JP3962560B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP3962560B2 JP3962560B2 JP2001201965A JP2001201965A JP3962560B2 JP 3962560 B2 JP3962560 B2 JP 3962560B2 JP 2001201965 A JP2001201965 A JP 2001201965A JP 2001201965 A JP2001201965 A JP 2001201965A JP 3962560 B2 JP3962560 B2 JP 3962560B2
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- 239000000758 substrate Substances 0.000 title claims description 199
- 238000012545 processing Methods 0.000 title claims description 113
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- 238000012546 transfer Methods 0.000 claims description 30
- 230000007246 mechanism Effects 0.000 claims description 13
- 238000001035 drying Methods 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 2
- 238000007664 blowing Methods 0.000 claims 1
- 238000011161 development Methods 0.000 description 46
- 230000032258 transport Effects 0.000 description 40
- 238000010438 heat treatment Methods 0.000 description 30
- 238000000034 method Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 18
- 238000001816 cooling Methods 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 239000000243 solution Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 9
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- 239000000428 dust Substances 0.000 description 3
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- 238000011084 recovery Methods 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000012487 rinsing solution Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001201965A JP3962560B2 (ja) | 2001-07-03 | 2001-07-03 | 基板処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001201965A JP3962560B2 (ja) | 2001-07-03 | 2001-07-03 | 基板処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003017392A JP2003017392A (ja) | 2003-01-17 |
| JP2003017392A5 JP2003017392A5 (enExample) | 2004-10-14 |
| JP3962560B2 true JP3962560B2 (ja) | 2007-08-22 |
Family
ID=19038852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001201965A Expired - Fee Related JP3962560B2 (ja) | 2001-07-03 | 2001-07-03 | 基板処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3962560B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4886719B2 (ja) * | 2008-03-14 | 2012-02-29 | 日立ビアメカニクス株式会社 | 加工装置 |
-
2001
- 2001-07-03 JP JP2001201965A patent/JP3962560B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003017392A (ja) | 2003-01-17 |
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