JP5062422B2 - 紫外線センサ - Google Patents
紫外線センサ Download PDFInfo
- Publication number
- JP5062422B2 JP5062422B2 JP2007546351A JP2007546351A JP5062422B2 JP 5062422 B2 JP5062422 B2 JP 5062422B2 JP 2007546351 A JP2007546351 A JP 2007546351A JP 2007546351 A JP2007546351 A JP 2007546351A JP 5062422 B2 JP5062422 B2 JP 5062422B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- conductive layer
- ultraviolet sensor
- ultraviolet
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims description 77
- 229910000314 transition metal oxide Inorganic materials 0.000 claims description 16
- 229910052748 manganese Inorganic materials 0.000 claims description 8
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000006104 solid solution Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 19
- 230000035945 sensitivity Effects 0.000 description 18
- 239000002002 slurry Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000002270 dispersing agent Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 238000010298 pulverizing process Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000007606 doctor blade method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910020599 Co 3 O 4 Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000010344 co-firing Methods 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 241000877463 Lanio Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000000825 ultraviolet detection Methods 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/109—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PN heterojunction type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Light Receiving Elements (AREA)
Description
2 導電層
3 半導体層
4 積層構造物
5,6 端子電極
7 紫外線の照射方向を示す矢印
まず、半導体層となるべきグリーンシートを作製するため、ZnO、Al2O3およびCo3O4の各原料無機粉末を、それぞれ、ZnO、AlO3/2およびCoO4/3に換算して、表1の「半導体層」の欄に示すモル%となるように秤量し、これに純水を加え、PSZ(部分安定化ジルコニア)ビーズをメディアとしてボールミルにて混合粉砕処理した。次いで、混合粉砕処理後のスラリーを脱水乾燥し、50μmの程度の粒径となるように造粒した後、1200℃の温度で2時間仮焼した。次に、このようにして得られた仮焼粉末に、再び、純水を加え、PSZビーズをメディアとしてボールミルにて平均粒径0.5μmになるまで混合粉砕処理した。次に、この混合粉砕処理後のスラリーを脱水乾燥した後、有機溶剤および分散剤を加えて混合し、さらにバインダおよび可塑剤を加えて成形用のスラリーとし、このスラリーにドクターブレード法を適用して、半導体層となるべき厚み20μmのグリーンシートを得た。
上記実験例1における試料14と同様の試料を用いて、透光性導電膜の有無について評価した。すなわち、実験例1における試料14と同じものを「透光性導電膜なし」の試料とし、他方、焼結後の積層構造物における半導体層の外表面上に、透光性導電膜として、ZnOにAlをドープして低抵抗化した厚み1μmの薄膜をスパッタリング法によって形成したことを除いて、試料14と同様の試料を作製し、これを「透光性導電膜あり」の試料とした。
Claims (7)
- 導電性を有するセラミック焼結体からなる、導電層と、
前記導電層の一方主面上に設けられ、前記導電層との間でヘテロ接合を形成するものであり、かつ焼結体からなるZnOを含むn型酸化物半導体からなる、半導体層と
を有する、積層構造物を備え、
前記半導体層が、紫外線の受光側に位置されるように用いられる、紫外線センサ。 - 前記導電層となる焼結体と前記半導体層となる焼結体とは、同時焼成により得られたものである、請求項1に記載の紫外線センサ。
- 前記半導体層は、Coを0.1〜3モル%含有する、請求項1に記載の紫外線センサ。
- 前記導電層は、遷移金属酸化物を含む、請求項1に記載の紫外線センサ。
- 前記遷移金属酸化物は、ABO3(Aは、希土類元素、SrおよびBaから選ばれる1種、または希土類元素、SrおよびBaから選ばれる少なくとも1種を含む固溶体であり、Bは、Mn、CoおよびNiから選ばれる1種、またはMn、CoおよびNiから選ばれる少なくとも1種を含む固溶体である。)からなるペロブスカイト型酸化物である、請求項4に記載の紫外線センサ。
- 前記半導体層の、紫外線の受光側の主面上に設けられる、透光性導電膜をさらに備える、請求項1に記載の紫外線センサ。
- 前記積層構造物の一方主面および他方主面上にそれぞれ設けられる、端子電極をさらに備える、請求項1に記載の紫外線センサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007546351A JP5062422B2 (ja) | 2005-11-24 | 2006-05-17 | 紫外線センサ |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005338319 | 2005-11-24 | ||
JP2005338319 | 2005-11-24 | ||
JP2007546351A JP5062422B2 (ja) | 2005-11-24 | 2006-05-17 | 紫外線センサ |
PCT/JP2006/309798 WO2007060758A1 (ja) | 2005-11-24 | 2006-05-17 | 紫外線センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007060758A1 JPWO2007060758A1 (ja) | 2009-05-07 |
JP5062422B2 true JP5062422B2 (ja) | 2012-10-31 |
Family
ID=38066998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007546351A Expired - Fee Related JP5062422B2 (ja) | 2005-11-24 | 2006-05-17 | 紫外線センサ |
Country Status (5)
Country | Link |
---|---|
US (2) | US8344371B2 (ja) |
EP (1) | EP1953833B1 (ja) |
JP (1) | JP5062422B2 (ja) |
DE (1) | DE602006014189D1 (ja) |
WO (1) | WO2007060758A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3952076B1 (ja) * | 2006-04-25 | 2007-08-01 | 株式会社村田製作所 | 紫外線センサ |
US9880052B2 (en) | 2013-10-02 | 2018-01-30 | The Joan and Irwin Jacobs Technion-Cornell Innovation Institute | Methods, systems, and apparatuses for accurate measurement and real-time feedback of solar ultraviolet exposure |
US9798458B2 (en) | 2013-10-02 | 2017-10-24 | The Joan and Irwin Jacobs Technion-Cornell Innovation Institute | Methods, systems, and apparatuses for accurate measurement and real-time feedback of solar ultraviolet exposure |
US10527491B2 (en) | 2015-08-25 | 2020-01-07 | The Joan and Irwin Jacobs Technion-Cornell Innovation Institute | Methods, systems, and apparatuses for accurate measurement and real-time feedback of solar ultraviolet exposure |
US10739253B2 (en) | 2016-06-07 | 2020-08-11 | Youv Labs, Inc. | Methods, systems, and devices for calibrating light sensing devices |
USD829112S1 (en) | 2016-08-25 | 2018-09-25 | The Joan and Irwin Jacobs Technion-Cornell Innovation Institute | Sensing device |
CN108400249B (zh) * | 2018-03-07 | 2020-09-22 | 华中科技大学鄂州工业技术研究院 | 基于镍酸镧空穴传输层的钙钛矿太阳能电池及其制备方法 |
WO2020082084A1 (en) | 2018-10-19 | 2020-04-23 | Youv Labs, Inc. | Methods, systems, and apparatus for accurate measurement of health relevant uv exposure from sunlight |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002001650A1 (en) * | 2000-06-26 | 2002-01-03 | University Of Maryland | Mgzno based uv detectors |
JP2003142700A (ja) * | 2001-11-05 | 2003-05-16 | Tdk Corp | 光センサ |
WO2004047187A1 (ja) * | 2002-11-15 | 2004-06-03 | Zenji Hiroi | 光センサー |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3876869D1 (de) * | 1987-06-22 | 1993-02-04 | Landis & Gyr Betriebs Ag | Photodetektor fuer ultraviolett und verfahren zur herstellung. |
JPH07326783A (ja) * | 1994-05-30 | 1995-12-12 | Canon Inc | 光起電力素子の形成方法及びそれに用いる薄膜製造装置 |
ATE332572T1 (de) * | 1996-06-19 | 2006-07-15 | Matsushita Electric Ind Co Ltd | Photoelektronisches material, dieses verwendende vorrichtungen und herstellungsverfahren |
JPH10190017A (ja) | 1996-12-20 | 1998-07-21 | Nippon Shokubai Co Ltd | 光電変換素子 |
US6495392B2 (en) * | 1999-08-24 | 2002-12-17 | Canon Kabushiki Kaisha | Process for producing a semiconductor device |
JP2001284631A (ja) * | 2000-03-30 | 2001-10-12 | Toshiba Corp | 光検出器及び光検出システム |
JP2001307909A (ja) * | 2000-04-25 | 2001-11-02 | Toshiba Corp | 電流−電圧非直線抵抗体 |
JP3743406B2 (ja) * | 2001-10-05 | 2006-02-08 | 株式会社村田製作所 | 導電性ペースト、積層セラミック電子部品の製造方法および積層セラミック電子部品 |
TW200301841A (en) * | 2001-12-18 | 2003-07-16 | Seiko Epson Corp | Light emission device, method of manufacturing same, electro-optical device and electronic device |
WO2003061020A1 (en) * | 2002-01-04 | 2003-07-24 | Rutgers, The State University Of New Jersey | SCHOTTKY DIODE WITH SILVER LAYER CONTACTING THE ZnO AND MgxZn1-xO FILMS |
JP2004311845A (ja) * | 2003-04-09 | 2004-11-04 | National Institute Of Advanced Industrial & Technology | 発電機能を有する可視光透過構造体 |
US7208768B2 (en) * | 2004-04-30 | 2007-04-24 | Sharp Laboratories Of America, Inc. | Electroluminescent device |
-
2006
- 2006-05-17 JP JP2007546351A patent/JP5062422B2/ja not_active Expired - Fee Related
- 2006-05-17 DE DE602006014189T patent/DE602006014189D1/de active Active
- 2006-05-17 EP EP06746501A patent/EP1953833B1/en not_active Not-in-force
- 2006-05-17 WO PCT/JP2006/309798 patent/WO2007060758A1/ja active Application Filing
-
2008
- 2008-05-20 US US12/123,849 patent/US8344371B2/en not_active Expired - Fee Related
-
2012
- 2012-08-08 US US13/569,422 patent/US8372681B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002001650A1 (en) * | 2000-06-26 | 2002-01-03 | University Of Maryland | Mgzno based uv detectors |
JP2003142700A (ja) * | 2001-11-05 | 2003-05-16 | Tdk Corp | 光センサ |
WO2004047187A1 (ja) * | 2002-11-15 | 2004-06-03 | Zenji Hiroi | 光センサー |
JP2004172166A (ja) * | 2002-11-15 | 2004-06-17 | Zenji Hiroi | 光センサー |
Also Published As
Publication number | Publication date |
---|---|
US8372681B2 (en) | 2013-02-12 |
DE602006014189D1 (de) | 2010-06-17 |
EP1953833A1 (en) | 2008-08-06 |
EP1953833B1 (en) | 2010-05-05 |
EP1953833A4 (en) | 2008-11-05 |
US20080217611A1 (en) | 2008-09-11 |
US8344371B2 (en) | 2013-01-01 |
US20120302001A1 (en) | 2012-11-29 |
WO2007060758A1 (ja) | 2007-05-31 |
JPWO2007060758A1 (ja) | 2009-05-07 |
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