description 1
- KNHJIEOCVVIBIV-UHFFFAOYSA-N 2,3-dimethylphenyl isocyanate Chemical compound CC1=CC=CC(N=C=O)=C1C KNHJIEOCVVIBIV-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- DBZGWWBWDYGSRA-UHFFFAOYSA-N 3-methyl-1-phenyl-2,5-dihydro-1$l^{5}-phosphole 1-oxide Chemical compound C1C(C)=CCP1(=O)C1=CC=CC=C1 DBZGWWBWDYGSRA-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- IXQBIOPGDNZYNA-UHFFFAOYSA-N N=C=O.N=C=O.CC1=CC=CC=C1C1=CC=CC=C1C Chemical compound N=C=O.N=C=O.CC1=CC=CC=C1C1=CC=CC=C1C IXQBIOPGDNZYNA-UHFFFAOYSA-N 0.000 description 1
- SPTUBPSDCZNVSI-UHFFFAOYSA-N N=C=O.N=C=O.COC1=CC=CC=C1C1=CC=CC=C1OC Chemical compound N=C=O.N=C=O.COC1=CC=CC=C1C1=CC=CC=C1OC SPTUBPSDCZNVSI-UHFFFAOYSA-N 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical group 0.000 description 1
- 125000006157 aromatic diamine group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- HAMGRBXTJNITHG-UHFFFAOYSA-N methyl isocyanate Chemical compound CN=C=O HAMGRBXTJNITHG-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/02—Polymeric products of isocyanates or isothiocyanates of isocyanates or isothiocyanates only
- C08G18/025—Polymeric products of isocyanates or isothiocyanates of isocyanates or isothiocyanates only the polymeric products containing carbodiimide groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Epoxy Resins (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12796598A JP4037958B2 (ja) | 1998-05-11 | 1998-05-11 | 熱硬化性樹脂組成物 |
| US09/286,801 US6300425B1 (en) | 1998-05-11 | 1999-04-06 | Thermosetting resin composition |
| EP99302879A EP0957118B1 (en) | 1998-05-11 | 1999-04-13 | Thermosetting resin composition |
| DE69908859T DE69908859T2 (de) | 1998-05-11 | 1999-04-13 | Wärmehärtbare Harzzusammensetzung |
| US09/924,305 US6486266B2 (en) | 1998-05-11 | 2001-08-08 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12796598A JP4037958B2 (ja) | 1998-05-11 | 1998-05-11 | 熱硬化性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11322899A JPH11322899A (ja) | 1999-11-26 |
| JPH11322899A5 JPH11322899A5 (cg-RX-API-DMAC7.html) | 2005-09-08 |
| JP4037958B2 true JP4037958B2 (ja) | 2008-01-23 |
Family
ID=14973067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12796598A Expired - Fee Related JP4037958B2 (ja) | 1998-05-11 | 1998-05-11 | 熱硬化性樹脂組成物 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6300425B1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP0957118B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4037958B2 (cg-RX-API-DMAC7.html) |
| DE (1) | DE69908859T2 (cg-RX-API-DMAC7.html) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4037958B2 (ja) * | 1998-05-11 | 2008-01-23 | 日清紡績株式会社 | 熱硬化性樹脂組成物 |
| JP3588263B2 (ja) * | 1998-05-15 | 2004-11-10 | 日清紡績株式会社 | エポキシ樹脂組成物 |
| US8048104B2 (en) | 2000-10-30 | 2011-11-01 | Dendron Gmbh | Device for the implantation of occlusion spirals |
| JP3588317B2 (ja) * | 2000-09-18 | 2004-11-10 | 日清紡績株式会社 | 熱硬化性樹脂組成物及びそれを用いた樹脂付き金属箔、プリプレグ並びにフィルム状接着剤 |
| DE102004003265A1 (de) | 2004-01-21 | 2005-08-11 | Dendron Gmbh | Vorrichtung zur Implantation von elektrisch isolierten Okklusionswendeln |
| US20070073008A1 (en) * | 2005-09-28 | 2007-03-29 | Cookson Singapore Pte, Ltd. | Compositions effective to suppress void formation |
| WO2009145224A1 (ja) * | 2008-05-27 | 2009-12-03 | パナソニック電工株式会社 | プリント配線板用エポキシ樹脂組成物、ソルダーレジスト組成物、樹脂フィルム、樹脂シート、プリプレグ、樹脂付き金属箔、カバーレイ、フレキシブルプリント配線板 |
| EP2423186B1 (de) * | 2010-08-30 | 2017-05-31 | LANXESS Deutschland GmbH | Neuartige haftvermittler auf basis von carbodiimiden, haftvermittlerhaltige, wässrige resorcin-formaldehyd-latex-dispersionen, haftungsverbesserte fasern, verfahren zu deren herstellung und deren verwendung |
| US9326774B2 (en) | 2012-08-03 | 2016-05-03 | Covidien Lp | Device for implantation of medical devices |
| US9808256B2 (en) | 2014-08-08 | 2017-11-07 | Covidien Lp | Electrolytic detachment elements for implant delivery systems |
| US9814466B2 (en) | 2014-08-08 | 2017-11-14 | Covidien Lp | Electrolytic and mechanical detachment for implant delivery systems |
| JP6849268B2 (ja) | 2015-04-06 | 2021-03-24 | 日清紡ケミカル株式会社 | 変性ポリカルボジイミド化合物、硬化剤及び熱硬化性樹脂組成物 |
| JP6849269B2 (ja) | 2015-04-06 | 2021-03-24 | 日清紡ケミカル株式会社 | 変性ポリカルボジイミド化合物、硬化剤及び熱硬化性樹脂組成物 |
| US9717503B2 (en) | 2015-05-11 | 2017-08-01 | Covidien Lp | Electrolytic detachment for implant delivery systems |
| US10058502B2 (en) | 2015-12-31 | 2018-08-28 | L'oreal | Nail polish compositions |
| US10828039B2 (en) | 2016-06-27 | 2020-11-10 | Covidien Lp | Electrolytic detachment for implantable devices |
| US10828037B2 (en) | 2016-06-27 | 2020-11-10 | Covidien Lp | Electrolytic detachment with fluid electrical connection |
| US11051822B2 (en) | 2016-06-28 | 2021-07-06 | Covidien Lp | Implant detachment with thermal activation |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2436740A1 (de) * | 1974-07-30 | 1976-02-12 | Bayer Ag | Verfahren zur herstellung von polyharnstoffen |
| US4218543A (en) * | 1976-05-21 | 1980-08-19 | Bayer Aktiengesellschaft | Rim process for the production of elastic moldings |
| US4607090A (en) * | 1984-08-30 | 1986-08-19 | Texaco Inc. | Reaction injection molded elastomers |
| DE3643241C2 (cg-RX-API-DMAC7.html) | 1985-03-29 | 1990-07-26 | Nisshinbo Industries, Inc., Tokio/Tokyo, Jp | |
| US4812524A (en) * | 1986-05-08 | 1989-03-14 | Pony Industries, Inc. | Polyurea/polyurethane adhesive compositions |
| US4732919A (en) * | 1986-11-06 | 1988-03-22 | Texaco Inc. | Reaction injection molded elastomer made from a quasi-prepolymer of a polyoxyalkylene polyamine and an aromatic isocyanate |
| US4806615A (en) * | 1987-06-01 | 1989-02-21 | Texaco Inc. | Reaction injection molded elastomers prepared from amine terminated polyethers, a blend of an aromatic amine terminated chain extender, a substituted acyclic aliphatic amine terminated chain extender and an aromatic polyisocyanate |
| US5223584A (en) * | 1989-07-11 | 1993-06-29 | Gencorp Inc. | In situ thermoset molecular composites |
| JPH04342713A (ja) | 1991-05-20 | 1992-11-30 | Nippon Paint Co Ltd | 硬化性組成物 |
| JP3470464B2 (ja) | 1994-07-15 | 2003-11-25 | Ｊｓｒ株式会社 | 熱硬化性樹脂組成物 |
| US5576398A (en) | 1995-07-07 | 1996-11-19 | Japan Synthetic Rubber Co., Ltd. | Thermosetting resin composition |
| US5929188A (en) * | 1996-04-30 | 1999-07-27 | Dainichiseika Color & Chemicals Mfg. Co., Ltd. | Polycarbodiimide compound, production process thereof, resin composition, and treatment method of article |
| US5925409A (en) * | 1997-08-27 | 1999-07-20 | Reichhold, Inc. | Resins for lining surfaces |
| JP4037958B2 (ja) * | 1998-05-11 | 2008-01-23 | 日清紡績株式会社 | 熱硬化性樹脂組成物 |
| US6103836A (en) * | 1998-05-15 | 2000-08-15 | Nisshinbo Industries, Inc. | Epoxy resin composition |
-
1998
- 1998-05-11 JP JP12796598A patent/JP4037958B2/ja not_active Expired - Fee Related
-
1999
- 1999-04-06 US US09/286,801 patent/US6300425B1/en not_active Expired - Fee Related
- 1999-04-13 DE DE69908859T patent/DE69908859T2/de not_active Expired - Fee Related
- 1999-04-13 EP EP99302879A patent/EP0957118B1/en not_active Expired - Lifetime
-
2001
- 2001-08-08 US US09/924,305 patent/US6486266B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11322899A (ja) | 1999-11-26 |
| US6300425B1 (en) | 2001-10-09 |
| US6486266B2 (en) | 2002-11-26 |
| EP0957118A3 (en) | 2000-01-05 |
| EP0957118A2 (en) | 1999-11-17 |
| DE69908859T2 (de) | 2004-05-06 |
| US20020004562A1 (en) | 2002-01-10 |
| EP0957118B1 (en) | 2003-06-18 |
| DE69908859D1 (de) | 2003-07-24 |
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