JP3980647B2 - 無機、有機および有機金属パラジウム水素スカベンジャー - Google Patents
無機、有機および有機金属パラジウム水素スカベンジャー Download PDFInfo
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- JP3980647B2 JP3980647B2 JP53614897A JP53614897A JP3980647B2 JP 3980647 B2 JP3980647 B2 JP 3980647B2 JP 53614897 A JP53614897 A JP 53614897A JP 53614897 A JP53614897 A JP 53614897A JP 3980647 B2 JP3980647 B2 JP 3980647B2
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- Prior art keywords
- palladium
- impression
- compound
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims description 104
- 229910052763 palladium Inorganic materials 0.000 title claims description 56
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 title claims description 46
- 239000001257 hydrogen Substances 0.000 title claims description 24
- 229910052739 hydrogen Inorganic materials 0.000 title claims description 24
- 125000002524 organometallic group Chemical group 0.000 title description 2
- 239000000203 mixture Substances 0.000 claims description 72
- 239000000463 material Substances 0.000 claims description 60
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 52
- 150000001875 compounds Chemical class 0.000 claims description 39
- 239000003054 catalyst Substances 0.000 claims description 38
- 229910052697 platinum Inorganic materials 0.000 claims description 28
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 239000003431 cross linking reagent Substances 0.000 claims description 10
- 125000001931 aliphatic group Chemical group 0.000 claims description 9
- 150000002484 inorganic compounds Chemical class 0.000 claims description 5
- 150000002894 organic compounds Chemical class 0.000 claims description 5
- 150000002902 organometallic compounds Chemical class 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910010272 inorganic material Inorganic materials 0.000 claims 2
- 150000002941 palladium compounds Chemical class 0.000 description 48
- 229920001296 polysiloxane Polymers 0.000 description 41
- -1 organometallic palladium compounds Chemical class 0.000 description 40
- 229920000642 polymer Polymers 0.000 description 26
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 20
- 125000000524 functional group Chemical group 0.000 description 17
- 239000004971 Cross linker Substances 0.000 description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 13
- 229910052602 gypsum Inorganic materials 0.000 description 12
- 239000010440 gypsum Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000004132 cross linking Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 229920002554 vinyl polymer Polymers 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 230000003068 static effect Effects 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229910052736 halogen Inorganic materials 0.000 description 8
- 125000001183 hydrocarbyl group Chemical group 0.000 description 8
- 238000006459 hydrosilylation reaction Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 150000001336 alkenes Chemical class 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 150000002367 halogens Chemical class 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 239000011505 plaster Substances 0.000 description 7
- 239000000725 suspension Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 5
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 5
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 229910002666 PdCl2 Inorganic materials 0.000 description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 239000002978 dental impression material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000005070 sampling Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- IBXMKLPFLZYRQZ-UHFFFAOYSA-N 1,5-diphenylpenta-1,4-dien-3-one;palladium Chemical class [Pd].[Pd].C=1C=CC=CC=1C=CC(=O)C=CC1=CC=CC=C1 IBXMKLPFLZYRQZ-UHFFFAOYSA-N 0.000 description 3
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 3
- 229910019032 PtCl2 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 125000000392 cycloalkenyl group Chemical group 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- INIOZDBICVTGEO-UHFFFAOYSA-L palladium(ii) bromide Chemical compound Br[Pd]Br INIOZDBICVTGEO-UHFFFAOYSA-L 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 229920005573 silicon-containing polymer Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RRHPTXZOMDSKRS-PHFPKPIQSA-L (1z,5z)-cycloocta-1,5-diene;dichloropalladium Chemical compound Cl[Pd]Cl.C\1C\C=C/CC\C=C/1 RRHPTXZOMDSKRS-PHFPKPIQSA-L 0.000 description 2
- 239000004912 1,5-cyclooctadiene Substances 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical class C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 229910021605 Palladium(II) bromide Inorganic materials 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 229910020388 SiO1/2 Inorganic materials 0.000 description 2
- 229910020485 SiO4/2 Inorganic materials 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- RBYGDVHOECIAFC-UHFFFAOYSA-L acetonitrile;palladium(2+);dichloride Chemical compound [Cl-].[Cl-].[Pd+2].CC#N.CC#N RBYGDVHOECIAFC-UHFFFAOYSA-L 0.000 description 2
- 125000002877 alkyl aryl group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229940057746 calcet Drugs 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 2
- 125000000068 chlorophenyl group Chemical group 0.000 description 2
- 230000015271 coagulation Effects 0.000 description 2
- 238000005345 coagulation Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000001162 cycloheptenyl group Chemical group C1(=CCCCCC1)* 0.000 description 2
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000000522 cyclooctenyl group Chemical group C1(=CCCCCCC1)* 0.000 description 2
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229940093915 gynecological organic acid Drugs 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 2
- 238000005805 hydroxylation reaction Methods 0.000 description 2
- 238000001802 infusion Methods 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 229910017464 nitrogen compound Inorganic materials 0.000 description 2
- 150000002830 nitrogen compounds Chemical class 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 description 2
- 150000003058 platinum compounds Chemical class 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000002000 scavenging effect Effects 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- RRKODOZNUZCUBN-CCAGOZQPSA-N (1z,3z)-cycloocta-1,3-diene Chemical compound C1CC\C=C/C=C\C1 RRKODOZNUZCUBN-CCAGOZQPSA-N 0.000 description 1
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 1
- PHQVPLFRGMMSCP-UHFFFAOYSA-N 1-chlorocycloocta-1,5-diene Chemical compound ClC1=CCCC=CCC1 PHQVPLFRGMMSCP-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical group C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- BVTLTBONLZSBJC-UHFFFAOYSA-N 2,4,6-tris(ethenyl)-2,4,6-trimethyl-1,3,5,2,4,6-trioxatrisilinane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O1 BVTLTBONLZSBJC-UHFFFAOYSA-N 0.000 description 1
- FAFGMAGIYHHRKN-UHFFFAOYSA-N 2-diphenylphosphanylethyl(diphenyl)phosphane;palladium Chemical compound [Pd].C=1C=CC=CC=1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1=CC=CC=C1.C=1C=CC=CC=1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1=CC=CC=C1 FAFGMAGIYHHRKN-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 206010053567 Coagulopathies Diseases 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910002621 H2PtCl6 Inorganic materials 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- YNHIGQDRGKUECZ-UHFFFAOYSA-L PdCl2(PPh3)2 Substances [Cl-].[Cl-].[Pd+2].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 YNHIGQDRGKUECZ-UHFFFAOYSA-L 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BKPKTOIGWIYKJZ-UHFFFAOYSA-N [bis(ethenyl)-methylsilyl]oxy-bis(ethenyl)-methylsilane Chemical compound C=C[Si](C=C)(C)O[Si](C)(C=C)C=C BKPKTOIGWIYKJZ-UHFFFAOYSA-N 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 238000013006 addition curing Methods 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- TWKVUTXHANJYGH-UHFFFAOYSA-L allyl palladium chloride Chemical class Cl[Pd]CC=C.Cl[Pd]CC=C TWKVUTXHANJYGH-UHFFFAOYSA-L 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- REHNCMANRAWBTN-UHFFFAOYSA-N bis(ethenyl)-[ethenyl(diethyl)silyl]oxy-ethylsilane Chemical compound CC[Si](CC)(C=C)O[Si](CC)(C=C)C=C REHNCMANRAWBTN-UHFFFAOYSA-N 0.000 description 1
- QRHCILLLMDEFSD-UHFFFAOYSA-N bis(ethenyl)-dimethylsilane Chemical compound C=C[Si](C)(C)C=C QRHCILLLMDEFSD-UHFFFAOYSA-N 0.000 description 1
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 description 1
- 150000004758 branched silanes Chemical class 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 150000005829 chemical entities Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- QCDFRRQWKKLIKV-UHFFFAOYSA-M chloroplatinum Chemical compound [Pt]Cl QCDFRRQWKKLIKV-UHFFFAOYSA-M 0.000 description 1
- 230000035602 clotting Effects 0.000 description 1
- 238000001246 colloidal dispersion Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 150000004759 cyclic silanes Chemical class 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- YNHIGQDRGKUECZ-UHFFFAOYSA-N dichloropalladium;triphenylphosphanium Chemical compound Cl[Pd]Cl.C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 YNHIGQDRGKUECZ-UHFFFAOYSA-N 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- KPWVUBSQUODFPP-UHFFFAOYSA-N ethenyl-(ethenyl-methyl-phenylsilyl)oxy-methyl-phenylsilane Chemical compound C=1C=CC=CC=1[Si](C)(C=C)O[Si](C)(C=C)C1=CC=CC=C1 KPWVUBSQUODFPP-UHFFFAOYSA-N 0.000 description 1
- ZZDKMMZBGZPOGS-UHFFFAOYSA-N ethoxy(penta-1,4-dien-3-yl)silane Chemical compound C(=C)C(C=C)[SiH2]OCC ZZDKMMZBGZPOGS-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000004687 hexahydrates Chemical class 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910001504 inorganic chloride Inorganic materials 0.000 description 1
- 229910002094 inorganic tetrachloropalladate Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000004757 linear silanes Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- JFCCVNTYPIUJDJ-UHFFFAOYSA-N methyl-tris(prop-2-enyl)silane Chemical compound C=CC[Si](C)(CC=C)CC=C JFCCVNTYPIUJDJ-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- PBDBXAQKXCXZCJ-UHFFFAOYSA-L palladium(2+);2,2,2-trifluoroacetate Chemical compound [Pd+2].[O-]C(=O)C(F)(F)F.[O-]C(=O)C(F)(F)F PBDBXAQKXCXZCJ-UHFFFAOYSA-L 0.000 description 1
- ZVSLRJWQDNRUDU-UHFFFAOYSA-L palladium(2+);propanoate Chemical compound [Pd+2].CCC([O-])=O.CCC([O-])=O ZVSLRJWQDNRUDU-UHFFFAOYSA-L 0.000 description 1
- LXNAVEXFUKBNMK-UHFFFAOYSA-N palladium(II) acetate Substances [Pd].CC(O)=O.CC(O)=O LXNAVEXFUKBNMK-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- DSQPRECRRGZSCV-UHFFFAOYSA-N penta-1,4-dien-3-yl(phenyl)silane Chemical compound C=CC([SiH2]c1ccccc1)C=C DSQPRECRRGZSCV-UHFFFAOYSA-N 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- HRGDZIGMBDGFTC-UHFFFAOYSA-N platinum(2+) Chemical compound [Pt+2] HRGDZIGMBDGFTC-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000010094 polymer processing Methods 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 150000003284 rhodium compounds Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- XFTDXEGRBTYXQE-UHFFFAOYSA-N silyl 3-ethenylpent-4-enoate Chemical compound C(=C)C(C=C)CC(=O)O[SiH3] XFTDXEGRBTYXQE-UHFFFAOYSA-N 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- UFHILTCGAOPTOV-UHFFFAOYSA-N tetrakis(ethenyl)silane Chemical compound C=C[Si](C=C)(C=C)C=C UFHILTCGAOPTOV-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- IGJPWUZGPMLVDT-UHFFFAOYSA-N tris(ethenyl)-tris(ethenyl)silyloxysilane Chemical compound C=C[Si](C=C)(C=C)O[Si](C=C)(C=C)C=C IGJPWUZGPMLVDT-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
- 239000008207 working material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K6/00—Preparations for dentistry
- A61K6/90—Compositions for taking dental impressions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
- G02B6/4401—Optical cables
- G02B6/4429—Means specially adapted for strengthening or protecting the cables
- G02B6/44382—Means specially adapted for strengthening or protecting the cables the means comprising hydrogen absorbing materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
Landscapes
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Veterinary Medicine (AREA)
- Epidemiology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Public Health (AREA)
- General Health & Medical Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Dental Preparations (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/629,864 US5684060A (en) | 1996-04-09 | 1996-04-09 | Compositions containing inorganic, organic and organometallic palladium hydrogen scavengers |
| US08/629,864 | 1996-04-09 | ||
| PCT/US1996/012853 WO1997037632A1 (en) | 1996-04-09 | 1996-08-07 | Compositions containing inorganic, organic and organometallic palladium hydrogen scavengers |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007085304A Division JP2007191722A (ja) | 1996-04-09 | 2007-03-28 | 印象用硬化組成物およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000509026A JP2000509026A (ja) | 2000-07-18 |
| JP2000509026A5 JP2000509026A5 (enExample) | 2004-09-02 |
| JP3980647B2 true JP3980647B2 (ja) | 2007-09-26 |
Family
ID=24524811
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53614897A Expired - Fee Related JP3980647B2 (ja) | 1996-04-09 | 1996-08-07 | 無機、有機および有機金属パラジウム水素スカベンジャー |
| JP2007085304A Pending JP2007191722A (ja) | 1996-04-09 | 2007-03-28 | 印象用硬化組成物およびその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007085304A Pending JP2007191722A (ja) | 1996-04-09 | 2007-03-28 | 印象用硬化組成物およびその製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5684060A (enExample) |
| EP (1) | EP0892630B1 (enExample) |
| JP (2) | JP3980647B2 (enExample) |
| AU (1) | AU718483B2 (enExample) |
| BR (1) | BR9612590A (enExample) |
| CA (1) | CA2250001C (enExample) |
| DE (1) | DE69618675T2 (enExample) |
| WO (1) | WO1997037632A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007191722A (ja) * | 1996-04-09 | 2007-08-02 | 3M Co | 印象用硬化組成物およびその製造方法 |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998040043A1 (en) * | 1997-03-11 | 1998-09-17 | Jeneric/Pentron Incorporated | Catalyst and composition for silicone dental impression materials |
| JP4563579B2 (ja) * | 1998-03-19 | 2010-10-13 | サンディア コーポレイション | 水生成を軽減された重合体 |
| WO2000016714A1 (en) * | 1998-09-24 | 2000-03-30 | Nissan Digital Process Ltd. | Tooth shape impression recording member and method of using it |
| US6328633B1 (en) * | 2000-01-14 | 2001-12-11 | Agere Systems Guardian Corp. | Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method |
| US6375541B1 (en) * | 2000-01-14 | 2002-04-23 | Lucent Technologies, Inc. | Polishing fluid polishing method semiconductor device and semiconductor device fabrication method |
| WO2003051996A1 (en) * | 2001-12-19 | 2003-06-26 | Rhodia Chimie | Catalytic palladium mixture |
| DE60331893D1 (de) * | 2003-05-09 | 2010-05-12 | 3M Espe Ag | Aushärtbare Silikon-Abformmassen mit hoher Reissfestigkeit und geringer Konsistenz |
| EP1502572B1 (en) | 2003-08-01 | 2012-03-07 | 3M Deutschland GmbH | Automixable putty impression material |
| US7045586B2 (en) * | 2003-08-14 | 2006-05-16 | Dow Corning Corporation | Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives |
| US20050038183A1 (en) * | 2003-08-14 | 2005-02-17 | Dongchan Ahn | Silicones having improved surface properties and curable silicone compositions for preparing the silicones |
| US20050038188A1 (en) * | 2003-08-14 | 2005-02-17 | Dongchan Ahn | Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance |
| EP1512724B1 (en) * | 2003-09-04 | 2007-04-11 | 3M Espe AG | Allylsilane containing composition |
| KR101246638B1 (ko) * | 2003-10-28 | 2013-03-25 | 다우 코닝 코포레이션 | 플랫-탑 패드의 제조방법 |
| JP5123177B2 (ja) | 2005-06-22 | 2013-01-16 | スリーエム イノベイティブ プロパティズ カンパニー | 改善された貯蔵特性を有する親水化された硬化性シリコーン印象材 |
| US9993393B2 (en) * | 2005-12-29 | 2018-06-12 | 3M Innovative Properties Company | Dental compositions and initiator systems with polycyclic aromatic component |
| CN101351183A (zh) * | 2005-12-29 | 2009-01-21 | 3M创新有限公司 | 包含水清除剂的牙科用组合物 |
| EP1968528B1 (en) * | 2005-12-29 | 2016-02-17 | 3M Innovative Properties Company | Dental compositions with surface-treated filler for shelf stability |
| EP1806122B1 (en) * | 2006-01-05 | 2017-06-14 | Coltène/Whaledent AG | Hardenable dental material |
| EP2044923A1 (en) | 2007-10-04 | 2009-04-08 | 3M Innovative Properties Company | Dental composition containing glass beads, process for production and use thereof |
| WO2009067113A1 (en) * | 2007-11-20 | 2009-05-28 | Henkel Ag & Co. Kgaa | Low-voiding die attach film, semiconductor package, and processes for making and using same |
| US20100279469A1 (en) * | 2007-11-20 | 2010-11-04 | Hwail Jin | Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using Same |
| EP2231102B1 (en) | 2007-12-18 | 2011-09-21 | 3M Innovative Properties Company | Dental composition containing a surfactant and an f-containing compound, process of production and use thereof |
| EP2133063A1 (en) | 2008-06-10 | 2009-12-16 | 3M Innovative Properties Company | Initiator system with biphenylene derivates, method of production and use thereof |
| JP5539763B2 (ja) * | 2010-03-24 | 2014-07-02 | 株式会社松風 | 医科・歯科用シリコーン印象材組成物 |
| JP5727033B2 (ja) * | 2010-12-13 | 2015-06-03 | ブルースター シリコンズ フランスＢｌｕｅｓｔａｒ Ｓｉｌｉｃｏｎｅｓ Ｆｒａｎｃｅ | 特に歯科印象採得を目的として使用可能なシリコーンエラストマー材料 |
| CN103649226B (zh) | 2011-06-08 | 2016-03-16 | 3M创新有限公司 | 包含硅氧烷化合物的组合物、其制备和使用方法 |
| EP2741729B1 (en) | 2011-08-12 | 2021-11-03 | 3M Innovative Properties Company | Curable composition with shortened setting time, process of production and use thereof |
| TW201414796A (zh) | 2012-07-27 | 2014-04-16 | Dow Corning | 自黏結可固化聚矽氧黏著劑之組成物及製造彼之方法 |
| JP6341938B2 (ja) | 2013-02-25 | 2018-06-13 | スリーエム イノベイティブ プロパティズ カンパニー | 安定化歯科用印象組成物、部品キット、及びそれらの使用 |
| WO2014178447A1 (ko) * | 2013-04-29 | 2014-11-06 | (주) 베리콤 | 기계적 물성이 향상된 치과용 인상재 |
| JP6199501B2 (ja) * | 2014-09-12 | 2017-09-20 | 富士フイルム株式会社 | 加飾用着色組成物、加飾材、加飾材付き基材、転写材料、タッチパネル、及び、情報表示装置 |
| US20190110960A1 (en) | 2014-12-16 | 2019-04-18 | 3M Innovative Properties Company | Hardenable dental impression composition comprising a polymeric filler particles and use thereof |
| WO2016196048A1 (en) | 2015-05-29 | 2016-12-08 | 3M Innovative Properties Company | Kit of parts for conducting a dental impression and retraction process |
| EP3570811A1 (en) | 2017-01-18 | 2019-11-27 | 3M Innovative Properties Company | Curable composition for dental retraction |
| WO2020021795A1 (ja) * | 2018-07-26 | 2020-01-30 | 株式会社ジーシー | 歯科用付加型シリコーン印象材 |
| JP7467017B2 (ja) * | 2021-05-25 | 2024-04-15 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS591241B2 (ja) * | 1978-06-30 | 1984-01-11 | 而至歯科工業株式会社 | 歯科用シリコ−ン組成物およびその使用法 |
| SU932692A1 (ru) * | 1980-07-11 | 1983-07-30 | Институт Неорганической Химии Со Ан Ссср | Способ получени катализатора дл избирательного гидрировани ацетиленовых соединений |
| DE3031894A1 (de) * | 1980-08-23 | 1982-09-16 | Bayer Ag, 5090 Leverkusen | Vinylsilikon-pasten fuer die zahnabformung |
| JPS60252404A (ja) * | 1984-05-28 | 1985-12-13 | Shin Etsu Chem Co Ltd | 室温硬化性印象材組成物 |
| JPS61260A (ja) * | 1984-06-12 | 1986-01-06 | Toshiba Silicone Co Ltd | 硬化性ポリオルガノシロキサン組成物 |
| US4806575A (en) * | 1986-11-19 | 1989-02-21 | Kerr Manufacturing Company | Prevention of outgassing in polyvinylsiloxane elastomers by the use of finely divided platinum black |
| JPH0637558B2 (ja) * | 1986-12-08 | 1994-05-18 | 徳山曹達株式会社 | 硬化性組成物 |
| JPH0218453A (ja) * | 1988-07-06 | 1990-01-22 | Toshiba Silicone Co Ltd | 型取材料およびそれを用いた成形型の製造方法 |
| US4957667A (en) * | 1988-11-07 | 1990-09-18 | Minnesota Mining And Manufacturing Company | Method of reducing surface defects in a positive dental model |
| JPH0672084B2 (ja) * | 1989-03-31 | 1994-09-14 | 信越化学工業株式会社 | 印象材組成物 |
| JP2624333B2 (ja) * | 1989-04-03 | 1997-06-25 | 株式会社トクヤマ | 硬化性組成物 |
| JPH0655898B2 (ja) * | 1989-08-01 | 1994-07-27 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物 |
| IT1246760B (it) * | 1990-07-02 | 1994-11-26 | Pirelli Cavi Spa | Cavi a fibre ottiche e relativi componenti contenenti una composizione barriera omogenea capace di proteggere le fibre ottiche dall'idrogeno e relativa composizione barriera omogenea. |
| DE4108032A1 (de) * | 1991-03-13 | 1992-09-17 | Bayer Ag | Palladiumhaltige polymerzusammensetzung sowie verfahren zu ihrer herstellung |
| JPH04293955A (ja) * | 1991-03-22 | 1992-10-19 | Tokuyama Soda Co Ltd | 硬化性組成物 |
| DE4405245A1 (de) * | 1994-02-18 | 1995-08-24 | Wacker Chemie Gmbh | Hitzestabilen Siliconkautschuk ergebende additionsvernetzende Massen |
| US5684060A (en) * | 1996-04-09 | 1997-11-04 | Minnesota Mining And Manufacturing Company | Compositions containing inorganic, organic and organometallic palladium hydrogen scavengers |
-
1996
- 1996-04-09 US US08/629,864 patent/US5684060A/en not_active Expired - Lifetime
- 1996-08-07 JP JP53614897A patent/JP3980647B2/ja not_active Expired - Fee Related
- 1996-08-07 DE DE69618675T patent/DE69618675T2/de not_active Expired - Lifetime
- 1996-08-07 AU AU67197/96A patent/AU718483B2/en not_active Ceased
- 1996-08-07 BR BR9612590A patent/BR9612590A/pt not_active IP Right Cessation
- 1996-08-07 WO PCT/US1996/012853 patent/WO1997037632A1/en not_active Ceased
- 1996-08-07 EP EP96927337A patent/EP0892630B1/en not_active Expired - Lifetime
- 1996-08-07 CA CA002250001A patent/CA2250001C/en not_active Expired - Fee Related
-
2007
- 2007-03-28 JP JP2007085304A patent/JP2007191722A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007191722A (ja) * | 1996-04-09 | 2007-08-02 | 3M Co | 印象用硬化組成物およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0892630A1 (en) | 1999-01-27 |
| CA2250001C (en) | 2008-10-14 |
| DE69618675T2 (de) | 2002-08-22 |
| AU6719796A (en) | 1997-10-29 |
| AU718483B2 (en) | 2000-04-13 |
| CA2250001A1 (en) | 1997-10-16 |
| JP2000509026A (ja) | 2000-07-18 |
| BR9612590A (pt) | 1999-07-20 |
| EP0892630B1 (en) | 2002-01-09 |
| JP2007191722A (ja) | 2007-08-02 |
| US5684060A (en) | 1997-11-04 |
| DE69618675D1 (de) | 2002-02-28 |
| WO1997037632A1 (en) | 1997-10-16 |
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