CN100410403C - Cu-Ni-Si-Mg系铜合金条 - Google Patents

Cu-Ni-Si-Mg系铜合金条 Download PDF

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Publication number
CN100410403C
CN100410403C CNB2005100712219A CN200510071221A CN100410403C CN 100410403 C CN100410403 C CN 100410403C CN B2005100712219 A CNB2005100712219 A CN B2005100712219A CN 200510071221 A CN200510071221 A CN 200510071221A CN 100410403 C CN100410403 C CN 100410403C
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Prior art keywords
concentration
copper alloy
quality
stress relaxation
alloy strip
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CNB2005100712219A
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Chinese (zh)
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CN1696320A (zh
Inventor
波多野隆绍
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Nippon Mining and Metals Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2202/00—Physical properties

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
CNB2005100712219A 2004-05-13 2005-05-13 Cu-Ni-Si-Mg系铜合金条 Active CN100410403C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP143258/04 2004-05-13
JP2004143258A JP3946709B2 (ja) 2004-05-13 2004-05-13 Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条

Publications (2)

Publication Number Publication Date
CN1696320A CN1696320A (zh) 2005-11-16
CN100410403C true CN100410403C (zh) 2008-08-13

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Family Applications (1)

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CNB2005100712219A Active CN100410403C (zh) 2004-05-13 2005-05-13 Cu-Ni-Si-Mg系铜合金条

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JP (1) JP3946709B2 (ko)
KR (1) KR100684095B1 (ko)
CN (1) CN100410403C (ko)
TW (1) TW200600594A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5247021B2 (ja) * 2005-11-28 2013-07-24 Ｊｘ日鉱日石金属株式会社 曲げ部のしわを低減させたＣｕ−Ｎｉ−Ｓｉ系合金板・条及びその製造方法
CN102562808B (zh) * 2011-12-15 2015-01-07 广州安达精密工业股份有限公司 一种轴瓦基底层
JP6039868B2 (ja) * 2012-12-27 2016-12-07 株式会社Ｕａｃｊ製箔 二次電池用負極集電体の製造方法
JP6266354B2 (ja) * 2014-01-15 2018-01-24 株式会社神戸製鋼所 電気電子部品用銅合金
CN112725657B (zh) * 2020-12-24 2021-09-17 国工恒昌新材料沧州有限公司 一种c70350镍硅青铜带材的制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN86102885A (zh) * 1985-04-26 1986-11-19 奥林公司 具有中等电导率和高强度的多用铜合金及其生产方法
JPH0559468A (ja) * 1991-04-24 1993-03-09 Nikko Kyodo Co Ltd 導電性ばね用銅合金
JPH05345941A (ja) * 1992-06-11 1993-12-27 Mitsubishi Shindoh Co Ltd 樹脂封止型半導体装置のＣｕ合金製リードフレーム材
JPH1143731A (ja) * 1997-07-23 1999-02-16 Kobe Steel Ltd スタンピング加工性及び銀めっき性に優れる高力銅合金
CN1301026A (zh) * 1999-12-17 2001-06-27 日矿金属株式会社 表面特性优良的电子材料用的铜合金及其制法
CN1358875A (zh) * 2000-12-15 2002-07-17 古河电气工业株式会社 高机械强度的铜合金
US20040045640A1 (en) * 2000-12-15 2004-03-11 Takayuki Usami High-mechanical strength copper alloy

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN86102885A (zh) * 1985-04-26 1986-11-19 奥林公司 具有中等电导率和高强度的多用铜合金及其生产方法
JPH0559468A (ja) * 1991-04-24 1993-03-09 Nikko Kyodo Co Ltd 導電性ばね用銅合金
JPH05345941A (ja) * 1992-06-11 1993-12-27 Mitsubishi Shindoh Co Ltd 樹脂封止型半導体装置のＣｕ合金製リードフレーム材
JPH1143731A (ja) * 1997-07-23 1999-02-16 Kobe Steel Ltd スタンピング加工性及び銀めっき性に優れる高力銅合金
CN1301026A (zh) * 1999-12-17 2001-06-27 日矿金属株式会社 表面特性优良的电子材料用的铜合金及其制法
CN1358875A (zh) * 2000-12-15 2002-07-17 古河电气工业株式会社 高机械强度的铜合金
US20040045640A1 (en) * 2000-12-15 2004-03-11 Takayuki Usami High-mechanical strength copper alloy

Also Published As

Publication number Publication date
JP2005325390A (ja) 2005-11-24
CN1696320A (zh) 2005-11-16
KR100684095B1 (ko) 2007-02-20
KR20060047904A (ko) 2006-05-18
TW200600594A (en) 2006-01-01
JP3946709B2 (ja) 2007-07-18
TWI297734B (ko) 2008-06-11

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Owner name: NIPPON MINING AND METALS CO., LTD.

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Effective date: 20060707

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Effective date of registration: 20060707

Address after: Tokyo, Japan, Japan

Applicant after: Nippon Mining & Metals Co., Ltd.

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Owner name: JX NIPPON MINING + METALS CORPORATION

Free format text: FORMER NAME: NIPPON MINING + METALS CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan, Japan

Patentee after: JX Nippon Mining & Metals Corporation

Address before: Tokyo, Japan, Japan

Patentee before: Nippon Mining & Metals Co., Ltd.

CP01 Change in the name or title of a patent holder

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Patentee before: JX Nippon Mining & Metals Corporation

CP01 Change in the name or title of a patent holder
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Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan

Patentee after: JKS Metal Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: JKS Metal Co.,Ltd.

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