JP2002329891A5 - - Google Patents

Download PDF

Info

Publication number
JP2002329891A5
JP2002329891A5 JP2001390544A JP2001390544A JP2002329891A5 JP 2002329891 A5 JP2002329891 A5 JP 2002329891A5 JP 2001390544 A JP2001390544 A JP 2001390544A JP 2001390544 A JP2001390544 A JP 2001390544A JP 2002329891 A5 JP2002329891 A5 JP 2002329891A5
Authority
JP
Japan
Prior art keywords
chip mounting
mounting substrate
optical
communication device
optical path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001390544A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002329891A (ja
JP4036644B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001390544A priority Critical patent/JP4036644B2/ja
Priority claimed from JP2001390544A external-priority patent/JP4036644B2/ja
Publication of JP2002329891A publication Critical patent/JP2002329891A/ja
Publication of JP2002329891A5 publication Critical patent/JP2002329891A5/ja
Application granted granted Critical
Publication of JP4036644B2 publication Critical patent/JP4036644B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2001390544A 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス Expired - Fee Related JP4036644B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001390544A JP4036644B2 (ja) 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000391550 2000-12-22
JP2000-391550 2000-12-22
JP2001390544A JP4036644B2 (ja) 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス

Publications (3)

Publication Number Publication Date
JP2002329891A JP2002329891A (ja) 2002-11-15
JP2002329891A5 true JP2002329891A5 (https=) 2005-07-14
JP4036644B2 JP4036644B2 (ja) 2008-01-23

Family

ID=26606450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001390544A Expired - Fee Related JP4036644B2 (ja) 2000-12-22 2001-12-21 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス

Country Status (1)

Country Link
JP (1) JP4036644B2 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003083543A1 (en) 2002-04-01 2003-10-09 Ibiden Co., Ltd. Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method
US7070207B2 (en) 2003-04-22 2006-07-04 Ibiden Co., Ltd. Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
KR100791186B1 (ko) * 2003-04-23 2008-01-02 다이요 잉키 세이조 가부시키가이샤 광 도파로, 광전기 혼재 기판 및 이 광전기 혼재 기판의제조 방법
JP2005079385A (ja) 2003-09-01 2005-03-24 Toshiba Corp 光半導体装置および光信号入出力装置
EP1688770B1 (en) * 2003-11-27 2012-11-14 Ibiden Co., Ltd. Ic chip mounting board, substrate for mother board, device for optical communication, method for manufacturing substrate for mounting ic chip thereon, and method for manufacturing substrate for mother board
CN101044422B (zh) * 2004-07-08 2010-05-05 陶氏康宁公司 短程光学互连
DE102004038591A1 (de) * 2004-08-06 2006-02-23 Robert Bosch Gmbh Schnittstellenbaustein
JP2006120956A (ja) 2004-10-22 2006-05-11 Ibiden Co Ltd 多層プリント配線板
JP4646618B2 (ja) 2004-12-20 2011-03-09 イビデン株式会社 光路変換部材、多層プリント配線板および光通信用デバイス
JP4797407B2 (ja) * 2005-02-07 2011-10-19 日立化成工業株式会社 配線基板の製造方法、半導体チップ搭載基板の製造方法及び半導体パッケージの製造方法
JP4810958B2 (ja) * 2005-02-28 2011-11-09 ソニー株式会社 ハイブリット回路装置
TWI290820B (en) * 2005-10-13 2007-12-01 Phoenix Prec Technology Corp Circuit board structure of integrated optoelectronic component
US7674987B2 (en) 2007-03-29 2010-03-09 Ibiden Co., Ltd. Multilayer printed circuit board
US7919849B2 (en) 2007-04-04 2011-04-05 Ibiden Co., Ltd. Package substrate and device for optical communication
US7783141B2 (en) 2007-04-04 2010-08-24 Ibiden Co., Ltd. Substrate for mounting IC chip and device for optical communication
JP4767228B2 (ja) * 2007-07-30 2011-09-07 京セラ株式会社 光伝送基板とその製造方法、光伝送装置、複合光伝送基板および光電気混載基板
JP5058006B2 (ja) * 2008-01-30 2012-10-24 京セラ株式会社 光伝送基板の製造方法
JP5149759B2 (ja) * 2008-10-01 2013-02-20 日本特殊陶業株式会社 光導波路付き配線基板の製造方法
SE533551C2 (sv) * 2009-02-12 2010-10-26 Senseair Ab En ljusdetektor anpassad att som diskret enhet fästas på en bärare
JP5493744B2 (ja) * 2009-11-12 2014-05-14 富士通株式会社 光電気混載基板、および、光電気混載基板の製造方法
JP5704878B2 (ja) * 2010-09-30 2015-04-22 オリンパス株式会社 光電気変換コネクタ、光伝送モジュール、撮像装置および内視鏡
JP2013054369A (ja) * 2012-10-23 2013-03-21 Ngk Spark Plug Co Ltd 光導波路付き配線基板
JP2022191844A (ja) 2021-06-16 2022-12-28 イビデン株式会社 半導体パッケージ
JP2023038405A (ja) 2021-09-07 2023-03-17 イビデン株式会社 半導体パッケージ

Similar Documents

Publication Publication Date Title
JP2002329891A5 (https=)
KR100965339B1 (ko) 전자부품 내장형 인쇄회로기판 및 그 제조방법
US20110314667A1 (en) Method of manufacturing printed circuit board including electronic component embedded therein
US7087845B2 (en) Metal core multilayer printed wiring board
KR101601815B1 (ko) 임베디드 기판, 인쇄회로기판 및 그 제조 방법
CN112584611B (zh) 具有延伸穿过多个介电层的通孔的部件承载件
KR100257926B1 (ko) 회로기판형성용다층필름 및 이를 사용한 다층회로기판 및 반도체장치용패키지
TW201517712A (zh) 電路板及其製作方法
JP3577421B2 (ja) 半導体装置用パッケージ
JP2001274556A (ja) プリント配線板
TW201448692A (zh) 埋入式高密度互連印刷電路板及其製作方法
JP6669330B2 (ja) 電子部品内蔵型印刷回路基板及びその製造方法
KR20150024643A (ko) 전자부품 내장형 인쇄회로기판 및 그 제조 방법
KR100816324B1 (ko) 칩 내장형 인쇄회로기판 및 그 제조방법
KR20060062896A (ko) 비아포스트에 의해 층간 전도성이 부여된 병렬적 다층인쇄회로기판 및 그 제조 방법
CN104247582B (zh) 印刷电路板及其制造方法
KR100536315B1 (ko) 반도체 패키지 기판 및 그 제조 방법
JP7610503B2 (ja) 印刷配線板及び印刷配線板の製造方法
TWI451826B (zh) 多層電路板及其製作方法
JP4666830B2 (ja) 多層配線基板及びその製造方法
US12402248B2 (en) Wiring substrate
KR20160097801A (ko) 인쇄회로기판 및 그 제조방법
TWI293237B (en) Method for manufacturing a substrate embedded with an electronic component and device from the same
KR100516716B1 (ko) 이중도통홀이 구비된 다층 인쇄회로기판의 제조방법
US20240021440A1 (en) Component Carrier and Method of Manufacturing the Same