JP3946709B2 - Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条 - Google Patents
Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条 Download PDFInfo
- Publication number
- JP3946709B2 JP3946709B2 JP2004143258A JP2004143258A JP3946709B2 JP 3946709 B2 JP3946709 B2 JP 3946709B2 JP 2004143258 A JP2004143258 A JP 2004143258A JP 2004143258 A JP2004143258 A JP 2004143258A JP 3946709 B2 JP3946709 B2 JP 3946709B2
- Authority
- JP
- Japan
- Prior art keywords
- concentration
- mass
- copper alloy
- stress relaxation
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 42
- 229910017873 Cu—Ni—Si—Mg Inorganic materials 0.000 title claims description 25
- 229910052749 magnesium Inorganic materials 0.000 claims description 31
- 239000010949 copper Substances 0.000 claims description 21
- 229910052717 sulfur Inorganic materials 0.000 claims description 21
- 239000012535 impurity Substances 0.000 claims description 19
- 229910052760 oxygen Inorganic materials 0.000 claims description 18
- 229910052787 antimony Inorganic materials 0.000 claims description 16
- 229910052785 arsenic Inorganic materials 0.000 claims description 16
- 229910052797 bismuth Inorganic materials 0.000 claims description 16
- 229910052711 selenium Inorganic materials 0.000 claims description 16
- 229910052714 tellurium Inorganic materials 0.000 claims description 16
- 229910052698 phosphorus Inorganic materials 0.000 claims description 13
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 230000035882 stress Effects 0.000 description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000000956 alloy Substances 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 229910045601 alloy Inorganic materials 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 10
- 238000005266 casting Methods 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000032683 aging Effects 0.000 description 5
- 238000005097 cold rolling Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005098 hot rolling Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 229910052748 manganese Inorganic materials 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000003610 charcoal Substances 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000006104 solid solution Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 229910017680 MgTe Inorganic materials 0.000 description 3
- 238000003483 aging Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000004993 emission spectroscopy Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910018098 Ni-Si Inorganic materials 0.000 description 1
- 229910018529 Ni—Si Inorganic materials 0.000 description 1
- 206010039509 Scab Diseases 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- -1 that is Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2202/00—Physical properties
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004143258A JP3946709B2 (ja) | 2004-05-13 | 2004-05-13 | Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条 |
| TW094112845A TW200600594A (en) | 2004-05-13 | 2005-04-22 | Cu-Ni-Si-Mg-based copper alloy strip |
| CNB2005100712219A CN100410403C (zh) | 2004-05-13 | 2005-05-13 | Cu-Ni-Si-Mg系铜合金条 |
| KR1020050040233A KR100684095B1 (ko) | 2004-05-13 | 2005-05-13 | Ｃｕ-Ｎｉ-Ｓｉ-Ｍｇ계 구리합금스트립 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004143258A JP3946709B2 (ja) | 2004-05-13 | 2004-05-13 | Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006312908A Division JP4287878B2 (ja) | 2006-11-20 | 2006-11-20 | Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005325390A JP2005325390A (ja) | 2005-11-24 |
| JP3946709B2 true JP3946709B2 (ja) | 2007-07-18 |
Family
ID=35349209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004143258A Expired - Lifetime JP3946709B2 (ja) | 2004-05-13 | 2004-05-13 | Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3946709B2 (ko) |
| KR (1) | KR100684095B1 (ko) |
| CN (1) | CN100410403C (ko) |
| TW (1) | TW200600594A (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5247021B2 (ja) * | 2005-11-28 | 2013-07-24 | Ｊｘ日鉱日石金属株式会社 | 曲げ部のしわを低減させたＣｕ−Ｎｉ−Ｓｉ系合金板・条及びその製造方法 |
| CN102562808B (zh) * | 2011-12-15 | 2015-01-07 | 广州安达精密工业股份有限公司 | 一种轴瓦基底层 |
| JP6039868B2 (ja) * | 2012-12-27 | 2016-12-07 | 株式会社Ｕａｃｊ製箔 | 二次電池用負極集電体の製造方法 |
| JP6266354B2 (ja) * | 2014-01-15 | 2018-01-24 | 株式会社神戸製鋼所 | 電気電子部品用銅合金 |
| CN112725657B (zh) * | 2020-12-24 | 2021-09-17 | 国工恒昌新材料沧州有限公司 | 一种c70350镍硅青铜带材的制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4594221A (en) * | 1985-04-26 | 1986-06-10 | Olin Corporation | Multipurpose copper alloys with moderate conductivity and high strength |
| JPH0830235B2 (ja) * | 1991-04-24 | 1996-03-27 | 日鉱金属株式会社 | 導電性ばね用銅合金 |
| JP2797846B2 (ja) * | 1992-06-11 | 1998-09-17 | 三菱伸銅株式会社 | 樹脂封止型半導体装置のＣｕ合金製リードフレーム材 |
| JP3800269B2 (ja) * | 1997-07-23 | 2006-07-26 | 株式会社神戸製鋼所 | スタンピング加工性及び銀めっき性に優れる高力銅合金 |
| JP4154100B2 (ja) * | 1999-12-17 | 2008-09-24 | 日鉱金属株式会社 | 表面特性の優れた電子材料用銅合金およびその製造方法 |
| JP3520046B2 (ja) * | 2000-12-15 | 2004-04-19 | 古河電気工業株式会社 | 高強度銅合金 |
| US7090732B2 (en) * | 2000-12-15 | 2006-08-15 | The Furukawa Electric, Co., Ltd. | High-mechanical strength copper alloy |
-
2004
- 2004-05-13 JP JP2004143258A patent/JP3946709B2/ja not_active Expired - Lifetime
-
2005
- 2005-04-22 TW TW094112845A patent/TW200600594A/zh unknown
- 2005-05-13 CN CNB2005100712219A patent/CN100410403C/zh active Active
- 2005-05-13 KR KR1020050040233A patent/KR100684095B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060047904A (ko) | 2006-05-18 |
| CN100410403C (zh) | 2008-08-13 |
| JP2005325390A (ja) | 2005-11-24 |
| KR100684095B1 (ko) | 2007-02-20 |
| TWI297734B (ko) | 2008-06-11 |
| TW200600594A (en) | 2006-01-01 |
| CN1696320A (zh) | 2005-11-16 |
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