CN100410403C - Cu-Ni-Si-Mg系铜合金条 - Google Patents
Cu-Ni-Si-Mg系铜合金条 Download PDFInfo
- Publication number
- CN100410403C CN100410403C CNB2005100712219A CN200510071221A CN100410403C CN 100410403 C CN100410403 C CN 100410403C CN B2005100712219 A CNB2005100712219 A CN B2005100712219A CN 200510071221 A CN200510071221 A CN 200510071221A CN 100410403 C CN100410403 C CN 100410403C
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- CN
- China
- Prior art keywords
- concentration
- copper alloy
- quality
- stress relaxation
- alloy strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 42
- 229910017873 Cu—Ni—Si—Mg Inorganic materials 0.000 title claims abstract description 29
- 235000000365 Oenanthe javanica Nutrition 0.000 title 1
- 240000008881 Oenanthe javanica Species 0.000 title 1
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 46
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 24
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 22
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 20
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 20
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 20
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 20
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 19
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 17
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 abstract description 9
- 239000011777 magnesium Substances 0.000 description 90
- 230000035882 stress Effects 0.000 description 28
- 238000005266 casting Methods 0.000 description 19
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 239000012535 impurity Substances 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 13
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 238000005097 cold rolling Methods 0.000 description 6
- 238000000227 grinding Methods 0.000 description 6
- 230000032683 aging Effects 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005098 hot rolling Methods 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000003610 charcoal Substances 0.000 description 4
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910017680 MgTe Inorganic materials 0.000 description 3
- 241000209456 Plumbago Species 0.000 description 3
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 231100000241 scar Toxicity 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000007669 thermal treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910018098 Ni-Si Inorganic materials 0.000 description 1
- 229910018529 Ni—Si Inorganic materials 0.000 description 1
- 206010039509 Scab Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006392 deoxygenation reaction Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2202/00—Physical properties
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004143258A JP3946709B2 (ja) | 2004-05-13 | 2004-05-13 | Cu−Ni−Si−Mg系銅合金条 |
JP143258/04 | 2004-05-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1696320A CN1696320A (zh) | 2005-11-16 |
CN100410403C true CN100410403C (zh) | 2008-08-13 |
Family
ID=35349209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100712219A Active CN100410403C (zh) | 2004-05-13 | 2005-05-13 | Cu-Ni-Si-Mg系铜合金条 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3946709B2 (ko) |
KR (1) | KR100684095B1 (ko) |
CN (1) | CN100410403C (ko) |
TW (1) | TW200600594A (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5247021B2 (ja) * | 2005-11-28 | 2013-07-24 | Jx日鉱日石金属株式会社 | 曲げ部のしわを低減させたCu−Ni−Si系合金板・条及びその製造方法 |
CN102562808B (zh) * | 2011-12-15 | 2015-01-07 | 广州安达精密工业股份有限公司 | 一种轴瓦基底层 |
JP6039868B2 (ja) * | 2012-12-27 | 2016-12-07 | 株式会社Uacj製箔 | 二次電池用負極集電体の製造方法 |
JP6266354B2 (ja) * | 2014-01-15 | 2018-01-24 | 株式会社神戸製鋼所 | 電気電子部品用銅合金 |
CN112725657B (zh) * | 2020-12-24 | 2021-09-17 | 国工恒昌新材料沧州有限公司 | 一种c70350镍硅青铜带材的制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN86102885A (zh) * | 1985-04-26 | 1986-11-19 | 奥林公司 | 具有中等电导率和高强度的多用铜合金及其生产方法 |
JPH0559468A (ja) * | 1991-04-24 | 1993-03-09 | Nikko Kyodo Co Ltd | 導電性ばね用銅合金 |
JPH05345941A (ja) * | 1992-06-11 | 1993-12-27 | Mitsubishi Shindoh Co Ltd | 樹脂封止型半導体装置のCu合金製リードフレーム材 |
JPH1143731A (ja) * | 1997-07-23 | 1999-02-16 | Kobe Steel Ltd | スタンピング加工性及び銀めっき性に優れる高力銅合金 |
CN1301026A (zh) * | 1999-12-17 | 2001-06-27 | 日矿金属株式会社 | 表面特性优良的电子材料用的铜合金及其制法 |
CN1358875A (zh) * | 2000-12-15 | 2002-07-17 | 古河电气工业株式会社 | 高机械强度的铜合金 |
US20040045640A1 (en) * | 2000-12-15 | 2004-03-11 | Takayuki Usami | High-mechanical strength copper alloy |
-
2004
- 2004-05-13 JP JP2004143258A patent/JP3946709B2/ja not_active Expired - Lifetime
-
2005
- 2005-04-22 TW TW094112845A patent/TW200600594A/zh unknown
- 2005-05-13 CN CNB2005100712219A patent/CN100410403C/zh active Active
- 2005-05-13 KR KR1020050040233A patent/KR100684095B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN86102885A (zh) * | 1985-04-26 | 1986-11-19 | 奥林公司 | 具有中等电导率和高强度的多用铜合金及其生产方法 |
JPH0559468A (ja) * | 1991-04-24 | 1993-03-09 | Nikko Kyodo Co Ltd | 導電性ばね用銅合金 |
JPH05345941A (ja) * | 1992-06-11 | 1993-12-27 | Mitsubishi Shindoh Co Ltd | 樹脂封止型半導体装置のCu合金製リードフレーム材 |
JPH1143731A (ja) * | 1997-07-23 | 1999-02-16 | Kobe Steel Ltd | スタンピング加工性及び銀めっき性に優れる高力銅合金 |
CN1301026A (zh) * | 1999-12-17 | 2001-06-27 | 日矿金属株式会社 | 表面特性优良的电子材料用的铜合金及其制法 |
CN1358875A (zh) * | 2000-12-15 | 2002-07-17 | 古河电气工业株式会社 | 高机械强度的铜合金 |
US20040045640A1 (en) * | 2000-12-15 | 2004-03-11 | Takayuki Usami | High-mechanical strength copper alloy |
Also Published As
Publication number | Publication date |
---|---|
KR20060047904A (ko) | 2006-05-18 |
JP3946709B2 (ja) | 2007-07-18 |
JP2005325390A (ja) | 2005-11-24 |
KR100684095B1 (ko) | 2007-02-20 |
TWI297734B (ko) | 2008-06-11 |
TW200600594A (en) | 2006-01-01 |
CN1696320A (zh) | 2005-11-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NIPPON MINING AND METALS CO., LTD. Free format text: FORMER OWNER: NIKKO METAL MFG. CO., LTD. Effective date: 20060707 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20060707 Address after: Tokyo, Japan, Japan Applicant after: Nippon Mining & Metals Co., Ltd. Address before: Kanagawa Applicant before: Nippon Mining Co. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: JX NIPPON MINING + METALS CORPORATION Free format text: FORMER NAME: NIPPON MINING + METALS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX Nippon Mining & Metals Corporation Address before: Tokyo, Japan, Japan Patentee before: Nippon Mining & Metals Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Corporation |
|
CP01 | Change in the name or title of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |
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CP02 | Change in the address of a patent holder |