JP4287878B2 - Cu−Ni−Si−Mg系銅合金条 - Google Patents
Cu−Ni−Si−Mg系銅合金条 Download PDFInfo
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- JP4287878B2 JP4287878B2 JP2006312908A JP2006312908A JP4287878B2 JP 4287878 B2 JP4287878 B2 JP 4287878B2 JP 2006312908 A JP2006312908 A JP 2006312908A JP 2006312908 A JP2006312908 A JP 2006312908A JP 4287878 B2 JP4287878 B2 JP 4287878B2
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- copper alloy
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 42
- 229910017873 Cu—Ni—Si—Mg Inorganic materials 0.000 title claims description 24
- 229910052749 magnesium Inorganic materials 0.000 claims description 30
- 239000010949 copper Substances 0.000 claims description 21
- 229910052717 sulfur Inorganic materials 0.000 claims description 21
- 239000012535 impurity Substances 0.000 claims description 19
- 229910052760 oxygen Inorganic materials 0.000 claims description 18
- 229910052787 antimony Inorganic materials 0.000 claims description 16
- 229910052785 arsenic Inorganic materials 0.000 claims description 16
- 229910052797 bismuth Inorganic materials 0.000 claims description 16
- 229910052711 selenium Inorganic materials 0.000 claims description 16
- 229910052714 tellurium Inorganic materials 0.000 claims description 16
- 229910052698 phosphorus Inorganic materials 0.000 claims description 13
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 230000035882 stress Effects 0.000 description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000000956 alloy Substances 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 229910045601 alloy Inorganic materials 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 10
- 238000005266 casting Methods 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 229910052748 manganese Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052750 molybdenum Inorganic materials 0.000 description 6
- 230000032683 aging Effects 0.000 description 5
- 238000005097 cold rolling Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005098 hot rolling Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000003610 charcoal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000006104 solid solution Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 229910017680 MgTe Inorganic materials 0.000 description 3
- 238000003483 aging Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000004993 emission spectroscopy Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910018098 Ni-Si Inorganic materials 0.000 description 1
- 229910018529 Ni—Si Inorganic materials 0.000 description 1
- 206010039509 Scab Diseases 0.000 description 1
- 229910007981 Si-Mg Inorganic materials 0.000 description 1
- 229910008316 Si—Mg Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- Conductive Materials (AREA)
Description
a)強度および耐応力緩和特性が向上する(特開昭61−250134),
b)熱間加工性が向上する(特開平05−345941),
c)Mgが酸化物となって酸素をトラップすることにより、熱処理の際のSi酸化物の生成又は粗大化を阻止できる(特開平09−209062),
等が報告されている。工業的に生産されている代表的なCu−Ni−Si−Mg系銅合金条はC70250(CDA合金番号)であり,この合金はNiを2.2〜4.2質量%,Siを0.25〜1.2質量%,Mgを0.05〜0.3質量%の範囲で含有する。
なお、「応力緩和率」の語は、本願の明細書0036欄に記載されているように定義されるものであり、この技術的意味に限定されるものである。
Ni及びSiは、時効処理を行うことにより、Ni2Siを主とする金属間化合物の微細な粒子を形成する。その結果、合金の強度が著しく増加し,同時に電気伝導度も上昇する。Siの添加濃度(質量%)は、Niの添加濃度(質量%)の1/6〜1/4の範囲とする。Si添加量がこの範囲から外れると、導電率が低下する。Niは1.0〜4.5質量%の範囲で添加する。Niが1.0を下回ると充分な強度が得られない。Niが4.5質量%を超えると,熱間圧延で割れが発生する。
O,S,Se,Te,P,As,SbおよびBiは,それぞれMgO,MgS,MgSe,MgTe,Mg3P2,Mg3As2,Mg3Sb2およびMg3Bi2を形成することにより,Cu−Ni−Si系銅合金に対するMg添加の効果を減ずる。全てのO,S,Se,Te,P,As,SbおよびBiが,Mgとの間で上記化合物を形成するとき,化合物形成に消費されるMgの濃度は24Tと推算される。Tは不純物の等価濃度を示すパラメ−タであり,次式で与えられる。
Cu−Ni−Si−Mg系銅合金において,Mg濃度と不純物濃度との関係に着目し,特性を改善する技術は過去に報告されてない。
Tおよび[%Mg]が同等であっても,0.0005質量%以上のCを含有すると,強度および応力緩和特性が向上する。しかし,C濃度が0.0015質量%を超えると,インゴットの粒界にCが偏析し,インゴットに粒界割れが発生する。特性改善効果と製造性を両立させるためのC濃度範囲は,0.0005〜0.0015質量%である。
Cu−Ni−Si−Mgの強度を改善するために,Sn,Fe,Co,Mo,Mn,ZnおよびAgのうち一種以上を,添加することができる。
このように作製した試料について,次の試験を行った。
Ni,SiおよびMg濃度をICP−発光分光法で,O濃度を不活性ガス溶融−赤外線吸収法で,S,Se,Te,P,As,SbおよびBi濃度をICP−質量分析法で,C濃度を燃焼−赤外線吸収法でそれぞれ測定した。
引張り方向が圧延方向と平行になる方向に,JIS−Z2201(2003年)に規定された13B号試験片を採取した。この試験片を用いてJIS−Z2241(2003年)に従って引張試験を行い0.2%耐力を求めた。
幅10mm,長さ100mmの短冊形状の試験片を,試験片の長手方向が圧延方向と平行になるように採取した。図1のように,l=50mmの位置を作用点として,試験片にyoのたわみを与え,0.2%耐力の80%に相当する応力(σo)を負荷した。yoは次式により求めた。
yo=(2/3)・l2・σo / (E・T)
ここで,Eはヤング率(131 GPa)であり,Tは試料の厚みである。150℃にて1000時間加熱後に除荷し,図2のように永久変形量(高さ)yを測定し,応力緩和率{[y(mm)/yo(mm)]×100(%)}を算出した。
Claims (1)
- 1.0〜4.5質量%のNiを含有し、Niの質量%濃度に対し1/6〜1/4の濃度のSiを含有し、さらにMgを含有し、Sn,Fe,Co,Mo,Mn,Zn,Agのうち1種類以上を総量で0.01〜2.0質量%を含有し、残部がCuおよび不可避的不純物より構成されるCu合金であって,0.00054〜0.0015質量%のCを有し、Mg濃度ならびに該不可避的不純物中のO,S,Se,Te,P,As,SbおよびBiの等価濃度(T)を次式の範囲に調整してフリーのMg含有量を0.01質量%以上とすることにより、600MPaを超える耐力と15%未満の応力緩和率を備えていることを特徴とする応力緩和特性に優れたCu−Ni−Si−Mg系銅合金条。
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JP2006312908A JP4287878B2 (ja) | 2006-11-20 | 2006-11-20 | Cu−Ni−Si−Mg系銅合金条 |
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JP2006312908A JP4287878B2 (ja) | 2006-11-20 | 2006-11-20 | Cu−Ni−Si−Mg系銅合金条 |
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JP2004143258A Division JP3946709B2 (ja) | 2004-05-13 | 2004-05-13 | Cu−Ni−Si−Mg系銅合金条 |
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JP4287878B2 true JP4287878B2 (ja) | 2009-07-01 |
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Families Citing this family (4)
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JP5773929B2 (ja) | 2012-03-28 | 2015-09-02 | 株式会社神戸製鋼所 | 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板 |
DE102013005158A1 (de) * | 2013-03-26 | 2014-10-02 | Kme Germany Gmbh & Co. Kg | Kupferlegierung |
JP6387755B2 (ja) * | 2014-09-10 | 2018-09-12 | 三菱マテリアル株式会社 | 銅圧延板及び電子・電気機器用部品 |
JP6756348B2 (ja) * | 2018-08-15 | 2020-09-16 | 三菱マテリアル株式会社 | 銅圧延板及び電子・電気機器用部品 |
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