CN1696320A - Cu-Ni-Si-Mg系铜合金条 - Google Patents
Cu-Ni-Si-Mg系铜合金条 Download PDFInfo
- Publication number
- CN1696320A CN1696320A CNA2005100712219A CN200510071221A CN1696320A CN 1696320 A CN1696320 A CN 1696320A CN A2005100712219 A CNA2005100712219 A CN A2005100712219A CN 200510071221 A CN200510071221 A CN 200510071221A CN 1696320 A CN1696320 A CN 1696320A
- Authority
- CN
- China
- Prior art keywords
- concentration
- copper alloy
- quality
- stress relaxation
- alloy strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 43
- 229910017873 Cu—Ni—Si—Mg Inorganic materials 0.000 title claims abstract description 30
- 235000000365 Oenanthe javanica Nutrition 0.000 title 1
- 240000008881 Oenanthe javanica Species 0.000 title 1
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 52
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 26
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 24
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 22
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 22
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 22
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 22
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 22
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 19
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 229910052748 manganese Inorganic materials 0.000 claims description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 abstract description 15
- 239000011777 magnesium Substances 0.000 description 96
- 230000035882 stress Effects 0.000 description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 23
- 238000005266 casting Methods 0.000 description 19
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- 239000012535 impurity Substances 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 10
- 239000010439 graphite Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 229910002804 graphite Inorganic materials 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 6
- 238000005097 cold rolling Methods 0.000 description 6
- 238000000227 grinding Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 230000032683 aging Effects 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005098 hot rolling Methods 0.000 description 5
- 239000003610 charcoal Substances 0.000 description 4
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 4
- 229910017680 MgTe Inorganic materials 0.000 description 3
- 241000209456 Plumbago Species 0.000 description 3
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 231100000241 scar Toxicity 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000007669 thermal treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910018098 Ni-Si Inorganic materials 0.000 description 1
- 229910018529 Ni—Si Inorganic materials 0.000 description 1
- 206010039509 Scab Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006392 deoxygenation reaction Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2202/00—Physical properties
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
Description
No. | [%Ni] | [%Si] | [%Ni]/[%Si] | [%Mg] | [%O] | [%S] | [%Se] | [%Te] | [%P] | [%As] | [%Sb] | [%Bi] | T | [%Mg]-24T | 0.2%耐力(MPa) | 应力松弛率(%) | |
1 | 发明例 | 2.45 | 0.521 | 4.7 | 0.134 | 0.00052 | 0.00092 | 0.00001 | 0.00000 | 0.00002 | 0.00003 | 0.00008 | 0.00001 | 0.00006 | 0.1325 | 688 | 8 |
2 | 发明例 | 2.40 | 0.500 | 4.8 | 0.018 | 0.00064 | 0.00082 | 0.00002 | 0.00001 | 0.00010 | 0.00007 | 0.00010 | 0.00002 | 0.00007 | 0.0162 | 637 | 14 |
3 | 发明例 | 2.50 | 0.481 | 5.2 | 0.064 | 0.00055 | 0.00098 | 0.00001 | 0.00003 | 0.00006 | 0.00005 | 0.00005 | 0.00000 | 0.00007 | 0.0623 | 675 | 12 |
4 | 发明例 | 2.47 | 0.515 | 4.8 | 0.024 | 0.00089 | 0.00083 | 0.00059 | 0.00082 | 0.00234 | 0.00066 | 0.00075 | 0.00006 | 0.00023 | 0.0184 | 642 | 11 |
5 | 发明例 | 2.49 | 0.508 | 4.9 | 0.054 | 0.00093 | 0.00087 | 0.00071 | 0.00094 | 0.00219 | 0.00063 | 0.00087 | 0.00017 | 0.00023 | 0.0484 | 657 | 10 |
6 | 发明例 | 2.48 | 0.551 | 4.5 | 0.124 | 0.00095 | 0.00089 | 0.00065 | 0.00077 | 0.00240 | 0.00067 | 0.00063 | 0.00011 | 0.00024 | 0.1183 | 688 | 9 |
7 | 发明例 | 2.41 | 0.473 | 5.1 | 0.056 | 0.00091 | 0.00254 | 0.00051 | 0.00026 | 0.02540 | 0.00044 | 0.00016 | 0.00012 | 0.00139 | 0.0228 | 631 | 11 |
8 | 发明例 | 2.41 | 0.502 | 4.8 | 0.147 | 0.00102 | 0.00249 | 0.00044 | 0.00033 | 0.02675 | 0.00051 | 0.00020 | 0.00017 | 0.00146 | 0.1120 | 666 | 9 |
9 | 发明例 | 2.45 | 0.471 | 5.2 | 0.070 | 0.00042 | 0.00154 | 0.00014 | 0.00010 | 0.00076 | 0.00024 | 0.00037 | 0.00012 | 0.00012 | 0.0670 | 654 | 10 |
10 | 发明例 | 2.48 | 0.506 | 4.9 | 0.025 | 0.00071 | 0.00126 | 0.00121 | 0.00101 | 0.00853 | 0.00076 | 0.00087 | 0.00047 | 0.00055 | 0.0118 | 625 | 13 |
11 | 发明例 | 2.46 | 0.473 | 5.2 | 0.114 | 0.00145 | 0.00177 | 0.00099 | 0.00114 | 0.01653 | 0.00103 | 0.00053 | 0.00002 | 0.00099 | 0.0901 | 679 | 11 |
12 | 发明例 | 2.42 | 0.515 | 4.7 | 0.128 | 0.00042 | 0.00049 | 0.00006 | 0.00011 | 0.08747 | 0.00002 | 0.00006 | 0.00001 | 0.00428 | 0.0254 | 647 | 12 |
13 | 发明例 | 2.44 | 0.530 | 4.6 | 0.142 | 0.00036 | 0.00055 | 0.00003 | 0.00007 | 0.08093 | 0.00003 | 0.00007 | 0.00002 | 0.00396 | 0.0470 | 672 | 11 |
14 | 发明例 | 2.46 | 0.503 | 4.9 | 0.164 | 0.00085 | 0.00081 | 0.00074 | 0.00091 | 0.00222 | 0.00062 | 0.00084 | 0.00014 | 0.00023 | 0.1586 | 679 | 9 |
15 | 比较例 | 2.42 | 0.484 | 5.0 | 0.011 | 0.00076 | 0.00123 | 0.00003 | 0.00002 | 0.00003 | 0.00006 | 0.00005 | 0.00001 | 0.00009 | 0.0088 | 558 | 24 |
16 | 比较例 | 2.46 | 0.482 | 5.1 | 0.013 | 0.00095 | 0.00089 | 0.00065 | 0.00077 | 0.00240 | 0.00067 | 0.00063 | 0.00011 | 0.00024 | 0.0073 | 544 | 25 |
17 | 比较例 | 2.47 | 0.526 | 4.7 | 0.045 | 0.00120 | 0.00220 | 0.00030 | 0.00029 | 0.02807 | 0.00031 | 0.00013 | 0.00014 | 0.00152 | 0.0086 | 576 | 26 |
18 | 比较例 | 2.45 | 0.480 | 5.1 | 0.082 | 0.00045 | 0.00057 | 0.00006 | 0.00009 | 0.07707 | 0.00002 | 0.00005 | 0.00001 | 0.00378 | -0.0087 | 526 | 28 |
19 | 比较例 | 2.46 | 0.492 | 5.0 | 0.208 | 0.00095 | 0.00231 | 0.00047 | 0.00029 | 0.02663 | 0.00047 | 0.00021 | 0.00013 | 0.00144 | 0.1734 | 687 | 8 |
20 | 比较例 | 2.43 | 0.506 | 4.8 | 0.149 | 0.00119 | 0.00184 | 0.00157 | 0.00168 | 0.10653 | 0.00077 | 0.00096 | 0.00021 | 0.00535 | 0.0206 | 653 | 12 |
No. | 坩埚 | 溶解温度(℃) | [%Ni] | [%Si] | [%Ni]/[%Si] | [%Mg] | [%C] | [%O] | [%S] | [%Se] | [%Te] | [%P] | [%As] | [%Sb] | [%Bi] | T | [%Mg]-24T | 0.2%耐力(MPa) | 应力松弛率(%) |
21 | 氧化铝 | 1150 | 2.75 | 0.598 | 4.6 | 0.065 | 0.00013 | 0.00070 | 0.00092 | 0.00019 | 0.00007 | 0.00820 | 0.00014 | 0.00016 | 0.00007 | 0.00048 | 0.0535 | 748 | 18 |
22 | 石墨 | 1150 | 2.79 | 0.594 | 4.7 | 0.068 | 0.00042 | 0.00074 | 0.00085 | 0.00020 | 0.00008 | 0.00843 | 0.00012 | 0.00013 | 0.00008 | 0.00049 | 0.0563 | 776 | 14 |
23 | 石墨 | 1200 | 2.80 | 0.560 | 5.0 | 0.064 | 0.00054 | 0.00081 | 0.00094 | 0.00024 | 0.00010 | 0.00831 | 0.00016 | 0.00018 | 0.00011 | 0.00049 | 0.0522 | 794 | 11 |
24 | 石墨 | 1250 | 2.75 | 0.598 | 4.6 | 0.060 | 0.00086 | 0.00077 | 0.00090 | 0.00023 | 0.00012 | 0.00859 | 0.00011 | 0.00013 | 0.00013 | 0.00050 | 0.0480 | 803 | 11 |
25 | 石墨 | 1300 | 2.76 | 0.575 | 4.8 | 0.065 | 0.00121 | 0.00070 | 0.00097 | 0.00017 | 0.00011 | 0.00869 | 0.00015 | 0.00017 | 0.00012 | 0.00050 | 0.0529 | 809 | 10 |
26 | 石墨 | 1350 | 2.73 | 0.593 | 4.6 | 0.062 | 0.00145 | 0.00075 | 0.00106 | 0.00020 | 0.00006 | 0.00829 | 0.00017 | 0.00014 | 0.00009 | 0.00049 | 0.0502 | 807 | 9 |
27 | 石墨 | 1400 | 2.78 | 0.591 | 4.7 | 0.063 | 0.00164 | 0.00073 | 0.00082 | 0.00022 | 0.00010 | 0.00849 | 0.00014 | 0.00013 | 0.00015 | 0.00049 | 0.0512 | 803 | 11 |
28 | 石墨 | 1450 | 2.79 | 0.581 | 4.8 | 0.067 | 0.00189 | 0.00072 | 0.00096 | 0.00025 | 0.00012 | 0.00822 | 0.00017 | 0.00015 | 0.00060 | 0.00049 | 0.0553 | 809 | 10 |
No. | [%Ni] | [%Si] | [%Ni]/[%Si] | [%Mg] | [%C] | 添加元素(质量%) | T | [%Mg]-24T | 0.2%耐力(MPa) | 应力松弛率(%) | |
29 | 发明例 | 1.68 | 0.357 | 4.7 | 0.012 | 0.00084 | 0.51%Sn,0.39%Zn | 0.00006 | 0.0106 | 618 | 11 |
30 | 比较例 | 1.64 | 0.349 | 4.7 | 0.013 | 0.00080 | 0.52%Sn,0.41%Zn | 0.00022 | 0.0077 | 508 | 26 |
31 | 发明例 | 3.55 | 0.670 | 5.3 | 0.145 | 0.00124 | 0.11%Mn | 0.00079 | 0.1260 | 714 | 8 |
32 | 比较例 | 3.50 | 0.648 | 5.4 | 0.026 | 0.00118 | 0.10%Mn | 0.00084 | 0.0058 | 617 | 19 |
33 | 发明例 | 2.17 | 0.529 | 4.1 | 0.045 | 0.00058 | 0.15%Co,0.05%Fe | 0.00055 | 0.0318 | 685 | 10 |
34 | 比较例 | 2.15 | 0.538 | 4.0 | 0.042 | 0.00054 | 0.14%Co,0.05%Fe | 0.00142 | 0.0079 | 591 | 22 |
35 | 发明例 | 1.98 | 0.404 | 4.9 | 0.139 | 0.00079 | 0.033%Ag | 0.00098 | 0.1155 | 624 | 9 |
36 | 比较例 | 2.02 | 0.396 | 5.1 | 0.025 | 0.00086 | 0.035%Ag | 0.00106 | -0.0004 | 531 | 23 |
37 | 发明例 | 2.43 | 0.506 | 4.8 | 0.033 | 0.00042 | 0.012%Mo | 0.00036 | 0.0244 | 692 | 11 |
38 | 比较例 | 2.45 | 0.490 | 5.0 | 0.033 | 0.00038 | 0.011%Mo | 0.00125 | 0.0030 | 584 | 27 |
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP143258/04 | 2004-05-13 | ||
JP2004143258A JP3946709B2 (ja) | 2004-05-13 | 2004-05-13 | Cu−Ni−Si−Mg系銅合金条 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1696320A true CN1696320A (zh) | 2005-11-16 |
CN100410403C CN100410403C (zh) | 2008-08-13 |
Family
ID=35349209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100712219A Active CN100410403C (zh) | 2004-05-13 | 2005-05-13 | Cu-Ni-Si-Mg系铜合金条 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3946709B2 (zh) |
KR (1) | KR100684095B1 (zh) |
CN (1) | CN100410403C (zh) |
TW (1) | TW200600594A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102562808A (zh) * | 2011-12-15 | 2012-07-11 | 广州安达汽车零部件股份有限公司 | 一种轴瓦基底层 |
CN104775048A (zh) * | 2014-01-15 | 2015-07-15 | 株式会社神户制钢所 | 电气电子部件用铜合金 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5247021B2 (ja) * | 2005-11-28 | 2013-07-24 | Jx日鉱日石金属株式会社 | 曲げ部のしわを低減させたCu−Ni−Si系合金板・条及びその製造方法 |
JP6039868B2 (ja) * | 2012-12-27 | 2016-12-07 | 株式会社Uacj製箔 | 二次電池用負極集電体の製造方法 |
CN112725657B (zh) * | 2020-12-24 | 2021-09-17 | 国工恒昌新材料沧州有限公司 | 一种c70350镍硅青铜带材的制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4594221A (en) * | 1985-04-26 | 1986-06-10 | Olin Corporation | Multipurpose copper alloys with moderate conductivity and high strength |
JPH0830235B2 (ja) * | 1991-04-24 | 1996-03-27 | 日鉱金属株式会社 | 導電性ばね用銅合金 |
JP2797846B2 (ja) * | 1992-06-11 | 1998-09-17 | 三菱伸銅株式会社 | 樹脂封止型半導体装置のCu合金製リードフレーム材 |
JP3800269B2 (ja) * | 1997-07-23 | 2006-07-26 | 株式会社神戸製鋼所 | スタンピング加工性及び銀めっき性に優れる高力銅合金 |
JP4154100B2 (ja) * | 1999-12-17 | 2008-09-24 | 日鉱金属株式会社 | 表面特性の優れた電子材料用銅合金およびその製造方法 |
JP3520046B2 (ja) * | 2000-12-15 | 2004-04-19 | 古河電気工業株式会社 | 高強度銅合金 |
US7090732B2 (en) * | 2000-12-15 | 2006-08-15 | The Furukawa Electric, Co., Ltd. | High-mechanical strength copper alloy |
-
2004
- 2004-05-13 JP JP2004143258A patent/JP3946709B2/ja not_active Expired - Lifetime
-
2005
- 2005-04-22 TW TW094112845A patent/TW200600594A/zh unknown
- 2005-05-13 KR KR1020050040233A patent/KR100684095B1/ko active IP Right Grant
- 2005-05-13 CN CNB2005100712219A patent/CN100410403C/zh active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102562808A (zh) * | 2011-12-15 | 2012-07-11 | 广州安达汽车零部件股份有限公司 | 一种轴瓦基底层 |
CN102562808B (zh) * | 2011-12-15 | 2015-01-07 | 广州安达精密工业股份有限公司 | 一种轴瓦基底层 |
CN104775048A (zh) * | 2014-01-15 | 2015-07-15 | 株式会社神户制钢所 | 电气电子部件用铜合金 |
CN104775048B (zh) * | 2014-01-15 | 2017-06-16 | 株式会社神户制钢所 | 电气电子部件用铜合金 |
Also Published As
Publication number | Publication date |
---|---|
KR100684095B1 (ko) | 2007-02-20 |
CN100410403C (zh) | 2008-08-13 |
JP3946709B2 (ja) | 2007-07-18 |
TWI297734B (zh) | 2008-06-11 |
JP2005325390A (ja) | 2005-11-24 |
TW200600594A (en) | 2006-01-01 |
KR20060047904A (ko) | 2006-05-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4655834B2 (ja) | 電気部品用銅合金材とその製造方法 | |
JP5962707B2 (ja) | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子 | |
TWI382097B (zh) | Cu-Ni-Si-Co-Cr alloy for electronic materials | |
JP4937815B2 (ja) | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 | |
JP4596493B2 (ja) | 導電性ばね材に用いられるCu−Ni−Si系合金 | |
KR101211984B1 (ko) | 전자 재료용 Cu-Ni-Si 계 합금 | |
CN1517446A (zh) | 铜基合金及其制造方法 | |
WO2011104982A1 (ja) | Cu-Mg-P系銅合金条材及びその製造方法 | |
CN100350064C (zh) | Cu-Ni-Si-Mg系铜合金条 | |
CN1793394A (zh) | 具有弯曲性和应力弛豫性能的铜合金 | |
JP5619389B2 (ja) | 銅合金材料 | |
CN1932056A (zh) | 耐高温软化引线框架用铜合金及其制造方法 | |
KR20100132044A (ko) | 전기전자기기용 동합금 재료 및 전기전자부품 | |
CN1458292A (zh) | 具有改善的冲压冲制性能的铜基合金及其制备方法 | |
CN1841570A (zh) | 镀锡的耐热剥离性优良的Cu-Ni-Si-Zn-Sn系合金条及其镀锡条 | |
CN1696320A (zh) | Cu-Ni-Si-Mg系铜合金条 | |
JP2017179502A (ja) | 強度及び導電性に優れる銅合金板 | |
JP4100629B2 (ja) | 高強度高導電性銅合金 | |
JP4459067B2 (ja) | 高強度高導電性銅合金 | |
JP4287878B2 (ja) | Cu−Ni−Si−Mg系銅合金条 | |
JP5150908B2 (ja) | コネクタ用銅合金とその製造法 | |
CN100338691C (zh) | Cu-Ni-Si-Mg系铜合金条 | |
JP6207539B2 (ja) | 銅合金条およびそれを備える大電流用電子部品及び放熱用電子部品 | |
JP2017179503A (ja) | 強度及び導電性に優れる銅合金板 | |
JPH0978162A (ja) | 電子機器用銅合金およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NIPPON MINING AND METALS CO., LTD. Free format text: FORMER OWNER: NIKKO METAL MFG. CO., LTD. Effective date: 20060707 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20060707 Address after: Tokyo, Japan, Japan Applicant after: Nippon Mining & Metals Co., Ltd. Address before: Kanagawa Applicant before: Nippon Mining Co. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: JX NIPPON MINING + METALS CORPORATION Free format text: FORMER NAME: NIPPON MINING + METALS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX Nippon Mining & Metals Corporation Address before: Tokyo, Japan, Japan Patentee before: Nippon Mining & Metals Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Corporation |
|
CP01 | Change in the name or title of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |
|
CP02 | Change in the address of a patent holder |