JP3931976B2 - アクチュエータ装置及びインクジェット式記録ヘッド並びにインクジェット式記録装置 - Google Patents
アクチュエータ装置及びインクジェット式記録ヘッド並びにインクジェット式記録装置 Download PDFInfo
- Publication number
- JP3931976B2 JP3931976B2 JP2002306147A JP2002306147A JP3931976B2 JP 3931976 B2 JP3931976 B2 JP 3931976B2 JP 2002306147 A JP2002306147 A JP 2002306147A JP 2002306147 A JP2002306147 A JP 2002306147A JP 3931976 B2 JP3931976 B2 JP 3931976B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- flow path
- forming substrate
- wiring
- ink jet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 80
- 238000005304 joining Methods 0.000 claims description 18
- 238000004891 communication Methods 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 76
- 238000005530 etching Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 239000013078 crystal Substances 0.000 description 11
- 238000007789 sealing Methods 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002306147A JP3931976B2 (ja) | 1998-08-26 | 2002-10-21 | アクチュエータ装置及びインクジェット式記録ヘッド並びにインクジェット式記録装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23982598 | 1998-08-26 | ||
| JP10-239825 | 1998-08-26 | ||
| JP2002306147A JP3931976B2 (ja) | 1998-08-26 | 2002-10-21 | アクチュエータ装置及びインクジェット式記録ヘッド並びにインクジェット式記録装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23456999A Division JP3522163B2 (ja) | 1998-08-26 | 1999-08-20 | インクジェット式記録ヘッド及びインクジェット式記録装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003136721A JP2003136721A (ja) | 2003-05-14 |
| JP2003136721A5 JP2003136721A5 (enExample) | 2006-10-05 |
| JP3931976B2 true JP3931976B2 (ja) | 2007-06-20 |
Family
ID=26534441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002306147A Expired - Fee Related JP3931976B2 (ja) | 1998-08-26 | 2002-10-21 | アクチュエータ装置及びインクジェット式記録ヘッド並びにインクジェット式記録装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3931976B2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7448732B2 (en) | 2004-09-30 | 2008-11-11 | Fujifilm Corporation | Liquid ejection head and manufacturing method thereof |
| US7614727B2 (en) | 2004-09-30 | 2009-11-10 | Fujifilm Corporation | Liquid ejection head, manufacturing method thereof, and image forming apparatus |
| JP4616609B2 (ja) * | 2004-10-05 | 2011-01-19 | ブラザー工業株式会社 | インクジェットヘッド |
| US7621622B2 (en) | 2005-03-18 | 2009-11-24 | Fujifilm Corporation | Liquid ejection head |
| JP4800666B2 (ja) * | 2005-05-27 | 2011-10-26 | 富士フイルム株式会社 | 液体吐出ヘッド及びその製造方法 |
| JP2007030465A (ja) | 2005-07-29 | 2007-02-08 | Fujifilm Holdings Corp | 基板の製造方法、液体吐出ヘッドの製造方法、液体吐出ヘッド及び画像形成装置 |
| JP5082285B2 (ja) * | 2006-04-25 | 2012-11-28 | セイコーエプソン株式会社 | 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置 |
| JP2008290291A (ja) * | 2007-05-23 | 2008-12-04 | Fuji Xerox Co Ltd | 液滴吐出ヘッド及び画像形成装置 |
| JP2009190398A (ja) * | 2008-01-17 | 2009-08-27 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
| JP5673023B2 (ja) * | 2010-11-26 | 2015-02-18 | コニカミノルタ株式会社 | 圧電モジュール、圧電デバイスおよびその製造方法 |
| JP6589301B2 (ja) * | 2015-03-10 | 2019-10-16 | セイコーエプソン株式会社 | 液体噴射ヘッド、及び液体噴射ヘッドの製造方法 |
| JP7224782B2 (ja) | 2018-05-30 | 2023-02-20 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
| JP7229700B2 (ja) * | 2018-08-24 | 2023-02-28 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
-
2002
- 2002-10-21 JP JP2002306147A patent/JP3931976B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003136721A (ja) | 2003-05-14 |
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