CN1765022A - 反射型发光二极管 - Google Patents

反射型发光二极管 Download PDF

Info

Publication number
CN1765022A
CN1765022A CNA038262908A CN03826290A CN1765022A CN 1765022 A CN1765022 A CN 1765022A CN A038262908 A CNA038262908 A CN A038262908A CN 03826290 A CN03826290 A CN 03826290A CN 1765022 A CN1765022 A CN 1765022A
Authority
CN
China
Prior art keywords
light
emitting diode
lead
leading part
emitting component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA038262908A
Other languages
English (en)
Other versions
CN100394618C (zh
Inventor
山崎繁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
OPTO-DEVICE Co Ltd
TIANYUAN ELECTRIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OPTO-DEVICE Co Ltd, TIANYUAN ELECTRIC CO Ltd filed Critical OPTO-DEVICE Co Ltd
Publication of CN1765022A publication Critical patent/CN1765022A/zh
Application granted granted Critical
Publication of CN100394618C publication Critical patent/CN100394618C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/647Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明涉及一种反射型发光二极管,该反射型发光二极管具有反射发光元件(11)发出的光,将该光辐射到外部的反射面,该反射型发光二极管由凹状壳体(22),一对引线结构和发光元件(11)构成,在该凹状壳体(22)的内部具有凹面形状的反射面(15),在周围的壁部具有槽(17),该一对引线结构由较窄引线部(12)和较宽引线部(18)构成,该发光元件(11)装载于上述引线结构的较窄引线部(12)上,在上述引线结构中,较窄引线部(12)与凹状壳体(22)的槽(17)嵌合。通过形成这样的结构,由于发光元件(11)产生的热量通过较宽引线部(18)排到外部,故可减小反射型发光二极管的热阻,可提高可靠性和实现高输出。此外,由于较宽引线部(18)用以作为安装时的端子使用,故可提高表面安装精度,防止发光二极管的倾斜。

Description

反射型发光二极管
技术领域
本发明涉及安装于印刷电路基板等的表面上的表面安装式反射型发光二极管。特别是涉及一种在不损害反射型发光二极管的辐射效率的情况下,可改善温度特性,并且高精度地安装于印刷电路基板的表面上的反射型发光二极管。
背景技术
在过去,图5所示的表面安装型发光二极管为人们熟知。该过去的表面安装型发光二极管由发光元件41、树脂基板42和透明模制树脂部43构成。当形成上述树脂基板42时,在于基板的内外两面具有导体箔的双面印刷基板的外面上,通过蚀刻法形成电路图案47a,47b,同样在内面上,通过蚀刻法等形成发光元件的阳极46b,阴极46a。然后在切断的侧面上,通过非电解银镀涂等方式,形成将导体箔的内外电连接的侧面连接导体48a,48b。
在象这样形成的树脂基板42的电路图案47a上,通过导电性粘接剂44,粘接发光元件41的一端,发光元件41的另一端通过金丝45,与电路图案47b电连接。通过用透明树脂43覆盖象这样装载有发光元件41的树脂基板42,由此,获得表面安装型发光二极管。
但是,在采用前者的树脂基板的方法中,在由形成于树脂基板上的金属箔形成的电路图案中,由于金属箔较薄,故无法将发光元件产生的热量充分地散发到外部。由此,为了获得较高的输出,大电流动作和高可靠性,具有实用上的问题,由于来自发光元件的辐射沿全方向扩散,故具有无法有效地利用所产生的光的缺点。
另一方面,图6表示未采用上述那样的树脂基板,而使用引线架制造的反射型发光二极管。图6是为强调JP特开平11-163411号文献和JP特开平07-211940号文献中所公开的反射型发光二极管的基本结构部分而进行描述的图。
图6的反射型发光二极管通过下述的过程进行制造。即,该方式为:将发光元件51的一端采用导电性粘接剂52粘接于通过蚀刻或金属模具冲压而成的一对引线56a,56b中的一个,比如引线56a上;接着,采用金丝53将发光元件51的另一端与引线56b电连接;接着,将装载了发光元件51的引线56a,56b按照使发光元件51向下的方式安装于凹状壳体55上;然后将透明树脂54填充于凹状壳体55的凹面部57中。
在这样的反射型发光二极管中,为了使从发光元件辐射的光在暂时通过位于后方的反射面反射后向外部辐射,必须尽可能地将妨碍光路的引线的宽度变窄。由此,为了获得反射率良好的反射型发光二极管,必须减小引线的宽度,在此场合,难于将由发光元件产生的热量通过引线充分地散发到外部。其结果会产生下述等的问题,即,由于引线的热阻增加,故发光元件的温度上升,反射型发光二极管的寿命缩短,而且,伴随温度特性变差的时间的推移,输出下降。
本发明的目的在于提供一种表面安装式反射型发光二极管,在该表面安装式反射型发光二极管中,通过不损害其光学特性,将由发光元件产生的热量有效且主动地散发到外部,由此,可靠性高,并且温度特性优良。
发明内容
为了解决上述课题,本发明涉及一种反射型发光二极管,该反射型发光二极管具有反射发光元件发出的光,将该光辐射到外部的反射面,其特征在于该反射型发光二极管由凹状壳体、一对引线结构和发光元件构成,在该凹状壳体的内部具有凹面形状的反射面,在周围的壁部具有槽,该一对引线结构由较窄引线部和较宽引线部构成,该发光元件装载于上述引线结构的较窄引线部上,在上述引线结构中,较窄引线部与上述凹状壳体的槽嵌合。
通过形成这样的结构,由于由发光元件产生的热量通过较宽引线部排到外部,故可降低反射型发光二极管的热阻,提高反射型发光二极管的可靠性,并实现高输出。
最好,在凹状壳体的槽的外部,上述引线结构的较窄引线部沿上述凹状壳体的外面弯曲。
由于在凹状壳体的外部将较窄引线部弯曲,故弯曲加工容易,并且可使抗弯应力达到最小限,其结果,可将由于弯曲而对发光元件造成的损伤抑制在最小限,不损失可靠性。
另外,最好沿上述凹状壳体的外面弯曲的较宽引线部在凹状壳体的底部朝向内部弯曲,通过该弯曲部分构成安装用端子。这样,由于较宽引线部用以作为安装时的端子使用,故可提高表面安装位置精度,可防止发光二极管的倾斜。
附图说明
图1为用于说明本发明中的一对引线结构和安装于其上的发光元件的图;
图2为用于说明固定装载有发光元件的本发明的引线结构的凹状壳体用的图;
图3为说明装载有发光元件的本发明的引线结构安装于凹状壳体上的状态用的图;
图4为说明装载有发光元件的本发明的一对引线结构安装于凹状壳体上,在凹状壳体的外部弯曲的状态用的图;
图5为表示采用基板的过去的表面安装型发光元件的结构的图;
图6为说明装载有发光元件的过去的引线结构安装于凹状壳体上的状态用的图;
图7为说明装载有发光元件的过去的引线结构安装于凹状壳体上,在凹状壳体的外部弯曲的状态用的图。
用于实施发明的优选形式
下面通过图1~图4,对本发明进行说明。图1为用于说明本发明的引线结构和安装于其上的发光元件的图。在图1中,本发明的一对引线结构由较宽引线部18a,18b和其前端的宽度较小的较窄引线部12a,12b构成。发光元件11的一端采用导电性树脂14固定于设置在较窄引线部12a上的发光元件装载用圆形部位上。另一方面,发光元件11的另一端采用金丝13,与较窄引线部12b电连接。
图2为说明用于固定本发明的引线结构的凹状壳体用的图。图2(a)为凹状壳体的总体立体图,图2(b)为凹状壳体的侧视图。在凹状壳体22的反射面15上,蒸镀有铝或银,或形成有镀层。在构成凹状壳体22的周围的壁部,用于嵌合上述引线结构的一对槽17a,17b相对地形成。
图3为说明装载了发光元件的本发明的引线结构安装于凹状壳体上的状态用的图。在图1,装载有发光元件11的引线结构上下相反,较窄引线部12a,12b分别与凹状壳体22的槽17a,17b嵌合。此时,引线结构在凹状壳体22的内部构成宽度较小的较窄引线部12a,12b,在凹状壳体22的外部构成宽度较大的较宽引线部18a,18b。
接着,在该发光元件11和反射面15之间的间隙中,将包含硬化催化剂的高粘度的透明环氧树脂填充到凹状壳体22的缘面,然后,通过80~105℃的气炉使透明环氧树脂硬化,将较窄引线部12a,12b与凹状壳体22形成一体。
象这样,与凹状壳体22形成一体的较窄引线部12a,12b分别象图4所示的那样,在凹状壳体22的两端的槽17a,17b的外部,沿凹状壳体22的外面弯曲,此外,在凹状壳体22的底部,向凹状壳体22的内面弯曲,构成表面安装型发光二极管。
在过去的反射型发光二极管中,引线宽度较小、热阻高,难于实现高输出,而在本发明中,象上述那样,可获得下述的优良的反射型发光二极管,其中,在凹状壳体22的内部,可极力地减小妨碍辐射光的引线宽度,并且在凹状壳体22的外部,通过增加引线宽度,可降低热阻,并且表面安装精度较高。
另外,由于在凹状壳体22的外部,将较窄引线部12a,12b弯曲,故易于弯曲加工,可减小抗弯应力,故不会破坏凹状壳体22。

Claims (3)

1.一种反射型发光二极管,该反射型发光二极管具有反射发光元件发出的光,将该光辐射到外部的反射面,其特征在于:
该反射型发光二极管由凹状壳体,一对引线结构和发光元件构成,在该凹状壳体的内部具有凹面形状的反射面,在周围的壁部具有槽,该一对引线结构由较窄引线部和较宽引线部构成,该发光元件装载于上述引线结构的较窄引线部上,在上述引线结构中,较窄引线部与上述凹状壳体的槽嵌合。
2.根据权利要求1所述的反射型发光二极管,其特征在于在凹状壳体的槽的外部,上述引线结构的较窄引线部沿上述凹状壳体的外面弯曲。
3.根据权利要求2所述的反射型发光二极管,其特征在于沿上述凹状壳体的外面弯曲的较宽引线部在凹状壳体的底部朝向内部弯曲,通过该弯曲部分构成安装用端子。
CNB038262908A 2003-04-16 2003-04-16 反射型发光二极管 Expired - Fee Related CN100394618C (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/004891 WO2004093204A1 (ja) 2003-04-16 2003-04-16 反射型発光ダイオード

Publications (2)

Publication Number Publication Date
CN1765022A true CN1765022A (zh) 2006-04-26
CN100394618C CN100394618C (zh) 2008-06-11

Family

ID=33193248

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038262908A Expired - Fee Related CN100394618C (zh) 2003-04-16 2003-04-16 反射型发光二极管

Country Status (5)

Country Link
US (1) US7420216B2 (zh)
JP (1) JP3982635B2 (zh)
CN (1) CN100394618C (zh)
AU (1) AU2003227413A1 (zh)
WO (1) WO2004093204A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101771129B (zh) * 2010-01-29 2012-11-07 王海军 反射式大功率led封装结构
CN103137823A (zh) * 2011-11-24 2013-06-05 展晶科技(深圳)有限公司 发光二极管及应用该发光二极管的直下式背光源

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100394618C (zh) 2003-04-16 2008-06-11 株式会社珍珠电球制作所 反射型发光二极管
JP2009026840A (ja) * 2007-07-18 2009-02-05 C I Kasei Co Ltd 発光装置および発光装置の作製方法
JP4438842B2 (ja) * 2007-08-31 2010-03-24 セイコーエプソン株式会社 半導体発光素子のための駆動回路およびこれを用いた光源装置、照明装置、モニタ装置、画像表示装置
JP2009152227A (ja) * 2007-12-18 2009-07-09 Pearl Lighting Co Ltd 反射型発光ダイオード
JP2009290008A (ja) * 2008-05-29 2009-12-10 Pearl Lighting Co Ltd 反射型発光ダイオード
WO2010106963A1 (ja) 2009-03-16 2010-09-23 株式会社 パールライティング 反射型発光ダイオード及び反射型発光ダイオード発光装置
JP6405697B2 (ja) * 2014-05-21 2018-10-17 日亜化学工業株式会社 発光装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63191647A (ja) 1987-02-04 1988-08-09 Canon Inc インクジエツト記録ヘツド
JPH0526759Y2 (zh) * 1987-05-29 1993-07-07
JPH069158A (ja) 1992-06-26 1994-01-18 Canon Inc 画像形成装置
DE4311530A1 (de) * 1992-10-02 1994-04-07 Telefunken Microelectron Optoelektronisches Bauelement mit engem Öffnungswinkel
JPH07211940A (ja) 1994-01-21 1995-08-11 Rohm Co Ltd 平面発光型led発光装置及びその製造方法
JP3856250B2 (ja) 1997-04-23 2006-12-13 シチズン電子株式会社 Smd型led
JP3618534B2 (ja) 1997-11-28 2005-02-09 同和鉱業株式会社 光通信用ランプ装置とその製造方法
DE19803936A1 (de) * 1998-01-30 1999-08-05 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Ausdehnungskompensiertes optoelektronisches Halbleiter-Bauelement, insbesondere UV-emittierende Leuchtdiode und Verfahren zu seiner Herstellung
JP4300500B2 (ja) * 1999-12-27 2009-07-22 岩崎電気株式会社 発光ダイオード及びその製造方法
JP2002033523A (ja) 2000-07-18 2002-01-31 Toshiba Electronic Engineering Corp 半導体発光装置
JP2002299693A (ja) 2001-04-04 2002-10-11 Nippon Computer Network Kk 発光ダイオード及び製造方法
CN1204632C (zh) * 2001-09-28 2005-06-01 李贞勋 白色发光二极管的制造方法
CN100394618C (zh) 2003-04-16 2008-06-11 株式会社珍珠电球制作所 反射型发光二极管

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101771129B (zh) * 2010-01-29 2012-11-07 王海军 反射式大功率led封装结构
CN103137823A (zh) * 2011-11-24 2013-06-05 展晶科技(深圳)有限公司 发光二极管及应用该发光二极管的直下式背光源

Also Published As

Publication number Publication date
CN100394618C (zh) 2008-06-11
AU2003227413A1 (en) 2004-11-04
AU2003227413A8 (en) 2004-11-04
WO2004093204A1 (ja) 2004-10-28
US7420216B2 (en) 2008-09-02
JP3982635B2 (ja) 2007-09-26
JPWO2004093204A1 (ja) 2006-07-06
US20060278881A1 (en) 2006-12-14

Similar Documents

Publication Publication Date Title
US20050035366A1 (en) Light emitting diode
JP3872490B2 (ja) 発光素子収納パッケージ、発光装置および照明装置
JP2004356506A (ja) ガラス封止型発光ダイオード
TW200830560A (en) Housing for optoelectronic component, optoelectronic component and method of manufacturing housing for optoelectronic component
EP2207212B1 (en) Light emitting device package
US20100072502A1 (en) Light-emitting diode
CN100394618C (zh) 反射型发光二极管
JP2668140B2 (ja) 発光モジュール
JP2004228240A (ja) 発光素子収納用パッケージおよび発光装置
JP3938100B2 (ja) Ledランプおよびled照明具
JP2005039194A (ja) 発光素子収納用パッケージおよび発光装置ならびに照明装置
KR100610275B1 (ko) 고출력 발광 다이오드 패키지 및 그 제조방법
KR100714628B1 (ko) 발광 다이오드 패키지
KR20100083907A (ko) Led 패키지 및 이의 제조 방법
US20150187838A1 (en) Light emitting device and method of manufacturing the same
CN102468406B (zh) 发光二极管封装结构及其制造方法
JP4261925B2 (ja) 発光素子収納用パッケージおよび発光装置
CN101079460B (zh) 发光装置
JP2004006438A (ja) 反射型発光ダイオード
JP4177874B2 (ja) 発光装置
CN110662343B (zh) 高反射背光电路板结构及其制作方法
US7696526B2 (en) Surface mount optoelectronic component
JP6064415B2 (ja) 発光装置
JP2652207B2 (ja) 発光ダイオード表示装置
JP2005039193A (ja) 発光素子収納用パッケージおよび発光装置ならびに照明装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20060421

Address after: Japan Osaka

Applicant after: Tabuchi Denki Kabushiki Kaisha

Co-applicant after: Optical Equipment Research Institute Co.,Ltd.

Address before: Japan Osaka

Applicant before: TABUCHI ELECTRIC CO.,LTD.

Co-applicant before: Optical equipment research institute

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: TOSHIBA LIGHTING + TECHNOLOGY CORPORATION

Free format text: FORMER OWNER: PEARL LAMP WORKS LTD.

Effective date: 20150429

C41 Transfer of patent application or patent right or utility model
C56 Change in the name or address of the patentee

Owner name: PEARL LAMP WORKS LTD.

Free format text: FORMER NAME: PEARL ELECTRICITY BALL MANUFACTURING CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Japan Osaka

Patentee after: Pearl Lighting Co.,Ltd.

Patentee after: Optical Equipment Research Institute Co.,Ltd.

Address before: Japan Osaka

Patentee before: Tabuchi Denki Kabushiki Kaisha

Patentee before: Optical Equipment Research Institute Co.,Ltd.

TR01 Transfer of patent right

Effective date of registration: 20150429

Address after: Kanagawa County, Japan

Patentee after: Toshiba Lighting & Technology Corp.

Patentee after: Optical Equipment Research Institute Co.,Ltd.

Address before: Japan Osaka

Patentee before: Pearl Lighting Co.,Ltd.

Patentee before: Optical Equipment Research Institute Co.,Ltd.

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160912

Address after: Kanagawa County, Japan

Patentee after: Toshiba Lighting & Technology Corp.

Address before: Kanagawa County, Japan

Patentee before: Toshiba Lighting & Technology Corp.

Patentee before: Optical Equipment Research Institute Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080611

CF01 Termination of patent right due to non-payment of annual fee