JP3996155B2 - 基板内に集積回路を形成する方法及び埋込回路 - Google Patents
基板内に集積回路を形成する方法及び埋込回路 Download PDFInfo
- Publication number
- JP3996155B2 JP3996155B2 JP2004309041A JP2004309041A JP3996155B2 JP 3996155 B2 JP3996155 B2 JP 3996155B2 JP 2004309041 A JP2004309041 A JP 2004309041A JP 2004309041 A JP2004309041 A JP 2004309041A JP 3996155 B2 JP3996155 B2 JP 3996155B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- substrate
- circuit
- antenna
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Description
11 裏面
12 上表面
13 基板本体
14 凹部
16 底面
18 側壁面
20 印刷パッド
21 回路パターン
22 回路
23,24 内部接続部
25,27,28,30,32,33 ノード
26 アンテナ
35 導電性接着材
36 バッテリー
36,38 電気部品
40 キャップ
42 封止材
44 上側表面
44 特許法第
50 シート基板
52,54 凹部
56,60 底面
58 側壁面
62 側壁面
66 第1の部分
68 第2の部分
70 バイパス
72 絶縁材
Claims (4)
- 基板内に集積回路を形成する方法であって、該方法は、
その中に第1凹部及び第2凹部を有する基板を提供する工程と、
前記第1凹部と第2凹部の間、および前記第1凹部及び第2凹部内に導電性フィルムを印刷する工程であって、前記導電性フィルムは前記第1と第2凹部の間及び各凹部内の電気的接続部を形成すると共に、前記第1と第2凹部の何れか一つの凹部に向かって延びるアンテナを形成する工程と、
前記第1凹部内に、その中の前記電気的接続部と電気的に接続される第1電気部品を提供する工程と、
前記第2凹部内に、その中の前記電気的接続部と電気的に接続される第2電気部品を提供する工程と、
前記第1電気部品、前記第2電気部品及び前記導電性フィルムを少なくとも一つの保護カバーで被覆する工程と、
を具備することを特徴とする基板内に集積回路を形成する方法。 - 請求項1記載の方法において、前記基板は人によって携帯されるカード形状のものであることを特徴とする基板の中に集積回路を形成する方法。
- 請求項1記載の方法において、前記第1及び第2凹部は底面と該底面から立ち上がった側壁面を有し、前記第1と第2凹部は前記側壁面のうち少なくとも一つの側壁面によって互いに分離され、前記印刷工程は、前記底面及び前記の少なくとも一つの側壁面に沿って導電性フィルムを印刷する工程を含むことを特徴とする基板の中に集積回路を形成する方法。
- 請求項1記載の方法において、前記基板は表面と裏面を有し、前記第1及び第2凹部は共に前記表面又は裏面の何れか一方の同一面側に設けられることを特徴とする基板の中に集積回路を形成する方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/847,123 US6329213B1 (en) | 1997-05-01 | 1997-05-01 | Methods for forming integrated circuits within substrates |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54744398A Division JP3705444B2 (ja) | 1997-05-01 | 1998-04-29 | 基板内に集積回路を形成する方法及び埋込回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005115959A JP2005115959A (ja) | 2005-04-28 |
JP3996155B2 true JP3996155B2 (ja) | 2007-10-24 |
Family
ID=25299818
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54744398A Expired - Fee Related JP3705444B2 (ja) | 1997-05-01 | 1998-04-29 | 基板内に集積回路を形成する方法及び埋込回路 |
JP2004309041A Expired - Fee Related JP3996155B2 (ja) | 1997-05-01 | 2004-10-25 | 基板内に集積回路を形成する方法及び埋込回路 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54744398A Expired - Fee Related JP3705444B2 (ja) | 1997-05-01 | 1998-04-29 | 基板内に集積回路を形成する方法及び埋込回路 |
Country Status (6)
Country | Link |
---|---|
US (3) | US6329213B1 (ja) |
JP (2) | JP3705444B2 (ja) |
AU (1) | AU7470898A (ja) |
DE (1) | DE19882361T1 (ja) |
GB (1) | GB2339407B (ja) |
WO (1) | WO1998049653A1 (ja) |
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-
1997
- 1997-05-01 US US08/847,123 patent/US6329213B1/en not_active Ceased
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1998
- 1998-04-29 AU AU74708/98A patent/AU7470898A/en not_active Abandoned
- 1998-04-29 DE DE19882361T patent/DE19882361T1/de not_active Ceased
- 1998-04-29 WO PCT/US1998/008902 patent/WO1998049653A1/en active Application Filing
- 1998-04-29 GB GB9925874A patent/GB2339407B/en not_active Expired - Fee Related
- 1998-04-29 JP JP54744398A patent/JP3705444B2/ja not_active Expired - Fee Related
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1999
- 1999-05-04 US US09/305,107 patent/US6271801B2/en not_active Expired - Lifetime
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2003
- 2003-12-10 US US10/734,072 patent/USRE40137E1/en not_active Expired - Lifetime
-
2004
- 2004-10-25 JP JP2004309041A patent/JP3996155B2/ja not_active Expired - Fee Related
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JP2005115959A (ja) | 2005-04-28 |
GB2339407A (en) | 2000-01-26 |
AU7470898A (en) | 1998-11-24 |
US6271801B2 (en) | 2001-08-07 |
USRE40137E1 (en) | 2008-03-04 |
JP3705444B2 (ja) | 2005-10-12 |
GB2339407B (en) | 2001-12-19 |
DE19882361T1 (de) | 2000-05-11 |
US6329213B1 (en) | 2001-12-11 |
US20010002826A1 (en) | 2001-06-07 |
WO1998049653A1 (en) | 1998-11-05 |
JP2001523364A (ja) | 2001-11-20 |
GB9925874D0 (en) | 1999-12-29 |
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