JP3962560B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus for developing a resist pattern on a glass substrate used in a liquid crystal display device (LCD) in a manufacturing process of a liquid crystal device.
[0002]
[Prior art]
In the LCD manufacturing process, a photolithography technique similar to that used for manufacturing semiconductor devices is used to form an ITO (Indium Tin Oxide) thin film or electrode pattern on a glass substrate for LCD. In the photolithography technique, a photoresist is applied to a glass substrate, which is exposed and further developed.
[0003]
In the development processing step, paddle development, spray development, or the like is performed. For example, paddle development is performed by depositing the developer on the substrate using the surface tension of the developer, and keeping the substrate stationary in this state. It is left for about 60 seconds.
[0004]
[Problems to be solved by the invention]
However, since paddle development is a method in which the developer is deposited on the substrate and left as it is, the liquid film thickness of the developer at the peripheral portion of the glass substrate due to surface tension is the liquid film thickness in the region other than the peripheral portion. Bigger than. As a result, the resin concentration of the resist becomes nonuniform on the substrate, and the line width may become nonuniform.
[0005]
Further, in the paddle development and spray development, problems such as pattern breakage and non-uniformity of the line width occur due to the impact on the substrate when the developer is supplied from the developer supply nozzle. Furthermore, pre-wet (in the pre-development stage, water or a dilute developer is dropped on the substrate for several seconds so that the resist surface state is adjusted to the developer) is indispensable as a countermeasure against the impact. Therefore, an apparatus for this pre-wet is required. Further, since the developer supplied to the substrate is diluted by pre-wetting, there is a problem that the recovery efficiency of the developer is poor.
[0006]
In view of the circumstances as described above, an object of the present invention is to provide a substrate processing apparatus capable of reducing the impact on a substrate when supplying a developing solution and improving the uniformity of the line width.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is arranged to convey a substrate in a predetermined direction, and to move in the substrate conveyance direction by the conveyance unit, and to face the lower surface of the substrate to be conveyed. Supply means for supplying a processing liquid to the entire lower surface of the substrate through a porous member.
[0008]
According to such a configuration of the present invention, when the processing liquid is discharged by the supply unit, the processing liquid can be uniformly supplied to the entire lower surface of the substrate so as to ooze out through the porous member. Moreover, since the discharge surface of the porous member always faces the lower surface of the substrate by moving the supply unit in accordance with the conveyance of the substrate during processing, for example, when the processing solution is a developing solution, The liquid film thickness does not rise at the peripheral edge of the substrate due to the surface tension, and the development processing can be performed with a uniform liquid film thickness. Thereby, line width uniformity can be improved.
[0009]
In addition, since the processing liquid can be supplied to the substrate so as to ooze out by the porous member, the impact of the processing liquid supply to the substrate can be reduced, and pattern breakage and the like can be prevented.
[0010]
Furthermore, since the impact can be reduced, pre-wetting is not required, so no pre-wetting device is required, and when the processing liquid is reused, the pre-wetting processing liquid is not diluted as in the prior art. Therefore, the recovery efficiency of the treatment liquid can be improved, which contributes to energy saving.
[0011]
According to one aspect of the present invention, the surface of the porous member that faces the transported substrate is substantially equal to the size of the substrate. Thereby, the processing liquid can be uniformly supplied to the entire lower surface of the substrate.
[0012]
According to one aspect of the present invention, the means provided on the downstream side of the supply relative to the supply means, supplies a rinsing liquid to the lower surface and the surface of the substrate to be transferred, and rinses and cleans the processing liquid; And a means for spraying air to the lower surface and the surface of the cleaned substrate, and drying the substrate. Thereby, for example, when the processing solution is a developing solution, the developing process, the rinsing process that is an indispensable process after the developing process, and the drying process can be continuously performed while the substrate is conveyed.
[0013]
According to one aspect of the present invention, the means for increasing the amount of the rinsing liquid supplied to the surface than the amount of the rinsing liquid supplied to the lower surface of the substrate to be transported, and the air blown to the lower surface of the substrate to be transported Means for increasing the amount of air supplied to the surface rather than the amount of. Thereby, even if it is a case where the rinse process and a drying process are performed with respect to the lower surface of a board | substrate, a board | substrate can be conveyed stably.
[0014]
According to an aspect of the present invention, the apparatus further includes a mechanism that is disposed adjacent to the transport unit and reverses the front and back of the substrate supplied from the outside. Thus, for example, the substrate is inverted before the developing process, the developing process is performed on the lower surface side of the substrate, and then the substrate is attached to the lower surface side of the substrate by performing a rinsing process and a drying process in the same state. Dust and dust easily fall off.
[0019]
A substrate processing apparatus according to another aspect of the present invention is arranged so as to face a lower surface of a substrate to be transferred, a transfer means for transferring a substrate, and a surface facing the substrate is substantially the same size as the size of the substrate. And a supply means for supplying the processing liquid to the entire lower surface of the substrate movable in the substrate transfer direction, and a sensor arranged near the standby position of the supply means for confirming the transfer position of the substrate. The supply means checks the transport position of the substrate by the sensor, starts to discharge the processing liquid, and operates to move according to the transport speed of the substrate.
According to an aspect of the present invention, the supply unit continues to supply the processing liquid to the entire lower surface of the substrate while moving in accordance with the transfer speed of the substrate .
In the substrate processing method according to the present invention, the surface of the substrate is turned to the lower surface side by reversing the front and back of the substrate, and the substrate is positioned on the lower surface side of the substrate while transporting the reversed substrate in a predetermined direction. A region for supplying a processing liquid having the same size as the surface of the substrate to the entire surface of the substrate is moved in the substrate transport direction in accordance with the substrate transport speed, while the processing liquid is applied to the substrate. A step of supplying
[0020]
Further features and advantages of the present invention will become more apparent by referring to the attached drawings and description of embodiments of the invention.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0022]
FIG. 1 is a plan view showing an LCD substrate coating and developing system to which the present invention is applied, FIG. 2 is a front view thereof, and FIG. 3 is a rear view thereof.
[0023]
The coating and developing processing system 1 includes a cassette station 2 on which a cassette C that accommodates a plurality of glass substrates G is placed, and a plurality of processing units for performing a series of processes including resist coating and development on the substrate G. An interface unit 4 for transferring the substrate G between the processing unit 3 and the exposure apparatus 32 is provided, and a cassette station 2 and an interface unit 4 are disposed at both ends of the processing unit 3, respectively.
[0024]
The cassette station 2 includes a transport mechanism 10 for transporting the LCD substrate between the cassette C and the processing unit 3. Then, loading and unloading of the cassette C is performed at the cassette station 2. In addition, the transport mechanism 10 includes a transport arm 11 that can move on a transport path 12 provided along the cassette arrangement direction, and the transport arm 11 can transport the substrate G between the cassette C and the processing unit 3. Done.
[0025]
The processing section 3 includes a main transport section 3a extending in the direction (X direction) perpendicular to the arrangement direction (Y direction) of the cassette C in the cassette station 2, and a resist coating processing unit along the main transport section 3a. An upstream portion 3b in which processing units including (CT) are arranged in parallel and a downstream portion 3c in which processing units including development processing unit (DEV) 18 are arranged in parallel are provided.
[0026]
The main transport unit 3 a is provided with a transport path 31 extending in the X direction and a transport shuttle 23 configured to be movable along the transport path 31 and transporting the glass substrate G in the X direction. The transport shuttle 23 is configured to transport the substrate G while holding the substrate G with, for example, support pins. Further, a vertical transfer unit 7 that transfers the substrate G between the processing unit 3 and the interface unit 4 is provided at the end of the main transfer unit 3a on the interface unit 4 side.
[0027]
In the upstream part 3b, a scrubber cleaning unit (SCR) 20 for cleaning the substrate G is provided at the end of the cassette station 2 side, and an organic substance on the substrate G is disposed above the scrubber cleaning unit (SCR) 20. An excimer UV processing unit (e-UV) 19 is provided for removing water.
[0028]
The scrubber cleaning processing unit (SCR) 20 is provided with a roller-type transfer device 50, and the substrate G is cleaned by the transfer device 50 while being transported horizontally. Further, at both ends of the scrubber cleaning processing unit (SCR) 20, delivery pins 46 having an up / down raising / lowering mechanism for delivering a substrate to / from the outside are provided.
[0029]
Next to the scrubber cleaning processing unit (SCR) 20, thermal processing blocks 24 and 25 are arranged in which units for performing thermal processing on the glass substrate G are stacked in multiple stages. Between these heat treatment blocks 24 and 25, the vertical transfer unit 5 is arranged, and the transfer arm 5a is movable in the Z direction and the horizontal direction and is rotatable in the θ direction. The substrate G is transferred by accessing each heat treatment system unit in the blocks 24 and 25. The vertical transport unit 7 in the processing unit 3 has the same configuration as the vertical transport unit 5.
[0030]
As shown in FIG. 2, the heat treatment system block 24 includes a baking unit (BEKE) for performing heat treatment before applying a resist to the substrate G, and an adhesion unit (AD) for performing hydrophobizing treatment with HMDS gas. They are stacked in order from the bottom. On the other hand, in the heat treatment block 25, two stages of cooling units (COL) for cooling the substrate G and an adhesion unit (AD) are stacked in order from the bottom.
[0031]
A resist processing block 15 extends in the X direction adjacent to the heat treatment block 25. This resist processing block 15 removes a resist coating unit (CT) for applying a resist to the substrate G, a reduced pressure drying unit (VD) for drying the applied resist under reduced pressure, and a peripheral edge of the substrate G. And an edge remover (ER) to be integrated. The resist processing block 15 is provided with a sub arm (not shown) that moves from the resist coating processing unit (CT) to the edge remover (ER) so that the substrate G is transported in the resist processing block 15 by the sub arm. It has become.
[0032]
A multi-stage heat treatment system block 26 is disposed adjacent to the resist processing block 15. The heat treatment system block 3 includes three pre-baking units (PREBAKE) for performing a heat treatment after the resist is applied to the substrate G. Are stacked.
[0033]
In the downstream portion 3c, as shown in FIG. 3, a heat treatment system block 29 is provided at the end on the interface portion 4 side, which includes a cooling unit (COL), a heat treatment before the development process after the exposure. Post-exposure baking units (PEBAKE) that perform the above are stacked in order from the bottom.
[0034]
A development processing unit (DEV) 18 according to the present invention extends in the X direction adjacent to the heat treatment block 29. This development processing unit (DEV) will be described later. Next to the development processing unit (DEV) 18, heat treatment system blocks 28 and 27 are arranged. Between these heat treatment system blocks 28 and 27, the same structure as the vertical transport unit 5 is provided. A vertical transfer unit 6 that can access the heat treatment units 28 and 27 is provided. An i-line processing unit (i-UV) 33 is provided on the end of the development processing unit (DEV) 18.
[0035]
In the heat treatment block 28, a cooling unit (COL) and a post baking unit (POBAKE) for performing heat treatment after development on the substrate G are stacked in order from the bottom. On the other hand, in the heat treatment block 27, similarly, a cooling unit (COL) and a post baking unit (POBAKE) are stacked in order from the bottom.
[0036]
The interface unit 4 is provided with a titler and peripheral exposure unit (Title / EE) 22 on the front side, an extension cooling unit (EXTCOL) 35 adjacent to the vertical transfer unit 7, and a buffer cassette 34 on the back side. There is a vertical transfer unit 8 that transfers the substrate G between the titler / peripheral exposure unit (Title / EE) 22, the extension cooling unit (EXTCOL) 35, the buffer cassette 34, and the adjacent exposure device 32. Has been placed. The vertical transport unit 8 has the same configuration as the vertical transport unit 5.
[0037]
FIG. 4 is a side view of the development processing unit (DEV) according to the first embodiment of the present invention. The development processing unit (DEV) is provided with a plurality of transport rollers 41 that are rotationally driven by a motor (not shown) as means for transporting the substrate G in the X direction. A developer nozzle 43 that is disposed on the lower surface side of the substrate G and supplies developer is provided on the upstream side (left in the drawing) of the transport roller 41. On the downstream side of the developing solution nozzle 43, a first rinsing nozzle 77 and a second rinsing nozzle 76 that supply a rinsing solution to the substrate G to wash away and wash the developing solution are disposed on the lower surface and the upper surface of the substrate G, respectively. Has been. On the downstream side of the first rinse nozzle 77 and the second rinse nozzle 76, a first air supply device 79 and a second air supply device 78 that blow and dry the substrate G with air are disposed on the lower surface and the upper surface of the substrate G. ing.
[0038]
The amount of the rinse liquid supplied from the second rinse nozzle 76 is set to be larger than the amount of the rinse liquid supplied from the first rinse nozzle 77. Further, the air supply amount of the second air supply device 78 is set to be larger than the air supply amount of the first air supply device 79. Thereby, even if it is a case where the rinse process and the drying process are performed with respect to the lower surface of the board | substrate G, the board | substrate G can be conveyed stably.
[0039]
5 and 6 are a front view and a plan view of a portion where the developer nozzle 43 is arranged in the development processing unit (DEV). For example, a flange portion 41a is formed on the transport roller 41, and the substrate G is placed on the flange portion 41a and transported. The developer nozzle 43 is supported by a vertical support body 44 with a slight gap with respect to the substrate G to be transported, for example. The surface of the developer nozzle 43 that faces the substrate G is approximately the same size as the substrate G. The support body 44 is fixed to a pedestal portion 45. The pedestal portion 45 is provided with, for example, wheels 47 that travel along rails 49 that extend in the conveyance direction of the substrate G. It is possible to move in the transport direction.
[0040]
FIG. 7 is a cross-sectional view of the developer nozzle 43. In the developer nozzle 43, a porous member 52 having a plurality of holes 52a is connected to a manifold 48 having a buffer chamber 59 for storing the developer. In the manifold 48, for example, a plurality of supply ports 48a for supplying a developing solution from a supply source (not shown) are formed. As described above, the developer nozzle 43 is disposed with a gap on the lower surface side of the substrate G to be transported.
[0041]
FIG. 8 is a perspective view showing a reversing mechanism according to an embodiment. In this reversing mechanism, for example, a U-shaped member 75 having a plurality of suction portions 56 for vacuum-sucking the substrate G is pivotally supported on the shaft 54 of the support member 58. This reversing mechanism is disposed, for example, at the transport upstream end and transport downstream end of the development processing unit (DEV).
[0042]
As shown in FIG. 9, the reversing mechanism is reversed after the substrate G is transferred from the transport arm of the vertical transport unit 7, and the state shown in FIG. From this state, the transfer pin 46 of the development processing unit (DEV) is raised, and the substrate G is transferred to the transfer pin 46.
[0043]
The configured coating and developing treatment system 1 of the processing steps as described above, first, the substrate G in the cassette C is transported to the upstream portion 3b definitive processing unit 3. In the upstream portion 3b, surface modification / organic matter removal processing is performed in the excimer UV processing unit (e-UV) 19, and then the substrate G is transported substantially horizontally by the transport device 50 in the scrubber cleaning processing unit (SCR) 20. While being washed, the washing process and the drying process are performed. Subsequently, the substrate G is taken out by the transfer arm 5a in the vertical transfer unit at the lowermost stage of the heat treatment system block 24, heated by the baking unit (BEKE) of the heat treatment system block 24, and by the adhesion unit (AD). Hydrophobization processing is performed, and cooling processing by the cooling unit (COL) of the heat treatment system block 25 is performed.
[0044]
Next, the substrate G is transferred from the transfer arm 5a to the transfer shuttle 23. After being transferred to the resist coating processing unit (CT) and subjected to the resist coating processing, the vacuum drying processing unit (VD) performs the vacuum drying processing and the edge remover (ER) sequentially performs the resist removal processing on the substrate periphery. Done.
[0045]
Next, the substrate G is transferred from the transfer shuttle 23 to the transfer arm of the vertical transfer unit 7, subjected to heat treatment in the pre-baking unit (PREBAKE) in the heat treatment block 26, and then cooled in the heat treatment block 29. The cooling process is performed at (COL). Subsequently, the substrate G is cooled by an extension cooling unit (EXTCOL) 35 and exposed by an exposure apparatus.
[0046]
Next, the substrate G is transferred to the post-exposure baking unit (PEBAKE) of the heat treatment system block 29 via the transfer arms of the vertical transfer units 8 and 7, where the heat treatment is performed, and then the substrate G is transferred to the cooling unit (COL). The cooling process is performed. Then, the substrate G is transferred from the transfer arm of the vertical transfer unit 7 to the reversing mechanism at the lowest stage of the heat treatment system block 29.
[0047]
Then, the substrate G reversed by the reversing mechanism is delivered to the delivery pins 46 and lowered as shown in FIG. When the substrate G is placed on the transport roller 41 at the transport upstream end, it is transported and transported onto the developer nozzle 43 as shown in FIG. Here, for example, after the transport position of the substrate G is confirmed by the optical sensor S arranged near the standby position of the developer nozzle, the developer nozzle 43 starts to discharge the developer, and FIG. As shown, the movement is started in accordance with the conveyance speed of the substrate G. During the movement of the developer nozzle 43, the developer is continuously discharged to perform development processing. Thereafter, the substrate G is rinsed and dried on the downstream side of conveyance.
[0048]
When the developer is discharged from the developer nozzle 43, the developer 55 can be uniformly supplied to the entire lower surface of the substrate G so that the developer 55 oozes out through the porous member 52. Moreover, by moving the developer nozzle 43 in accordance with the conveyance of the substrate G during the development process, the discharge surface of the porous member 52 always faces the lower surface of the substrate G. The liquid film thickness does not rise at the peripheral edge of the substrate G due to the surface tension of the developing solution, and the developing process can be performed with a uniform liquid film thickness. Thereby, line width uniformity can be improved.
[0049]
Further, since the supply to the substrate G to ooze the current image was more porous member 52, it is possible to reduce the impact of the developer to the substrate G, it is possible to prevent a pattern breakage or the like.
[0050]
Further, in this embodiment, since the impact can be reduced, pre-wetting is not necessary, so no pre-wetting device is required, and when the developer is reused, the pre-wet developer as in the past is used. Since it is not diluted, the recovery efficiency of the developer can be improved.
[0051]
Furthermore, according to the present embodiment, the substrate G is inverted before the development processing, the development processing is performed on the lower surface side of the substrate, and then the rinsing processing and the drying processing are performed as they are. The rinsing process and the drying process have an effect that dust and dirt attached to the lower surface side of the substrate easily fall off.
[0052]
When the development processing by the development processing unit (DEV) is completed, the substrate G is reversed by the reversing mechanism at the lowest stage in the heat treatment system block 28 and transferred by the transport arm 6 a of the vertical transport unit 6. Then, heat treatment is performed in the post-baking unit (POBAKE) in the heat treatment block 28 or 27, and cooling treatment is performed in the cooling unit (COL). The substrate G is transferred to the transport mechanism 10 and accommodated in the cassette C.
[0053]
12 and 13 are a perspective view and a side view showing a part of a development processing unit (DEV) according to the second embodiment of the present invention.
[0054]
In the present embodiment, the substrate G is transported in the horizontal direction by a plurality of transport rollers 61 that rotate parallel to the surface of the substrate G. The transport roller 61 is formed to sandwich the both ends of the substrate, and transports the substrate G by rotation. On the lower surface of the substrate G to be transported, a plurality of long developer nozzles 65 are arranged in the transport direction of the substrate G. The developer nozzle 65 has the same configuration as that of the first embodiment, and the developer supplied from the supply pipe 64 is supplied to the lower surface of the substrate via the manifold having the buffer chamber and the porous member 63. It is designed to ooze out to the side.
[0055]
Also according to this embodiment, the same effect as the first embodiment can be obtained. In this embodiment, it is preferable that the developer is discharged only by the nozzle facing the substrate G corresponding to the substrate G to be transported, and the other nozzles not facing the substrate G are preferably stopped from discharging. Of course, it is possible to always discharge the developer by the nozzle.
[0056]
As described above, in each of the above embodiments, the case where the development processing is performed while the glass substrate is transported horizontally by roller transportation or the like has been described, but the present invention is not limited thereto. For example, as shown in FIGS. 14 and 15, the present invention is also applicable to a development processing unit that performs development by sucking and holding the substrate G by the holding portion 66 disposed in the cup CP.
[0057]
The developer nozzle of this embodiment uses the same developer nozzle 43 as in the first embodiment, and this developer nozzle 43 is supported by a lifting support member 72 and can be lifted and lowered by a drive unit 80. Has been placed. The drive unit 80 controls the distance between the developer nozzle 43 and the substrate G in units of several mm or less, for example.
[0058]
Note that when the substrate G is transported between the outside of the development processing unit and the development processing unit, the developing solution nozzle 43 is in a standby state in a raised state. The holding unit 66 can be moved up and down by the motor unit 74 for delivery of the substrate G, and can be rotated for liquid draining and drying processing. Although not shown in the present embodiment, a rinsing nozzle for supplying a rinsing liquid is of course also provided.
[0059]
When the developing unit in the present embodiment to supply the developing solution to the substrate G, first close the developer nozzle 43 to the substrate G, to start the discharge of the developer 68 from the close state, developed gradually The liquid nozzle 43 is moved away from the substrate G. Then, as shown in FIG. 16, when the distance between the substrate G and the developer nozzle 43 reaches a predetermined distance, the discharge of the developer is stopped, and the developing process ends at a position where the nozzle 43 is kept at the predetermined distance. Hold until.
[0060]
Therefore, in the conventional liquid pile development, as shown in FIG. 17, the developer 85 swells at the peripheral edge of the substrate G and development processing in a uniform liquid pile state cannot be performed. The liquid film thickness on the entire surface of the substrate can be kept uniform at a predetermined value. Further, in the present embodiment, since the tension from the developer nozzle 43 is applied to the developer 68, the developing process can be performed in a state where the amount of the developer is larger than in the conventional case. When the amount of the developer is small, the resist material dissolves in the developer and a by-product is formed, which tends to change the reaction rate. However, in this embodiment, the amount of the developer is large, so the processing capacity is stable. To do.
[0061]
Furthermore, according to this embodiment, the present invention can be applied to a conventional development processing unit for performing static development and a resist coating and development processing system including this development processing unit.
[0062]
The method of controlling the film thickness by controlling the distance of the developer nozzle to the substrate G can also be applied to the first embodiment and the second embodiment. For example, the support 44 shown in FIG. 5 may be configured to be extendable so that the distance between the substrate G and the developer nozzle 43 can be controlled. The same applies to the developer nozzles 65 shown in FIGS.
[0063]
【The invention's effect】
As described above, according to the present invention, it is possible to reduce the impact on the substrate when supplying the developer and improve the uniformity of the line width.
[Brief description of the drawings]
FIG. 1 is a plan view showing an overall configuration of a coating and developing treatment system to which the present invention is applied.
FIG. 2 is a front view of the coating and developing treatment system shown in FIG.
FIG. 3 is a rear view of the coating and developing treatment system shown in FIG. 1;
FIG. 4 is a side view of a development processing unit (DEV) according to an embodiment of the present invention.
5 is a front view of a developer nozzle in the development processing unit (DEV) shown in FIG. 4. FIG.
FIG. 6 is a plan view of the developer nozzle.
FIG. 7 is a cross-sectional view of the developer nozzle.
FIG. 8 is a perspective view showing a reversing mechanism according to an embodiment of the present invention.
9 is a side view of the reversing mechanism shown in FIG.
10 is a side view showing a reversed state of the reversing mechanism shown in FIG. 8. FIG.
FIG. 11 is an operation diagram when transported from a delivery pin to a developer nozzle.
FIG. 12 is a perspective view showing a part of a development processing unit according to a second embodiment of the present invention.
13 is a side view of a developer nozzle in the development processing unit shown in FIG.
FIG. 14 is a plan view showing a part of a development processing unit according to another embodiment of the present invention.
15 is a cross-sectional view of a part of the development processing unit shown in FIG.
FIG. 16 is a side view showing a state of liquid accumulation by a developer nozzle.
FIG. 17 is a side view showing a conventional liquid accumulation state.
[Explanation of symbols]
G ... Glass substrate 41 ... Conveying roller 41a ... Flange 42 ... Drive motors 43, 65 ... Developer nozzle 48 ... Manifold 48a ... Supply port 49 ... Rail 52a ... Hole 52, 63 ... Porous member 54 ... Shaft 55, 68 ... Developer 56 ... Adsorption part 58 ... Support member 59 ... Buffer chamber 61 ... Conveying roller 66 ... Holding part 72 ... Lifting support member 74 ... Motor part 75 ... U-shaped members 76, 77 ... Rinse nozzles 78, 79 ... Air supply device 80 ... Drive unit

Claims (8)

Transport means for transporting the substrate in a predetermined direction;
And a supply unit that moves in the substrate transport direction by the transport unit and that supplies a processing liquid to the entire lower surface of the substrate through a porous member disposed to face the lower surface of the transported substrate. A substrate processing apparatus. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein a surface of the porous member facing the substrate to be conveyed is substantially equal to the size of the substrate. In the substrate processing apparatus of Claim 1 or Claim 2,
Means for providing a rinsing liquid to the lower surface and the surface of the substrate to be transported to wash away and wash the processing liquid, which is provided on the downstream side of transport relative to the supply means;
A substrate processing apparatus comprising: means for blowing air to the lower surface and the surface of the cleaned substrate, and drying the substrate. In the substrate processing apparatus of any one of Claims 1-3,
Means for increasing the amount of rinsing liquid supplied to the surface rather than the amount of rinsing liquid supplied to the lower surface of the substrate to be transported;
And a means for increasing the amount of air supplied to the surface rather than the amount of air blown onto the lower surface of the substrate to be transported. In the substrate processing apparatus of any one of Claims 1-4,
A substrate processing apparatus, further comprising a mechanism that is disposed adjacent to the transfer means and reverses the front and back of a substrate supplied from the outside. Transport means for transporting the substrate;
The processing liquid is arranged across the lower surface of the substrate to be transported, the surface facing the substrate is approximately the same size as the substrate, and the processing liquid is supplied to the entire lower surface of the substrate movable in the substrate transport direction. Supply means for
A sensor disposed near a standby position of the supply means, and for confirming a transfer position of the substrate;
The substrate processing apparatus is characterized in that the supply means confirms the transport position of the substrate by the sensor, starts discharging the processing liquid, and operates to move according to the transport speed of the substrate. The substrate processing apparatus according to claim 6 ,
The substrate processing apparatus, wherein the supply means continues to supply the processing liquid to the entire lower surface of the substrate while moving in accordance with the transport speed of the substrate. Reversing the front and back of the substrate to make the surface of the substrate the lower surface,
An area for supplying a processing liquid having the same size as the surface of the substrate to the entire surface of the substrate located on the lower surface side of the substrate while transporting the inverted substrate in a predetermined direction. And a step of supplying a processing liquid to the substrate while moving the substrate in the transport direction in accordance with the transport speed of the substrate.

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