JP3982635B2 - 反射型発光ダイオード - Google Patents
反射型発光ダイオード Download PDFInfo
- Publication number
- JP3982635B2 JP3982635B2 JP2004570897A JP2004570897A JP3982635B2 JP 3982635 B2 JP3982635 B2 JP 3982635B2 JP 2004570897 A JP2004570897 A JP 2004570897A JP 2004570897 A JP2004570897 A JP 2004570897A JP 3982635 B2 JP3982635 B2 JP 3982635B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead
- concave case
- emitting diode
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
Claims (2)
- 発光素子が発する光を反射して外部に放射する反射面を有する反射型発光ダイオードにおいて、
内部に凹面形状の反射面を有し、周囲の壁部の上部に溝を有する凹状ケースと、
凹状ケースの外部に位置する広幅リード部とその先端側の狭幅リード部とから構成される一対のリード構造と、
前記リード構造の狭幅リード部に搭載された発光素子とから構成され、
前記リード構造は、狭幅リード部が前記凹状ケースの溝に嵌合され、
前記凹状ケースの溝の外部で前記リード構造の狭幅リード部が折り曲げられて、広幅リード部が凹状ケースの外側面に沿っていることを特徴とする反射型発光ダイオード。 - 前記凹状ケースの外側面に沿って折り曲げられた広幅リード部は凹状ケースの底部で内部に向かって折り曲げられ、その折り曲げ部分によって実装用端子が構成されることを特徴とする請求項1記載の反射型発光ダイオード。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/004891 WO2004093204A1 (ja) | 2003-04-16 | 2003-04-16 | 反射型発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2004093204A1 JPWO2004093204A1 (ja) | 2006-07-06 |
JP3982635B2 true JP3982635B2 (ja) | 2007-09-26 |
Family
ID=33193248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004570897A Expired - Fee Related JP3982635B2 (ja) | 2003-04-16 | 2003-04-16 | 反射型発光ダイオード |
Country Status (5)
Country | Link |
---|---|
US (1) | US7420216B2 (ja) |
JP (1) | JP3982635B2 (ja) |
CN (1) | CN100394618C (ja) |
AU (1) | AU2003227413A1 (ja) |
WO (1) | WO2004093204A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110128196A (ko) | 2009-03-16 | 2011-11-28 | 가부시키가이샤 파루 라이팅구 | 반사형 발광 다이오드 및 반사형 발광 다이오드 발광 장치 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3982635B2 (ja) | 2003-04-16 | 2007-09-26 | 株式会社 オプトデバイス研究所 | 反射型発光ダイオード |
JP2009026840A (ja) * | 2007-07-18 | 2009-02-05 | C I Kasei Co Ltd | 発光装置および発光装置の作製方法 |
JP4438842B2 (ja) * | 2007-08-31 | 2010-03-24 | セイコーエプソン株式会社 | 半導体発光素子のための駆動回路およびこれを用いた光源装置、照明装置、モニタ装置、画像表示装置 |
JP2009152227A (ja) * | 2007-12-18 | 2009-07-09 | Pearl Lighting Co Ltd | 反射型発光ダイオード |
JP2009290008A (ja) * | 2008-05-29 | 2009-12-10 | Pearl Lighting Co Ltd | 反射型発光ダイオード |
CN101771129B (zh) * | 2010-01-29 | 2012-11-07 | 王海军 | 反射式大功率led封装结构 |
CN103137823B (zh) * | 2011-11-24 | 2015-10-07 | 展晶科技(深圳)有限公司 | 发光二极管及应用该发光二极管的直下式背光源 |
JP6405697B2 (ja) * | 2014-05-21 | 2018-10-17 | 日亜化学工業株式会社 | 発光装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63191647A (ja) | 1987-02-04 | 1988-08-09 | Canon Inc | インクジエツト記録ヘツド |
JPH0526759Y2 (ja) * | 1987-05-29 | 1993-07-07 | ||
JPH069158A (ja) | 1992-06-26 | 1994-01-18 | Canon Inc | 画像形成装置 |
DE4311530A1 (de) * | 1992-10-02 | 1994-04-07 | Telefunken Microelectron | Optoelektronisches Bauelement mit engem Öffnungswinkel |
JPH07211940A (ja) | 1994-01-21 | 1995-08-11 | Rohm Co Ltd | 平面発光型led発光装置及びその製造方法 |
JP3856250B2 (ja) | 1997-04-23 | 2006-12-13 | シチズン電子株式会社 | Smd型led |
JP3618534B2 (ja) | 1997-11-28 | 2005-02-09 | 同和鉱業株式会社 | 光通信用ランプ装置とその製造方法 |
DE19803936A1 (de) * | 1998-01-30 | 1999-08-05 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Ausdehnungskompensiertes optoelektronisches Halbleiter-Bauelement, insbesondere UV-emittierende Leuchtdiode und Verfahren zu seiner Herstellung |
JP4300500B2 (ja) | 1999-12-27 | 2009-07-22 | 岩崎電気株式会社 | 発光ダイオード及びその製造方法 |
JP2002033523A (ja) | 2000-07-18 | 2002-01-31 | Toshiba Electronic Engineering Corp | 半導体発光装置 |
JP2002299693A (ja) | 2001-04-04 | 2002-10-11 | Nippon Computer Network Kk | 発光ダイオード及び製造方法 |
CN1204632C (zh) * | 2001-09-28 | 2005-06-01 | 李贞勋 | 白色发光二极管的制造方法 |
JP3982635B2 (ja) | 2003-04-16 | 2007-09-26 | 株式会社 オプトデバイス研究所 | 反射型発光ダイオード |
-
2003
- 2003-04-16 JP JP2004570897A patent/JP3982635B2/ja not_active Expired - Fee Related
- 2003-04-16 AU AU2003227413A patent/AU2003227413A1/en not_active Abandoned
- 2003-04-16 CN CNB038262908A patent/CN100394618C/zh not_active Expired - Fee Related
- 2003-04-16 WO PCT/JP2003/004891 patent/WO2004093204A1/ja active Application Filing
- 2003-04-16 US US10/553,122 patent/US7420216B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110128196A (ko) | 2009-03-16 | 2011-11-28 | 가부시키가이샤 파루 라이팅구 | 반사형 발광 다이오드 및 반사형 발광 다이오드 발광 장치 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2004093204A1 (ja) | 2006-07-06 |
AU2003227413A1 (en) | 2004-11-04 |
CN1765022A (zh) | 2006-04-26 |
US20060278881A1 (en) | 2006-12-14 |
CN100394618C (zh) | 2008-06-11 |
WO2004093204A1 (ja) | 2004-10-28 |
US7420216B2 (en) | 2008-09-02 |
AU2003227413A8 (en) | 2004-11-04 |
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