JP3984640B2 - 伝送線路対 - Google Patents
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- JP3984640B2 JP3984640B2 JP2006524148A JP2006524148A JP3984640B2 JP 3984640 B2 JP3984640 B2 JP 3984640B2 JP 2006524148 A JP2006524148 A JP 2006524148A JP 2006524148 A JP2006524148 A JP 2006524148A JP 3984640 B2 JP3984640 B2 JP 3984640B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/088—Stacked transmission lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
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Description
ΔL1=ΔT×v=ΔT×c/√(ε) ・・・ (数1)
ΔL2=ΔT×c/√(ε) ・・・ (数2)
伝送される信号の周波数において上記第1の伝送線路での実効波長の0.5倍以上の結合線路長を有する結合線路領域が形成されるように、上記第1の伝送線路に隣接して配置された第2の伝送線路とを備え、
上記結合線路領域において、
上記第1の伝送線路は、誘電体又は半導体により形成された基板における表面又は当該表面に平行な内層面のいずれかの面に配置され、その伝送方向に対して直線形状を有する第1の信号導体を備え、
上記第2の伝送線路は、当該基板のいずれかの面に配置され、当該配置された面内にてその伝送方向に対して90度を超える角度を有する方向に信号を伝送する複数の伝送方向反転領域を含み、上記第1の信号導体とは異なる線路長さを有する第2の信号導体を備える伝送線路対を提供する。
ΔLeff≧0.5×λ ・・・ (数3)
ΔLeff≧λ ・・・ (数4)
ここで、結合線路長をLcp、第1の伝送線路、第2の伝送線路の実効誘電率をそれぞれε1、ε2とすると、ΔLeffは数5に示すように定義される。
ΔLeff=Lcp×{√(ε2)−√(ε1)} ・・・ (数5)
上記第1の伝送線路において伝送される信号が、上記第2の伝送線路において伝送される信号よりもその信号の伝送速度が大きい第1態様に記載の伝送線路対を提供する。
上記第1の伝送線路と上記第2の伝送線路の上記実効誘電率の差が設定された実効誘電率差設定領域と、
当該実効誘電率の差が設定されていない実効誘電率差非設定領域とを有し、
上記実効誘電率差非設定領域の線路長が、上記第1の伝送線路での上記実効波長の0.5倍より小さい第10態様に記載の伝送線路対を提供する。
Lcp≧0.5×λ/√(ε1) ・・・ (数6)
ΔL1a=ΔT×v1=ΔT×c/√(ε1) ・・・ (数7)
ΔL1b=ΔT×v2=ΔT×c/√(ε2) ・・・ (数8)
ΔLeff≧0.5×λ
さらに好ましくは、数4に示すように、
ΔLeff≧λ
を、本発明の伝送線路対10が満たせば、確実にクロストーク抑圧効果が得られることになる。
本実施形態の伝送線路対20の構造を示す模式斜視図を図4Aに示し、図4Aの伝送線路対20の構造を部分的に拡大する部分拡大上面図を図4Bに示す。
Lcp1<0.5×λg (=λ/√(ε1)) ・・・(数9)
ΔLeff2=Lcp2×{√(ε2)−√(ε1)} ・・・(数10)
まず、実施例1として、誘電率3.8、総厚さ250μmの誘電体基板の表面上に銅配線により厚さ20μm、配線幅Wを100μmとした信号導体を形成し、誘電体基板の裏面全面にも同じく銅配線により厚さ20μmの接地導体層を形成し、結合線路長Lcpを50mmとする平行結合マイクロストリップ線路構造を構成した。なお、これらの値は従来例1の高周波回路と同じ値である。入力端子は同軸コネクタに接続し、出力側の端子は特性インピーダンスとほぼ同じ抵抗値である100Ωの抵抗で接地終端し、端子での信号反射による悪影響を測定結果から減じた。第2の伝送線路においては、図5に上面図を示すように、交互に逆方向に信号を蛇行させるようにそれぞれ0.75回転の螺旋形状に信号導体を配置した。第2の伝送線路の第2の信号導体の総配線幅W2は500μmとした。第1の伝送線路の第1の信号導体は直線とした。それぞれの信号導体の配線領域間距離Gを従来例1の650μmから450μmへと減じることにより、従来例1の伝送線路対での配線間隔Dと同じ750μmの配線間隔を実施例1においても実現した。
次に実施例2にかかる伝送線路対80の構成を示す模式斜視図を図15に示す。図15に示すように、実施例2の伝送線路対80として、上記実施例1の伝送線路対の第2の伝送線路において、その螺旋回転数を1回転とした信号導体の表面を、厚さ100μm、誘電率3.6のエポキシ樹脂によって被覆した伝送線路対を作製した。すなわち、本実施例2の伝送線路対80は、図15に示すように、第1の伝送線路82aの第1の信号導体83aを略直線状に形成し、第2の伝送線路82bの第2の信号導体83bを、その螺旋回転数が1回転に設定された複数の回転方向反転構造29が直列に周期的に配列されるように形成し、さらに、第2の信号導体83bを覆うように追加誘電体291を配置させて形成した。つまり、本実施例2の伝送線路対80は、伝送方向反転部位を備えさせた伝送線路対の構成において、追加誘電体を配置させた構成を有している。
Claims (13)
- 第1の伝送線路と、
伝送される信号の周波数において上記第1の伝送線路での実効波長の0.5倍以上の結合線路長を有する結合線路領域が形成されるように、上記第1の伝送線路に隣接して配置された第2の伝送線路とを備え、
上記結合線路領域において、
上記第1の伝送線路は、誘電体又は半導体により形成された基板における表面又は当該表面に平行な内層面のいずれかの面に配置され、その伝送方向に対して直線形状を有する第1の信号導体を備え、
上記第2の伝送線路は、当該基板のいずれかの面に配置され、当該配置された面内にてその伝送方向に対して90度を超える角度を有する方向に信号を伝送する複数の伝送方向反転領域を含み、上記第1の信号導体とは異なる線路長さを有する第2の信号導体を備える伝送線路対。 - 上記結合線路長と上記第1の伝送線路の実効誘電率の平方根の積と、上記結合線路長と上記第2の伝送線路の実効誘電率の平方根の積との差の絶対値が、上記第1の伝送線路又は上記第2の伝送線路にて伝送される信号の周波数における波長の0.5倍以上である請求項1に記載の伝送線路対。
- 上記結合線路長と上記第1の伝送線路の実効誘電率の平方根の積と、上記結合線路長と上記第2の伝送線路の実効誘電率の平方根の積との差の絶対値が、上記第1の伝送線路又は上記第2の伝送線路にて伝送される信号の周波数における波長の1倍以上である請求項1に記載の伝送線路対。
- 上記伝送方向反転領域は、上記伝送方向に対して180度反転された方向に上記信号を伝送する領域を含む請求項1に記載の伝送線路対。
- 上記結合線路領域において、上記第1の伝送線路よりも上記第2の伝送線路に近接して配置された近接誘電体を備える請求項1に記載の伝送線路対。
- 上記第2の信号導体の表面の少なくとも一部が上記近接誘電体により被覆される請求項5に記載の伝送線路対。
- 上記第2の伝送線路は、上記第1の伝送線路の実効誘電率よりも高い実効誘電率を有し、
上記第1の伝送線路において伝送される信号が、上記第2の伝送線路において伝送される信号よりもその信号の伝送速度が大きい請求項1に記載の伝送線路対。 - 上記結合線路領域において、上記第1の伝送線路は、互いに対を成す2本の伝送線路を含む差動伝送線路を構成する請求項7に記載の伝送線路対。
- 上記第2の伝送線路が能動素子へ電力を供給するバイアス線路である請求項1に記載の伝送線路対。
- 上記結合線路領域において、上記第2の伝送線路は、上記第1の伝送線路の実効誘電率と異なる実効誘電率を有する請求項1に記載の伝送線路対。
- 上記結合線路領域の全体に渡って、上記第1の伝送線路と上記第2の伝送線路の上記実効誘電率の差が設定された実効誘電率差設定領域が配置される請求項10に記載の伝送線路対。
- 上記結合線路領域において、
上記第1の伝送線路と上記第2の伝送線路の上記実効誘電率の差が設定された実効誘電率差設定領域と、
当該実効誘電率の差が設定されていない実効誘電率差非設定領域とを有し、
上記実効誘電率差非設定領域の線路長が、上記第1の伝送線路での上記実効波長の0.5倍より小さい請求項10に記載の伝送線路対。 - 上記結合線路領域において、連続して配置された一の上記実効誘電率差非設定領域の線路長が、上記結合線路長の0.5倍より小さい請求項12に記載の伝送線路対。
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Application Number | Priority Date | Filing Date | Title |
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JP2005097160 | 2005-03-30 | ||
JP2005097160 | 2005-03-30 | ||
PCT/JP2006/306524 WO2006106761A1 (ja) | 2005-03-30 | 2006-03-29 | 伝送線路対 |
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JP3984640B2 true JP3984640B2 (ja) | 2007-10-03 |
JPWO2006106761A1 JPWO2006106761A1 (ja) | 2008-09-11 |
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US (1) | US7414201B2 (ja) |
JP (1) | JP3984640B2 (ja) |
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WO (1) | WO2006106761A1 (ja) |
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JP4372161B2 (ja) * | 2007-01-22 | 2009-11-25 | 日本航空電子工業株式会社 | ケーブル、及び接続部材 |
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CN101841969B (zh) * | 2009-03-17 | 2013-06-05 | 鸿富锦精密工业(深圳)有限公司 | 差分信号线及差分信号线偏移量的补偿方法 |
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CN2384319Y (zh) * | 1997-10-10 | 2000-06-21 | 江年华 | 磁微带线 |
JP2000077911A (ja) * | 1998-09-02 | 2000-03-14 | Murata Mfg Co Ltd | 多層伝送線路及びこれを用いた電子部品 |
JP2002299917A (ja) | 2001-03-29 | 2002-10-11 | Kyocera Corp | 高周波伝送線路 |
JP2003258394A (ja) * | 2002-03-06 | 2003-09-12 | Toshiba Corp | 配線基板 |
EP1376747A3 (en) * | 2002-06-28 | 2005-07-20 | Texas Instruments Incorporated | Common mode rejection in differential pairs using slotted ground planes |
JP4196601B2 (ja) * | 2002-07-05 | 2008-12-17 | トヨタ自動車株式会社 | 変速機の操作機構 |
JP3660338B2 (ja) * | 2002-11-07 | 2005-06-15 | 株式会社東芝 | 伝送線路及び半導体装置 |
JP2004274172A (ja) | 2003-03-05 | 2004-09-30 | Sony Corp | バルン |
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US20070040628A1 (en) | 2007-02-22 |
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US7414201B2 (en) | 2008-08-19 |
CN1969424A (zh) | 2007-05-23 |
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