JP4036644B2 - Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス - Google Patents

Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス Download PDF

Info

Publication number
JP4036644B2
JP4036644B2 JP2001390544A JP2001390544A JP4036644B2 JP 4036644 B2 JP4036644 B2 JP 4036644B2 JP 2001390544 A JP2001390544 A JP 2001390544A JP 2001390544 A JP2001390544 A JP 2001390544A JP 4036644 B2 JP4036644 B2 JP 4036644B2
Authority
JP
Japan
Prior art keywords
optical
chip mounting
optical path
optical signal
mounting substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001390544A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002329891A5 (https=
JP2002329891A (ja
Inventor
元雄 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP2001390544A priority Critical patent/JP4036644B2/ja
Publication of JP2002329891A publication Critical patent/JP2002329891A/ja
Publication of JP2002329891A5 publication Critical patent/JP2002329891A5/ja
Application granted granted Critical
Publication of JP4036644B2 publication Critical patent/JP4036644B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
JP2001390544A 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス Expired - Fee Related JP4036644B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001390544A JP4036644B2 (ja) 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000391550 2000-12-22
JP2000-391550 2000-12-22
JP2001390544A JP4036644B2 (ja) 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス

Publications (3)

Publication Number Publication Date
JP2002329891A JP2002329891A (ja) 2002-11-15
JP2002329891A5 JP2002329891A5 (https=) 2005-07-14
JP4036644B2 true JP4036644B2 (ja) 2008-01-23

Family

ID=26606450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001390544A Expired - Fee Related JP4036644B2 (ja) 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス

Country Status (1)

Country Link
JP (1) JP4036644B2 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003083543A1 (en) 2002-04-01 2003-10-09 Ibiden Co., Ltd. Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method
US7070207B2 (en) 2003-04-22 2006-07-04 Ibiden Co., Ltd. Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
KR100791186B1 (ko) * 2003-04-23 2008-01-02 다이요 잉키 세이조 가부시키가이샤 광 도파로, 광전기 혼재 기판 및 이 광전기 혼재 기판의제조 방법
JP2005079385A (ja) 2003-09-01 2005-03-24 Toshiba Corp 光半導体装置および光信号入出力装置
EP1688770B1 (en) * 2003-11-27 2012-11-14 Ibiden Co., Ltd. Ic chip mounting board, substrate for mother board, device for optical communication, method for manufacturing substrate for mounting ic chip thereon, and method for manufacturing substrate for mother board
CN101044422B (zh) * 2004-07-08 2010-05-05 陶氏康宁公司 短程光学互连
DE102004038591A1 (de) * 2004-08-06 2006-02-23 Robert Bosch Gmbh Schnittstellenbaustein
JP2006120956A (ja) 2004-10-22 2006-05-11 Ibiden Co Ltd 多層プリント配線板
JP4646618B2 (ja) 2004-12-20 2011-03-09 イビデン株式会社 光路変換部材、多層プリント配線板および光通信用デバイス
JP4797407B2 (ja) * 2005-02-07 2011-10-19 日立化成工業株式会社 配線基板の製造方法、半導体チップ搭載基板の製造方法及び半導体パッケージの製造方法
JP4810958B2 (ja) * 2005-02-28 2011-11-09 ソニー株式会社 ハイブリット回路装置
TWI290820B (en) * 2005-10-13 2007-12-01 Phoenix Prec Technology Corp Circuit board structure of integrated optoelectronic component
US7674987B2 (en) 2007-03-29 2010-03-09 Ibiden Co., Ltd. Multilayer printed circuit board
US7919849B2 (en) 2007-04-04 2011-04-05 Ibiden Co., Ltd. Package substrate and device for optical communication
US7783141B2 (en) 2007-04-04 2010-08-24 Ibiden Co., Ltd. Substrate for mounting IC chip and device for optical communication
JP4767228B2 (ja) * 2007-07-30 2011-09-07 京セラ株式会社 光伝送基板とその製造方法、光伝送装置、複合光伝送基板および光電気混載基板
JP5058006B2 (ja) * 2008-01-30 2012-10-24 京セラ株式会社 光伝送基板の製造方法
JP5149759B2 (ja) * 2008-10-01 2013-02-20 日本特殊陶業株式会社 光導波路付き配線基板の製造方法
SE533551C2 (sv) * 2009-02-12 2010-10-26 Senseair Ab En ljusdetektor anpassad att som diskret enhet fästas på en bärare
JP5493744B2 (ja) * 2009-11-12 2014-05-14 富士通株式会社 光電気混載基板、および、光電気混載基板の製造方法
JP5704878B2 (ja) * 2010-09-30 2015-04-22 オリンパス株式会社 光電気変換コネクタ、光伝送モジュール、撮像装置および内視鏡
JP2013054369A (ja) * 2012-10-23 2013-03-21 Ngk Spark Plug Co Ltd 光導波路付き配線基板
JP2022191844A (ja) 2021-06-16 2022-12-28 イビデン株式会社 半導体パッケージ
JP2023038405A (ja) 2021-09-07 2023-03-17 イビデン株式会社 半導体パッケージ

Also Published As

Publication number Publication date
JP2002329891A (ja) 2002-11-15

Similar Documents

Publication Publication Date Title
JP4036644B2 (ja) Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス
US7693382B2 (en) Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication
US8076782B2 (en) Substrate for mounting IC chip
JP3801921B2 (ja) 光通信用デバイス、および、光通信用デバイスの製造方法
JP4540275B2 (ja) Ｉｃチップ実装用基板、および、ｉｃチップ実装用基板の製造方法
JP2003110245A (ja) 光学素子実装用基板の製造方法、光学素子実装用基板及び光学素子
JP4097425B2 (ja) 多層プリント配線板およびその製造方法
JP4703067B2 (ja) Ｉｃチップ実装用基板の製造方法
JP4056315B2 (ja) 光通信用デバイスおよび光通信用デバイスの製造方法
JP5092191B2 (ja) Ｉｃチップ実装用基板
JP4831901B2 (ja) 多層プリント配線板
JP2002289911A (ja) 光通信用デバイス
JP3992553B2 (ja) 光通信用デバイスおよび光通信用デバイスの製造方法
JP4789381B2 (ja) 多層プリント配線板
JP4014464B2 (ja) 光通信用デバイスおよび光通信用デバイスの製造方法
JP2002236228A (ja) 多層プリント配線板
JP3771169B2 (ja) 光通信用デバイス
JP2002270860A (ja) Ｉｃチップ実装用基板
JP4393463B2 (ja) 光通信用デバイス
JP4827809B2 (ja) Ｉｃチップ実装用基板
JP4522079B2 (ja) Ｉｃチップ実装用基板
JP4605955B2 (ja) Ｉｃチップ実装用基板
JP4627942B2 (ja) Ｉｃチップ実装用基板の製造方法
JP2006091744A (ja) パッケージ基板および光通信用デバイス
JP4149481B2 (ja) 多層プリント配線板および多層プリント配線板の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070717

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070913

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20071030

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20071030

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4036644

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101109

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101109

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111109

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111109

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121109

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131109

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees