JPH11322899A5 - - Google Patents

Info

Publication number
JPH11322899A5
JPH11322899A5 JP1998127965A JP12796598A JPH11322899A5 JP H11322899 A5 JPH11322899 A5 JP H11322899A5 JP 1998127965 A JP1998127965 A JP 1998127965A JP 12796598 A JP12796598 A JP 12796598A JP H11322899 A5 JPH11322899 A5 JP H11322899A5
Authority
JP
Japan
Prior art keywords
diisocyanate
diaminodiphenyl
aromatic diamine
tolylene
dimethyldiphenylmethane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998127965A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11322899A (ja
JP4037958B2 (ja
Filing date
Publication date
Priority claimed from JP12796598A external-priority patent/JP4037958B2/ja
Priority to JP12796598A priority Critical patent/JP4037958B2/ja
Application filed filed Critical
Priority to US09/286,801 priority patent/US6300425B1/en
Priority to EP99302879A priority patent/EP0957118B1/en
Priority to DE69908859T priority patent/DE69908859T2/de
Publication of JPH11322899A publication Critical patent/JPH11322899A/ja
Priority to US09/924,305 priority patent/US6486266B2/en
Publication of JPH11322899A5 publication Critical patent/JPH11322899A5/ja
Publication of JP4037958B2 publication Critical patent/JP4037958B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP12796598A 1998-05-11 1998-05-11 熱硬化性樹脂組成物 Expired - Fee Related JP4037958B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP12796598A JP4037958B2 (ja) 1998-05-11 1998-05-11 熱硬化性樹脂組成物
US09/286,801 US6300425B1 (en) 1998-05-11 1999-04-06 Thermosetting resin composition
EP99302879A EP0957118B1 (en) 1998-05-11 1999-04-13 Thermosetting resin composition
DE69908859T DE69908859T2 (de) 1998-05-11 1999-04-13 Wärmehärtbare Harzzusammensetzung
US09/924,305 US6486266B2 (en) 1998-05-11 2001-08-08 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12796598A JP4037958B2 (ja) 1998-05-11 1998-05-11 熱硬化性樹脂組成物

Publications (3)

Publication Number Publication Date
JPH11322899A JPH11322899A (ja) 1999-11-26
JPH11322899A5 true JPH11322899A5 (cg-RX-API-DMAC7.html) 2005-09-08
JP4037958B2 JP4037958B2 (ja) 2008-01-23

Family

ID=14973067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12796598A Expired - Fee Related JP4037958B2 (ja) 1998-05-11 1998-05-11 熱硬化性樹脂組成物

Country Status (4)

Country Link
US (2) US6300425B1 (cg-RX-API-DMAC7.html)
EP (1) EP0957118B1 (cg-RX-API-DMAC7.html)
JP (1) JP4037958B2 (cg-RX-API-DMAC7.html)
DE (1) DE69908859T2 (cg-RX-API-DMAC7.html)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4037958B2 (ja) * 1998-05-11 2008-01-23 日清紡績株式会社 熱硬化性樹脂組成物
JP3588263B2 (ja) * 1998-05-15 2004-11-10 日清紡績株式会社 エポキシ樹脂組成物
US8048104B2 (en) 2000-10-30 2011-11-01 Dendron Gmbh Device for the implantation of occlusion spirals
JP3588317B2 (ja) * 2000-09-18 2004-11-10 日清紡績株式会社 熱硬化性樹脂組成物及びそれを用いた樹脂付き金属箔、プリプレグ並びにフィルム状接着剤
DE102004003265A1 (de) 2004-01-21 2005-08-11 Dendron Gmbh Vorrichtung zur Implantation von elektrisch isolierten Okklusionswendeln
US20070073008A1 (en) * 2005-09-28 2007-03-29 Cookson Singapore Pte, Ltd. Compositions effective to suppress void formation
WO2009145224A1 (ja) * 2008-05-27 2009-12-03 パナソニック電工株式会社 プリント配線板用エポキシ樹脂組成物、ソルダーレジスト組成物、樹脂フィルム、樹脂シート、プリプレグ、樹脂付き金属箔、カバーレイ、フレキシブルプリント配線板
EP2423186B1 (de) * 2010-08-30 2017-05-31 LANXESS Deutschland GmbH Neuartige haftvermittler auf basis von carbodiimiden, haftvermittlerhaltige, wässrige resorcin-formaldehyd-latex-dispersionen, haftungsverbesserte fasern, verfahren zu deren herstellung und deren verwendung
US9326774B2 (en) 2012-08-03 2016-05-03 Covidien Lp Device for implantation of medical devices
US9808256B2 (en) 2014-08-08 2017-11-07 Covidien Lp Electrolytic detachment elements for implant delivery systems
US9814466B2 (en) 2014-08-08 2017-11-14 Covidien Lp Electrolytic and mechanical detachment for implant delivery systems
JP6849268B2 (ja) 2015-04-06 2021-03-24 日清紡ケミカル株式会社 変性ポリカルボジイミド化合物、硬化剤及び熱硬化性樹脂組成物
JP6849269B2 (ja) 2015-04-06 2021-03-24 日清紡ケミカル株式会社 変性ポリカルボジイミド化合物、硬化剤及び熱硬化性樹脂組成物
US9717503B2 (en) 2015-05-11 2017-08-01 Covidien Lp Electrolytic detachment for implant delivery systems
US10058502B2 (en) 2015-12-31 2018-08-28 L'oreal Nail polish compositions
US10828039B2 (en) 2016-06-27 2020-11-10 Covidien Lp Electrolytic detachment for implantable devices
US10828037B2 (en) 2016-06-27 2020-11-10 Covidien Lp Electrolytic detachment with fluid electrical connection
US11051822B2 (en) 2016-06-28 2021-07-06 Covidien Lp Implant detachment with thermal activation

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2436740A1 (de) * 1974-07-30 1976-02-12 Bayer Ag Verfahren zur herstellung von polyharnstoffen
US4218543A (en) * 1976-05-21 1980-08-19 Bayer Aktiengesellschaft Rim process for the production of elastic moldings
US4607090A (en) * 1984-08-30 1986-08-19 Texaco Inc. Reaction injection molded elastomers
DE3643241C2 (cg-RX-API-DMAC7.html) 1985-03-29 1990-07-26 Nisshinbo Industries, Inc., Tokio/Tokyo, Jp
US4812524A (en) * 1986-05-08 1989-03-14 Pony Industries, Inc. Polyurea/polyurethane adhesive compositions
US4732919A (en) * 1986-11-06 1988-03-22 Texaco Inc. Reaction injection molded elastomer made from a quasi-prepolymer of a polyoxyalkylene polyamine and an aromatic isocyanate
US4806615A (en) * 1987-06-01 1989-02-21 Texaco Inc. Reaction injection molded elastomers prepared from amine terminated polyethers, a blend of an aromatic amine terminated chain extender, a substituted acyclic aliphatic amine terminated chain extender and an aromatic polyisocyanate
US5223584A (en) * 1989-07-11 1993-06-29 Gencorp Inc. In situ thermoset molecular composites
JPH04342713A (ja) 1991-05-20 1992-11-30 Nippon Paint Co Ltd 硬化性組成物
JP3470464B2 (ja) 1994-07-15 2003-11-25 Ｊｓｒ株式会社 熱硬化性樹脂組成物
US5576398A (en) 1995-07-07 1996-11-19 Japan Synthetic Rubber Co., Ltd. Thermosetting resin composition
US5929188A (en) * 1996-04-30 1999-07-27 Dainichiseika Color & Chemicals Mfg. Co., Ltd. Polycarbodiimide compound, production process thereof, resin composition, and treatment method of article
US5925409A (en) * 1997-08-27 1999-07-20 Reichhold, Inc. Resins for lining surfaces
JP4037958B2 (ja) * 1998-05-11 2008-01-23 日清紡績株式会社 熱硬化性樹脂組成物
US6103836A (en) * 1998-05-15 2000-08-15 Nisshinbo Industries, Inc. Epoxy resin composition

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