JP3952076B1 - 紫外線センサ - Google Patents
紫外線センサ Download PDFInfo
- Publication number
- JP3952076B1 JP3952076B1 JP2006120208A JP2006120208A JP3952076B1 JP 3952076 B1 JP3952076 B1 JP 3952076B1 JP 2006120208 A JP2006120208 A JP 2006120208A JP 2006120208 A JP2006120208 A JP 2006120208A JP 3952076 B1 JP3952076 B1 JP 3952076B1
- Authority
- JP
- Japan
- Prior art keywords
- layer
- zno
- ultraviolet sensor
- ultraviolet
- zno layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 89
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 83
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 36
- 229910000314 transition metal oxide Inorganic materials 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 8
- 229910052748 manganese Inorganic materials 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 8
- 239000006104 solid solution Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000035945 sensitivity Effects 0.000 abstract description 21
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 115
- 239000010408 film Substances 0.000 description 31
- 239000002002 slurry Substances 0.000 description 15
- 239000000843 powder Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 238000002156 mixing Methods 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 239000010409 thin film Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 7
- 239000011324 bead Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 239000004014 plasticizer Substances 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 238000010298 pulverizing process Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 238000007606 doctor blade method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000010344 co-firing Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 229910020599 Co 3 O 4 Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 241000877463 Lanio Species 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000000825 ultraviolet detection Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/109—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PN heterojunction type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022416—Electrodes for devices characterised by at least one potential jump barrier or surface barrier comprising ring electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0296—Inorganic materials including, apart from doping material or other impurities, only AIIBVI compounds, e.g. CdS, ZnS, HgCdTe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1828—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/543—Solar cells from Group II-VI materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Light Receiving Elements (AREA)
Abstract
【解決手段】ZnOを含む酸化物半導体からなる、ZnO層2と、ZnO層2に接するように設けられるものであって、ZnOがNiOに固溶してなる酸化物半導体からなる、(Ni,Zn)O層3と、ZnO層2に電気的に接続される、第1の端子電極5と、(Ni,Zn)O層3に電気的に接続される、第2の端子電極6とを備え、ZnO層2が紫外線7の受光側に位置されるように用いられる。(Ni,Zn)O層3は焼結体からなることが好ましい。
【選択図】図1
Description
まず、ZnO層となるべきグリーンシートを作製するため、ZnO、Al2O3およびCo3O4の各原料無機粉末を、それぞれ、ZnO、AlO3/2およびCoO4/3に換算して、表1の「ZnO層の組成」の欄に示すモル%となるように秤量し、これに純水を加え、PSZ(部分安定化ジルコニア)ビーズをメディアとしてボールミルにて平均粒径0.5μm以下となるように混合粉砕処理した。次いで、混合粉砕処理後のスラリーを脱水乾燥し、50μmの程度の粒径となるように造粒した後、1200℃の温度で2時間仮焼した。次に、このようにして得られた仮焼粉末に、再び、純水を加え、PSZビーズをメディアとしてボールミルにて平均粒径0.5μmになるまで混合粉砕処理した。次に、この混合粉砕処理後のスラリーを脱水乾燥した後、有機溶剤および分散剤を加えて混合し、さらにバインダおよび可塑剤を加えて成形用のスラリーとし、このスラリーにドクターブレード法を適用して、ZnO層となるべき厚み10μmのグリーンシートを得た。
上記実験例1における試料22と同様の試料を用いて、透光性導電膜の有無について評価した。すなわち、実験例1における試料22と同じものを「透光性導電膜なし」の試料とし、他方、焼結後の積層構造物におけるZnO層の外表面上に、透光性導電膜として、ZnOにAlをドープして低抵抗化した厚み1μmの薄膜をスパッタリング法によって形成したことを除いて、試料22と同様の試料を作製し、これを「透光性導電膜あり」の試料とした。
2,12 ZnO層
3,13 (Ni,Zn)O層
4 導電層
5,6,17,19 端子電極
7 紫外線の照射方向を示す矢印
10 透光性導電膜
14 基材層
16,18 接続導体膜
Claims (8)
- ZnOを含む酸化物半導体からなる、ZnO層と、
前記ZnO層に接するように設けられるものであって、ZnOがNiOに固溶してなる酸化物半導体からなる、(Ni,Zn)O層と、
前記ZnO層に電気的に接続される、第1の端子電極と、
前記(Ni,Zn)O層に電気的に接続される、第2の端子電極と
を備え、
前記(Ni,Zn)O層の組成を(Ni 1−x Zn x )Oで表したとき、xは、0.2≦x≦0.4であり、
前記ZnO層および前記(Ni,Zn)O層は、同時焼成されて得られた焼結体からなり、
前記ZnO層が、紫外線の受光側に位置されるように用いられる、紫外線センサ。 - 前記ZnO層は、Coを0.1〜3モル%含有する、請求項1に記載の紫外線センサ。
- 前記(Ni,Zn)O層の、前記ZnO層が位置する側とは逆側において、前記(Ni,Zn)O層に接するように設けられるものであって、導電性を有するセラミック焼結体からなる、導電層をさらに備える、請求項1または2に記載の紫外線センサ。
- 前記導電層は、遷移金属酸化物を含む、請求項3に記載の紫外線センサ。
- 前記遷移金属酸化物は、ABO3(Aは、希土類元素、SrおよびBaから選ばれる1種、または希土類元素、SrおよびBaから選ばれる少なくとも1種を含む固溶体であり、Bは、Mn、CoおよびNiから選ばれる1種、またはMn、CoおよびNiから選ばれる少なくとも1種を含む固溶体である。)からなるペロブスカイト型酸化物である、請求項4に記載の紫外線センサ。
- 前記(Ni,Zn)O層の、前記ZnO層が位置する側とは逆側において、少なくとも前記ZnO層および前記(Ni,Zn)O層を補強するように設けられる、高抵抗材料からなる基材層をさらに備える、請求項1ないし5のいずれかに記載の紫外線センサ。
- 前記高抵抗材料は、NiOまたはNiOを主成分とするものである、請求項6に記載の紫外線センサ。
- 前記ZnO層の、紫外線の受光側の主面上に設けられる、透光性導電膜をさらに備える、請求項1ないし7のいずれかに記載の紫外線センサ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006120208A JP3952076B1 (ja) | 2006-04-25 | 2006-04-25 | 紫外線センサ |
PCT/JP2006/318131 WO2007122750A1 (ja) | 2006-04-25 | 2006-09-13 | 紫外線センサ |
EP06810088.2A EP2012368A4 (en) | 2006-04-25 | 2006-09-13 | ULTRAVIOLET SENSOR |
US12/257,678 US7635906B2 (en) | 2006-04-25 | 2008-10-24 | Ultraviolet sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006120208A JP3952076B1 (ja) | 2006-04-25 | 2006-04-25 | 紫外線センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP3952076B1 true JP3952076B1 (ja) | 2007-08-01 |
JP2007294639A JP2007294639A (ja) | 2007-11-08 |
Family
ID=38456408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006120208A Expired - Fee Related JP3952076B1 (ja) | 2006-04-25 | 2006-04-25 | 紫外線センサ |
Country Status (4)
Country | Link |
---|---|
US (1) | US7635906B2 (ja) |
EP (1) | EP2012368A4 (ja) |
JP (1) | JP3952076B1 (ja) |
WO (1) | WO2007122750A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009300206A (ja) * | 2008-06-12 | 2009-12-24 | Murata Mfg Co Ltd | 紫外線センサ |
JP2012109486A (ja) * | 2010-11-19 | 2012-06-07 | Murata Mfg Co Ltd | 紫外線センサの製造方法、及び紫外線センサ |
US9064990B2 (en) | 2010-06-21 | 2015-06-23 | Murato Manufacturing Co., Ltd. | Ultraviolet sensor and method for manufacturing the same |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5446587B2 (ja) * | 2008-09-08 | 2014-03-19 | 株式会社村田製作所 | 紫外線センサおよびその製造方法 |
JP5458702B2 (ja) * | 2009-07-02 | 2014-04-02 | 株式会社村田製作所 | 紫外線センサ |
JP2011060953A (ja) * | 2009-09-09 | 2011-03-24 | Murata Mfg Co Ltd | 光センサ |
KR101631652B1 (ko) * | 2009-12-29 | 2016-06-20 | 삼성전자주식회사 | 광민감성 투명 산화물 반도체 재료를 이용한 이미지 센서 |
JPWO2011158827A1 (ja) * | 2010-06-18 | 2013-08-19 | 株式会社村田製作所 | 紫外線センサ、及び紫外線センサの製造方法 |
JP5459566B2 (ja) * | 2010-08-20 | 2014-04-02 | 株式会社村田製作所 | 紫外線センサの製造方法 |
JP5392414B2 (ja) * | 2010-09-13 | 2014-01-22 | 株式会社村田製作所 | フォトダイオード、及び紫外線センサ |
JP5445989B2 (ja) | 2011-03-09 | 2014-03-19 | 株式会社村田製作所 | 紫外線センサ、及び紫外線センサの製造方法 |
JP5920818B2 (ja) * | 2012-02-23 | 2016-05-18 | 国立大学法人島根大学 | 光電変換素子及びその製造方法 |
US9798458B2 (en) | 2013-10-02 | 2017-10-24 | The Joan and Irwin Jacobs Technion-Cornell Innovation Institute | Methods, systems, and apparatuses for accurate measurement and real-time feedback of solar ultraviolet exposure |
US9880052B2 (en) | 2013-10-02 | 2018-01-30 | The Joan and Irwin Jacobs Technion-Cornell Innovation Institute | Methods, systems, and apparatuses for accurate measurement and real-time feedback of solar ultraviolet exposure |
CN105070834B (zh) * | 2015-07-28 | 2016-06-01 | 华中科技大学 | 一种基于掺杂型NiO空穴传输层的钙钛矿太阳能电池及其制备方法 |
WO2017035384A1 (en) | 2015-08-25 | 2017-03-02 | The Joan and Irwin Jacobs Technion-Cornell Innovation Institute | Methods, systems, and apparatuses for accurate measurement and real-time feedback of solar ultraviolet exposure |
EP3358610B1 (en) * | 2015-10-02 | 2021-09-15 | Mitsui Mining and Smelting Co., Ltd. | A bonding junction structure |
US10739253B2 (en) | 2016-06-07 | 2020-08-11 | Youv Labs, Inc. | Methods, systems, and devices for calibrating light sensing devices |
USD829112S1 (en) | 2016-08-25 | 2018-09-25 | The Joan and Irwin Jacobs Technion-Cornell Innovation Institute | Sensing device |
CN108400249B (zh) * | 2018-03-07 | 2020-09-22 | 华中科技大学鄂州工业技术研究院 | 基于镍酸镧空穴传输层的钙钛矿太阳能电池及其制备方法 |
US20200124468A1 (en) | 2018-10-19 | 2020-04-23 | Emmanuel Dumont | Methods, systems, and apparatuses for accurate measurement of health relevant uv exposure from sunlight |
CN109616533B (zh) * | 2018-10-30 | 2020-07-24 | 河北大学 | 一种晶硅异质结太阳电池及其制备方法 |
JP7245418B2 (ja) * | 2019-07-09 | 2023-03-24 | 住友金属鉱山株式会社 | 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、および厚膜抵抗体 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4565731A (en) * | 1978-05-04 | 1986-01-21 | Canon Kabushiki Kaisha | Image-forming member for electrophotography |
US5382487A (en) * | 1979-12-13 | 1995-01-17 | Canon Kabushiki Kaisha | Electrophotographic image forming member |
US4557987A (en) * | 1980-12-23 | 1985-12-10 | Canon Kabushiki Kaisha | Photoconductive member having barrier layer and amorphous silicon charge generation and charge transport layers |
KR100291456B1 (ko) * | 1996-06-19 | 2001-09-07 | 모리시타 요이찌 | 광전자재료및그를이용한장치와,광전자재료의제조방법 |
JP2001237460A (ja) * | 2000-02-23 | 2001-08-31 | Matsushita Electric Ind Co Ltd | 発光素子 |
JP2001307909A (ja) * | 2000-04-25 | 2001-11-02 | Toshiba Corp | 電流−電圧非直線抵抗体 |
JP2003142700A (ja) * | 2001-11-05 | 2003-05-16 | Tdk Corp | 光センサ |
JP4164563B2 (ja) * | 2002-09-24 | 2008-10-15 | 独立行政法人科学技術振興機構 | 酸化物半導体pn接合デバイス及びその製造方法 |
JP2004172166A (ja) | 2002-11-15 | 2004-06-17 | Zenji Hiroi | 光センサー |
US7453065B2 (en) * | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
WO2007060758A1 (ja) * | 2005-11-24 | 2007-05-31 | Murata Manufacturing Co., Ltd. | 紫外線センサ |
-
2006
- 2006-04-25 JP JP2006120208A patent/JP3952076B1/ja not_active Expired - Fee Related
- 2006-09-13 EP EP06810088.2A patent/EP2012368A4/en not_active Withdrawn
- 2006-09-13 WO PCT/JP2006/318131 patent/WO2007122750A1/ja active Application Filing
-
2008
- 2008-10-24 US US12/257,678 patent/US7635906B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009300206A (ja) * | 2008-06-12 | 2009-12-24 | Murata Mfg Co Ltd | 紫外線センサ |
US9064990B2 (en) | 2010-06-21 | 2015-06-23 | Murato Manufacturing Co., Ltd. | Ultraviolet sensor and method for manufacturing the same |
JP2012109486A (ja) * | 2010-11-19 | 2012-06-07 | Murata Mfg Co Ltd | 紫外線センサの製造方法、及び紫外線センサ |
Also Published As
Publication number | Publication date |
---|---|
WO2007122750A1 (ja) | 2007-11-01 |
US7635906B2 (en) | 2009-12-22 |
EP2012368A1 (en) | 2009-01-07 |
US20090057805A1 (en) | 2009-03-05 |
EP2012368A4 (en) | 2013-06-05 |
JP2007294639A (ja) | 2007-11-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3952076B1 (ja) | 紫外線センサ | |
JP5062422B2 (ja) | 紫外線センサ | |
US20130092933A1 (en) | Ultraviolet sensor and method for manufacturing the same | |
US20150145638A1 (en) | ZnO MULTILAYER CHIP VARISTOR WITH BASE METAL INNER ELECTRODES AND PREPARATION METHOD THEREOF | |
JPWO2012035938A1 (ja) | 半導体セラミック素子およびその製造方法 | |
JP5446587B2 (ja) | 紫外線センサおよびその製造方法 | |
US9064987B2 (en) | Photodiode-type ultraviolet sensor having a stacked structure and method for producing the same | |
US20160161443A1 (en) | Gas sensor, method for manufacturing gas sensor, and method for detecting gas concentration | |
JP2012146706A (ja) | 紫外線センサー素子 | |
JP5251282B2 (ja) | 紫外線センサの製造方法 | |
JP5459566B2 (ja) | 紫外線センサの製造方法 | |
US9530909B2 (en) | Photodiode and ultraviolet sensor | |
JPWO2010001822A1 (ja) | 熱電変換モジュールおよび熱電変換モジュールの製造方法 | |
KR20060031629A (ko) | 발광소자 탑재용 기판 및 발광소자 | |
KR102310618B1 (ko) | ZVMNYb계 바리스터 및 그 제조방법 | |
WO2011158827A1 (ja) | 紫外線センサ、及び紫外線センサの製造方法 | |
JP5534564B2 (ja) | 紫外線センサの製造方法 | |
JP2008305815A (ja) | 紫外線センサ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070416 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100511 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110511 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120511 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120511 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130511 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130511 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140511 Year of fee payment: 7 |
|
LAPS | Cancellation because of no payment of annual fees |